⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7563948 | 0.78 | — | — | |
| SCHEMBL28835012 | 0.76 | SHBG (0.31) | — | |
| SCHEMBL21197611 | 0.75 | — | — | |
| SCHEMBL10537585 | 0.73 | SHBG (0.32) | — | |
| SCHEMBL29077030 | 0.72 | — | — | |
| SCHEMBL473092 | 0.65 | — | — | |
| SCHEMBL22169227 | 0.65 | — | — | |
| SCHEMBL11453062 | 0.64 | — | — | |
| SCHEMBL23358875 | 0.63 | THRB (0.33) | — | |
| SCHEMBL23358846 | 0.63 | THRB (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111825947-B | Resin composition for metal substrate, resin glue solution containing resin composition and metal-based copper-clad laminate | 广东生益科技股份有限公司 | 2021-08-27 | — | — | CN | claimed |
| WO-2020215399-A1 | RESIN COMPOSITION FOR METAL SUBSTRATE, RESIN GLUE SOLUTION COMPRISING SAME, AND METAL-BASED COPPER FOIL-CLAD LAMINATE | 广东生益科技股份有限公司 | 2020-10-29 | — | — | WO | claimed |
| CN-115011225-B | Bionic frost-preventing and removing material and preparation method and application thereof | 中国科学院理化技术研究所 | 2023-04-07 | — | — | CN | disclosed |
| CN-115011225-A | Bionic frost-preventing and removing material and preparation method and application thereof | 中国科学院理化技术研究所 | 2022-09-06 | — | — | CN | disclosed |
| CN-111331762-B | Preparation process of epoxy resin daub mould | 沈阳中航迈瑞特工业有限公司 | 2021-12-28 | — | — | CN | disclosed |
| CN-111825947-B | Resin composition for metal substrate, resin glue solution containing resin composition and metal-based copper-clad laminate | 广东生益科技股份有限公司 | 2021-08-27 | — | — | CN | disclosed |
| WO-2020215399-A1 | RESIN COMPOSITION FOR METAL SUBSTRATE, RESIN GLUE SOLUTION COMPRISING SAME, AND METAL-BASED COPPER FOIL-CLAD LAMINATE | 广东生益科技股份有限公司 | 2020-10-29 | — | — | WO | disclosed |
| CN-111825947-A | Resin composition for metal substrate, resin glue solution containing resin composition and metal-based copper-clad laminate | 广东生益科技股份有限公司 | 2020-10-27 | — | — | CN | disclosed |
| CN-111331762-A | Preparation process of epoxy resin daub mould | 沈阳中航迈瑞特工业有限公司 | 2020-06-26 | — | — | CN | disclosed |
| WO-2006004572-A2 | DISHWASHING WIPE | THE PROCTER & GAMBLE COMPANY (US) | 2006-01-12 | — | — | WO | disclosed |
| US-20050164901-A1 | Dishwashing wipe | THE PROCTER & GAMBLE COMPANY | 2005-07-28 | — | — | US | disclosed |