SCHEMBL573469

SCHEMBL573469

C=CCOCC1CCC2OC2C1

nearest known ligand 0.44

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15893004 0.84 ALDH1A1 (0.32) ALDH1A1
SCHEMBL216588 0.82
SCHEMBL272901 0.79
SCHEMBL17281230 0.79
SCHEMBL18602784 0.79 ALDH1A1 (0.42) ALDH1A1
SCHEMBL6885906 0.79
SCHEMBL291993 0.79 TSHR (0.32)
SCHEMBL17281234 0.78
SCHEMBL2232344 0.78 ALDH1A1 (0.54) ALDH1A1
SCHEMBL2734448 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103052664-B Polyfarnesene graft copolymers with polycondensates Amyris, Inc. (US) 2015-08-12 CN claimed
US-9040630-B2 Graft copolymers of polyfarnesenes with condensation polymers Amyris, Inc. (US) 2015-05-26 US claimed
EP-2601229-B1 GRAFT COPOLYMERS OF POLYFARNESENES WITH CONDENSATION POLYMERS AMYRIS INC (US) 2013-10-16 EP claimed
EP-2601229-A1 GRAFT COPOLYMERS OF POLYFARNESENES WITH CONDENSATION POLYMERS Amyris, Inc. (US) 2013-06-12 EP claimed
US-20130123379-A1 GRAFT COPOLYMERS OF POLYFARNESENES WITH CONDENSATION POLYMERS Amyris, Inc. (US) 2013-05-16 US claimed
WO-2012018682-A1 GRAFT COPOLYMERS OF POLYFARNESENES WITH CONDENSATION POLYMERS Amyris, Inc. (US) 2012-02-09 WO claimed
EP-2772505-B1 PHOTOCURABLE RESIN COMPOSITION AND NOVEL SILOXANE COMPOUND ADEKA CORP (JP) 2017-11-15 EP disclosed
CN-104203989-B Polymerization comprises the compositions of farnesene 阿迈瑞斯公司 2016-10-12 CN disclosed
EP-2817342-B1 POLYMERIZATION OF COMPOSITIONS COMPRISING A FARNESENE AMYRIS INC (US) 2016-05-25 EP disclosed
CN-103025837-B Adhesive composition NIPPON CARBIDE INDUSTRIES CO.,INC. (JP) 2016-05-04 CN disclosed
CN-103052664-B Polyfarnesene graft copolymers with polycondensates Amyris, Inc. (US) 2015-08-12 CN disclosed
US-9063415-B2 Photocurable resin composition and novel siloxane compound ADEKA CORPORATION (JP) 2015-06-23 US disclosed
US-9063415-B2 Photocurable resin composition and novel siloxane compound ADEKA CORPORATION (JP) 2015-06-23 US disclosed
US-20030120008-A1 Fluorine-containing copolymer, composition for forming a film, anti-reflection film, and image display device FUJIFILM CORPORATION (JP) 2003-06-26 US disclosed
EP-0805186-B1 THERMOSETTING COMPOSITION, METHOD OF FINISH COATING, AND COATED ARTICLES NOF CORP (JP) 2002-05-29 EP disclosed
US-6242046-B1 BLEND OF POLYMER, METAL OXIDE, SOLVENT AND WATER BASF NOF COATINGS COMPANY, LIMITED (JP) 2001-06-05 US disclosed
US-6235808-B1 Radiation-curable cycloaliphatic epoxy compounds, uses thereof, and compositions containing them RENSSELAER POLYTECHNIC INSTITUTE 2001-05-22 US disclosed
US-6103387-A THERMOSETTING RESIN COMPRISING A CERAMIC, WHICH GIVES A CURED PRODUCT HAVING EXCELLENT STAIN RESISTANCE, STAIN-REMOVING PROPERTY, WEATHERING RESISTANCE, LIGHT RESISTANCE, CHEMICAL RESISTANCE, MOISTURE RESISTANCE AND APPEARANCE NOF CORPORATION (JP) 2000-08-15 US disclosed
US-6075155-A PHOTOPOLYMERIZABLE MONOMERS; SOLVENT-FREE RENSSELAER POLYTECHNIC INSTITUTE (US) 2000-06-13 US disclosed
EP-0805186-A1 THERMOSETTING COMPOSITION, METHOD OF FINISH COATING, AND COATED ARTICLES NOF CORPORATION (JP) 1997-11-05 EP disclosed