Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CRBN | Q96SW2 | 4/20 | 0.50 |
| ▸ | FKBP5 | Q13451 | 1/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.47 |
| ▸ | TRIM24 | O15164 | 2/20 | 0.47 |
| ▸ | TRIM33 | Q9UPN9 | 2/20 | 0.47 |
| ▸ | OR51E2 | Q9H255 | 1/20 | 0.45 |
| ▸ | HPGD | P15428 | 2/20 | 0.32 |
| ▸ | HTT | P42858 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.32 |
| ▸ | RAB9A | P51151 | 2/20 | 0.31 |
| ▸ | MEN1 | O00255 | 2/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 3/20 | 0.31 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.31 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.31 |
| ▸ | CA1 | P00915 | 1/20 | 0.30 |
| ▸ | CA9 | Q16790 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1395582 | 1.00 | CRBN (0.50) | CRBNFKBP5ALDH1A1TRIM24TRIM33 | |
| SCHEMBL141622 | 0.96 | CRBN (0.53) | CRBNFKBP5ALDH1A1TRIM24TRIM33 | |
| SCHEMBL5507318 | 0.89 | — | — | |
| SCHEMBL906641 | 0.81 | — | — | |
| SCHEMBL540663 | 0.80 | — | — | |
| SCHEMBL23028960 | 0.79 | CRBN (0.80) | CRBNFKBP5ALDH1A1TRIM24TRIM33 | |
| SCHEMBL5909153 | 0.79 | CRBN (0.80) | CRBNFKBP5ALDH1A1TRIM24TRIM33 | |
| SCHEMBL6049487 | 0.79 | CRBN (0.80) | CRBNFKBP5ALDH1A1TRIM24TRIM33 | |
| SCHEMBL8801853 | 0.79 | CRBN (0.80) | CRBNFKBP5ALDH1A1TRIM24TRIM33 | |
| SCHEMBL9716416 | 0.79 | CRBN (0.80) | CRBNFKBP5ALDH1A1TRIM24TRIM33 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 207 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120118278-A | Bio-based polyurethane-polylactic acid composite fiber and preparation method thereof | 河北邦泰氨纶科技有限公司 | 2025-06-10 | — | — | CN | claimed |
| CN-117659811-B | Fireproof insulating powder coating and preparation method and application thereof | 擎天材料科技有限公司 | 2025-04-29 | — | — | CN | claimed |
| CN-119798601-A | Tea polyphenol palmitate modified aqueous polyurethane dispersion, preparation method and application | 万华化学集团股份有限公司 | 2025-04-11 | — | — | CN | claimed |
| CN-118994618-A | Hyperbranched photosensitive resin with photoinitiation groups and LDI solder resist ink thereof | 深圳市百利合新材料发展有限公司 | 2024-11-22 | — | — | CN | claimed |
| CN-117757398-A | Joint filling silver adhesive and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2024-03-26 | — | — | CN | claimed |
| CN-117659811-A | Fireproof insulating powder coating and preparation method and application thereof | 擎天材料科技有限公司 | 2024-03-08 | — | — | CN | claimed |
| CN-117659824-A | Anticorrosive weather-resistant powder coating and preparation method and application thereof | 擎天材料科技有限公司 | 2024-03-08 | — | — | CN | claimed |
| CN-116514494-B | Permeable concrete and landscape pavement construction method | 北京中景橙石科技股份有限公司 | 2023-09-15 | — | — | CN | claimed |
| CN-116514494-A | Permeable concrete and landscape pavement construction method | 北京中景橙石科技股份有限公司 | 2023-08-01 | — | — | CN | claimed |
| US-9090770-B2 | Polyacetal resin composition, method for producing the same, and molded article | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2015-07-28 | — | — | US | claimed |
| EP-2559731-A1 | POLYACETAL RESIN COMPOSITION, PROCESS FOR PRODUCTION OF THE COMPOSITION, AND MOLDED ARTICLE | Asahi Kasei Chemicals Corporation (JP) | 2013-02-20 | — | — | EP | claimed |
| US-20130035416-A1 | POLYACETAL RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND MOLDED ARTICLE | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2013-02-07 | — | — | US | claimed |
| US-8278820-B2 | Active matrix organic electroluminescent device and method of manufacture thereof | University of Electric Sience and Technology of China (CN) | 2012-10-02 | — | — | US | claimed |
| US-20110221331-A1 | Active matrix organic electroluminescent device and method of manufacture thereof | UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA | 2011-09-15 | — | — | US | claimed |
| US-6403713-B2 | CROSSLINKING WITH PHENOL-FORMALDEHYDE RESIN, 3-(N-SALICYLOYL) AMINO-1,2,4-TRIAZOLE, AND HYDRAZIDE FORMING BUTYL RUBBER; RESILIENT AND LOW CORROSIVITY; HALOGEN-FREE | ONIZAWA MASAO (JP) | 2002-06-11 | — | — | US | claimed |
| US-6388008-B2 | DIELECTRIC, CORROSION RESISTANCE | ONIZAWA MASAO (JP) | 2002-05-14 | — | — | US | claimed |
| US-20010031832-A1 | Method for crosslinking of isoprene-isobutylene rubber and crosslinked rubber product obtained by said method | ONIZAWA MASAO (JP) | 2001-10-18 | — | — | US | claimed |
| US-20010027235-A1 | Method for crosslinking of isoprene-isobutylene rubber, ethylene-propylene-diene rubber containing ethylidenenorbornene as unsaturated component, or mixture thereof; and crosslinked rubber product obtained by said method | ONIZAWA MASAO (JP) | 2001-10-04 | — | — | US | claimed |
| US-6255394-B1 | INCREASING HARDNESS WITHOUT USING A HALOGEN COMPOUND OR EXCESS CARBON BLACK | ONIZAWA MASAO (JP) | 2001-07-03 | — | — | US | claimed |
| CN-120118278-A | Bio-based polyurethane-polylactic acid composite fiber and preparation method thereof | 河北邦泰氨纶科技有限公司 | 2025-06-10 | — | — | CN | disclosed |
| CN-120010185-A | Low-temperature-curable photosensitive resin composition and OLED display using same | 深圳市容大感光科技股份有限公司 | 2025-05-16 | — | — | CN | disclosed |
| CN-119955260-A | Resin composition for packaging protection of power device and preparation method thereof | 上海邃铸科技有限公司 | 2025-05-09 | — | — | CN | disclosed |
| CN-117659811-B | Fireproof insulating powder coating and preparation method and application thereof | 擎天材料科技有限公司 | 2025-04-29 | — | — | CN | disclosed |
| CN-119798601-A | Tea polyphenol palmitate modified aqueous polyurethane dispersion, preparation method and application | 万华化学集团股份有限公司 | 2025-04-11 | — | — | CN | disclosed |
| CN-118994618-A | Hyperbranched photosensitive resin with photoinitiation groups and LDI solder resist ink thereof | 深圳市百利合新材料发展有限公司 | 2024-11-22 | — | — | CN | disclosed |
| CN-112352198-B | Photosensitive film and method for forming permanent mask resist | 株式会社力森诺科 | 2024-08-16 | — | — | CN | disclosed |
| US-12032292-B2 | Photosensitive film and method for forming permanent mask resist | RESONAC CORPORATION (JP) | 2024-07-09 | — | — | US | disclosed |
| CN-115275518-B | Composite diaphragm, preparation method thereof, secondary battery and electric equipment | 欣旺达动力科技股份有限公司 | 2024-06-11 | — | — | CN | disclosed |
| US-20240174784-A1 | POLYMER LATEX COMPOSITION | SYNTHOMER SDN. BHD. (MY) | 2024-05-30 | — | — | US | disclosed |
| CN-117887363-A | Anisotropic conductive adhesive film and preparation method and application thereof | 宁波连森电子材料有限公司 | 2024-04-16 | — | — | CN | disclosed |
| CN-117757398-A | Joint filling silver adhesive and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2024-03-26 | — | — | CN | disclosed |
| CN-117659811-A | Fireproof insulating powder coating and preparation method and application thereof | 擎天材料科技有限公司 | 2024-03-08 | — | — | CN | disclosed |
| CN-117659824-A | Anticorrosive weather-resistant powder coating and preparation method and application thereof | 擎天材料科技有限公司 | 2024-03-08 | — | — | CN | disclosed |
| EP-4320174-A1 | POLYMER LATEX COMPOSITION | Synthomer Sdn. Bhd. (MY) | 2024-02-14 | — | — | EP | disclosed |
| CN-108227378-B | Heat-curable solder resist composition, dry film thereof, cured product thereof, and printed wiring board | 太阳油墨（苏州）有限公司 | 2023-12-15 | — | — | CN | disclosed |
| CN-116514494-B | Permeable concrete and landscape pavement construction method | 北京中景橙石科技股份有限公司 | 2023-09-15 | — | — | CN | disclosed |
| CN-116514494-A | Permeable concrete and landscape pavement construction method | 北京中景橙石科技股份有限公司 | 2023-08-01 | — | — | CN | disclosed |
| CN-115275518-A | Composite diaphragm, preparation method thereof, secondary battery and electric equipment | 欣旺达电动汽车电池有限公司 | 2022-11-01 | — | — | CN | disclosed |
| WO-2022216149-A1 | POLYMER LATEX COMPOSITION | SYNTHOMER SDN BHD (MY) | 2022-10-13 | — | — | WO | disclosed |
| CN-114967336-A | Photosensitive resin composition, photosensitive resin film and electronic component | 杭州福斯特电子材料有限公司 | 2022-08-30 | — | — | CN | disclosed |
| CN-113227194-A | Photosensitive resin composition | 日本化药株式会社 | 2021-08-06 | — | — | CN | disclosed |
| CN-113156762-A | Photosensitive resin composition, dry film, cured product and printed wiring board | 日本化药株式会社 | 2021-07-23 | — | — | CN | disclosed |
| CN-109791354-B | Photosensitive resin composition, dry film and printed wiring board | 互应化学工业株式会社 | 2021-06-04 | — | — | CN | disclosed |
| US-20210124267-A1 | PHOTOSENSITIVE FILM AND METHOD FOR FORMING PERMANENT MASK RESIST | SHOWA DENKO MATERIALS CO., LTD. (JP) | 2021-04-29 | — | — | US | disclosed |
| CN-112352198-A | Photosensitive film and method for forming permanent mask resist | 昭和电工材料株式会社 | 2021-02-09 | — | — | CN | disclosed |
| CN-107003611-B | Liquid solder resist composition and covered printed wiring board | 互应化学工业株式会社 | 2020-09-29 | — | — | CN | disclosed |
| US-10683413-B2 | Polyacetal resin composition and sliding member | POLYPLASTICS CO., LTD. (JP) | 2020-06-16 | — | — | US | disclosed |
| CN-107003610-B | Solder resist composition and covered printed wiring board | 互应化学工业株式会社 | 2020-05-19 | — | — | CN | disclosed |
| EP-3422101-B1 | LIQUID SOLDER RESIST COMPOSITION AND PRINTED CIRCUIT BOARD | GOO CHEMICAL CO LTD (JP) | 2020-04-08 | — | — | EP | disclosed |
| EP-3264176-B1 | LIQUID SOLDER RESIST COMPOSITION AND PRINTED WIRING BOARD | GOO CHEMICAL CO LTD (JP) | 2020-03-11 | — | — | EP | disclosed |
| WO-2020045024-A1 | PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM AND PRINTED WIRING BOARD | 互応化学工業株式会社 | 2020-03-05 | — | — | WO | disclosed |
| CN-110609446-A | Photocurable/thermosetting resin composition, cured product, and printed wiring board | 太阳油墨制造株式会社 | 2019-12-24 | — | — | CN | disclosed |
| US-10317796-B2 | Solder resist composition and covered printed wiring board | GOO CHEMICAL CO., LTD. (JP) | 2019-06-11 | — | — | US | disclosed |
| EP-3232269-B1 | LIQUID SOLDER RESIST COMPOSITION AND COVERED PRINTED WIRING BOARD | GOO CHEMICAL CO LTD (JP) | 2019-05-15 | — | — | EP | disclosed |
| EP-3232268-B1 | SOLDER RESIST COMPOSITION AND COVERED PRINTED WIRING BOARD | GOO CHEMICAL CO LTD (JP) | 2019-05-08 | — | — | EP | disclosed |
| US-10261414-B2 | Liquid solder resist composition and printed wiring board | GOO CHEMICAL CO., LTD. (JP) | 2019-04-16 | — | — | US | disclosed |
| US-10254647-B2 | Liquid solder resist composition and printed wiring board | GOO CHEMICAL CO., LTD. (JP) | 2019-04-09 | — | — | US | disclosed |
| US-10232678-B2 | Stabilizer bar with rubber bush and method for producing same | NHK SPRING CO., LTD. (JP) | 2019-03-19 | — | — | US | disclosed |
| US-10234758-B2 | Liquid solder resist composition and covered-printed wiring board | GOO CHEMICAL CO., LTD. (JP) | 2019-03-19 | — | — | US | disclosed |
| EP-3202847-B1 | POLYACETAL RESIN COMPOSITION AND SLIDING MEMBER | POLYPLASTICS CO (JP) | 2019-02-20 | — | — | EP | disclosed |
| EP-3422101-A1 | LIQUID SOLDER RESIST COMPOSITION AND PRINTED CIRCUIT BOARD | Goo Chemical Co., Ltd. (JP) | 2019-01-02 | — | — | EP | disclosed |
| US-10151976-B2 | Solder resist composition, and covered-printed wiring board | GOO CHEMICAL CO., LTD. (JP) | 2018-12-11 | — | — | US | disclosed |
| US-20180210336-A1 | LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD | GOO CHEMICAL CO., LTD. (JP) | 2018-07-26 | — | — | US | disclosed |
| US-20180136559-A1 | LIQUID SOLDER RESIST COMPOSITION AND PRINTED WIRING BOARD | GOO CHEMICAL CO., LTD. (JP) | 2018-05-17 | — | — | US | disclosed |
| US-20180129135-A1 | LIQUID SOLDER RESIST COMPOSITION AND PRINTED WIRING BOARD | GOO CHEMICAL CO., LTD. (JP) | 2018-05-10 | — | — | US | disclosed |
| EP-3163373-B1 | LIQUID SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD | GOO CHEMICAL CO LTD (JP) | 2018-04-25 | — | — | EP | disclosed |
| EP-3109701-B1 | PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND COVER-PRINTED WIRING BOARD | GOO CHEMICAL CO LTD (JP) | 2018-04-18 | — | — | EP | disclosed |
| EP-3054350-B1 | LIQUID SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD | GOO CHEMICAL CO LTD (JP) | 2018-04-11 | — | — | EP | disclosed |
| US-20180059544-A1 | LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD | GOO CHEMICAL CO LTD (JP) | 2018-03-01 | — | — | US | disclosed |
| EP-3264176-A1 | LIQUID SOLDER RESIST COMPOSITION AND PRINTED CIRCUIT BOARD | Goo Chemical Co., Ltd. (JP) | 2018-01-03 | — | — | EP | disclosed |
| US-9835944-B2 | Liquid solder resist composition and covered-printed wiring board | GOO CHEMICAL CO., LTD. (JP) | 2017-12-05 | — | — | US | disclosed |
| US-20170336708-A1 | SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD | GOO CHEMICAL CO., LTD. (JP) | 2017-11-23 | — | — | US | disclosed |
| US-20170315443-A1 | LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD | GOO CHEMICAL CO., LTD. (JP) | 2017-11-02 | — | — | US | disclosed |
| US-20170306141-A1 | POLYACETAL RESIN COMPOSITION AND SLIDING MEMBER | POLYPLASTICS CO., LTD. (JP) | 2017-10-26 | — | — | US | disclosed |
| US-20170306140-A1 | POLYACETAL RESIN COMPOSITION AND SLIDING MEMBER | POLYPLASTICS CO., LTD. (JP) | 2017-10-26 | — | — | US | disclosed |
| EP-3232268-A1 | SOLDER RESIST COMPOSITION AND COVERED PRINTED WIRING BOARD | Goo Chemical Co., Ltd. (JP) | 2017-10-18 | — | — | EP | disclosed |
| EP-3232267-A1 | SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD | Goo Chemical Co., Ltd. (JP) | 2017-10-18 | — | — | EP | disclosed |
| EP-3232269-A1 | LIQUID SOLDER RESIST COMPOSITION AND COVERED PRINTED WIRING BOARD | Goo Chemical Co., Ltd. (JP) | 2017-10-18 | — | — | EP | disclosed |
| US-20170283608-A1 | POLYACETAL RESIN COMPOSITION AND SLIDING MEMBER | POLYPLASTICS CO., LTD. (JP) | 2017-10-05 | — | — | US | disclosed |
| US-9770442-B2 | Self-assembling amphiphilic polymers as anti-cancer agents | ALLEXCEL INC. (US) | 2017-09-26 | — | — | US | disclosed |
| US-20170269477-A1 | SOLDER RESIST COMPOSITION AND COVERED PRINTED WIRING BOARD | GOO CHEMICAL CO., LTD. (JP) | 2017-09-21 | — | — | US | disclosed |
| EP-3202846-A1 | POLYACETAL RESIN COMPOSITION AND SLIDING MEMBER | Polyplastics Co., Ltd. (JP) | 2017-08-09 | — | — | EP | disclosed |
| EP-3202847-A1 | POLYACETAL RESIN COMPOSITION AND SLIDING MEMBER | Polyplastics Co., Ltd. (JP) | 2017-08-09 | — | — | EP | disclosed |
| EP-3202845-A1 | POLYACETAL RESIN COMPOSITION AND SLIDING MEMBER | Polyplastics Co., Ltd. (JP) | 2017-08-09 | — | — | EP | disclosed |
| EP-3163373-A1 | LIQUID SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD | Goo Chemical Co., Ltd. (JP) | 2017-05-03 | — | — | EP | disclosed |
| EP-2167103-B1 | SELF-ASSEMBLING AMPHIPHILIC POLYMERS AS ANTICANCER AGENTS | ALLEXCEL INC (US) | 2017-03-01 | — | — | EP | disclosed |
| EP-3135512-A1 | STABILIZER BAR WITH RUBBER BUSH AND METHOD FOR PRODUCING SAME | NHK Spring Co., Ltd. (JP) | 2017-03-01 | — | — | EP | disclosed |
| EP-2120974-B1 | SELF-ASSEMBLING AMPHIPHILIC POLYMERS AS ANTIVIRAL AGENTS | ALLEXCEL INC (US) | 2017-03-01 | — | — | EP | disclosed |
| US-20170043641-A1 | STABILIZER BAR WITH RUBBER BUSH AND METHOD FOR PRODUCING SAME | NHK SPRING CO., LTD. (JP) | 2017-02-16 | — | — | US | disclosed |
| US-20170017152-A1 | PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND COVERED-PRINTED WIRING BOARD | GOO CHEMICAL CO., LTD. (JP) | 2017-01-19 | — | — | US | disclosed |
| EP-3109701-A1 | PHOTOSENSITIVE RESIN COMPOSITION, SOLDER RESIST COMPOSITION, AND COATED PRINTED WIRING BOARD | Goo Chemical Co., Ltd. (JP) | 2016-12-28 | — | — | EP | disclosed |
| US-20160342085-A1 | LIQUID SOLDER RESIST COMPOSITION AND COVERED-PRINTED WIRING BOARD | GOO CHEMICAL CO., LTD. (JP) | 2016-11-24 | — | — | US | disclosed |
| EP-3054350-A1 | LIQUID SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD | Goo Chemical Co., Ltd. (JP) | 2016-08-10 | — | — | EP | disclosed |
| EP-2650150-B1 | BUSH- AND BRACKET-INTEGRATED STABILIZER BAR | NHK SPRING CO LTD (JP) | 2015-09-02 | — | — | EP | disclosed |
| US-9090770-B2 | Polyacetal resin composition, method for producing the same, and molded article | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2015-07-28 | — | — | US | disclosed |
| EP-1911807-B1 | RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING THE SAME | TORAY INDUSTRIES (JP) | 2015-03-04 | — | — | EP | disclosed |
| EP-2098569-B1 | POLYACETAL RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | POLYPLASTICS CO (JP) | 2014-11-26 | — | — | EP | disclosed |
| EP-1979407-B1 | SOLUBILIZATION AND TARGETED DELIVERY OF DRUGS WITH SELF-ASSEMBLING AMPHIPHILIC POLYMERS | ALLEXCEL INC (US) | 2014-08-06 | — | — | EP | disclosed |
| US-8765850-B2 | Polyacetal resin composition and preparation process thereof | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2014-07-01 | — | — | US | disclosed |
| EP-2036949-B1 | POLYACETAL RESIN COMPOSITION | POLYPLASTICS CO (JP) | 2014-03-19 | — | — | EP | disclosed |
| US-8664334-B2 | Resin composition and molded article made thereof | TORAY INDUSTRIES, INC. (JP) | 2014-03-04 | — | — | US | disclosed |
| EP-2267075-B1 | POLYACETAL RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME | ASAHI KASEI CHEMICALS CORP (JP) | 2014-01-22 | — | — | EP | disclosed |
| US-8613460-B2 | Bush- and bracket-integrated stabilizer bar | NHK SPRING CO., LTD. (JP) | 2013-12-24 | — | — | US | disclosed |
| US-20130270787-A1 | BUSH- AND BRACKET-INTEGRATED STABILIZER BAR | NHK SPRING CO., LTD. (JP) | 2013-10-17 | — | — | US | disclosed |
| EP-2650150-A1 | BUSH- AND BRACKET-INTEGRATED STABILIZER BAR | NHK Spring Co., Ltd. (JP) | 2013-10-16 | — | — | EP | disclosed |
| EP-2617766-A1 | Resin composition and molded article made therof | TORAY INDUSTRIES, INC. (JP) | 2013-07-24 | — | — | EP | disclosed |
| US-8476824-B2 | Active matrix organic electroluminescent device and method of manufacture thereof | UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA (CN) | 2013-07-02 | — | — | US | disclosed |
| EP-2559731-A1 | POLYACETAL RESIN COMPOSITION, PROCESS FOR PRODUCTION OF THE COMPOSITION, AND MOLDED ARTICLE | Asahi Kasei Chemicals Corporation (JP) | 2013-02-20 | — | — | EP | disclosed |
| US-20130035416-A1 | POLYACETAL RESIN COMPOSITION, METHOD FOR PRODUCING THE SAME, AND MOLDED ARTICLE | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2013-02-07 | — | — | US | disclosed |
| WO-2013012011-A1 | RESIN MOLDED BODY AND AUTOMOBILE INTERIOR COMPONENT | ウィンテックポリマー株式会社 (JP) | 2013-01-24 | — | — | WO | disclosed |
| EP-1679346-B1 | POLYACETAL RESIN COMPOSITION | POLYPLASTICS CO (JP) | 2012-11-14 | — | — | EP | disclosed |
| US-8278820-B2 | Active matrix organic electroluminescent device and method of manufacture thereof | University of Electric Sience and Technology of China (CN) | 2012-10-02 | — | — | US | disclosed |
| US-20120164762-A1 | Active matrix organic electroluminescent device and method of manufacture thereof | UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA | 2012-06-28 | — | — | US | disclosed |
| US-8173764-B2 | Solubilization and targeted delivery of drugs with self-assembling amphiphilic polymers | ALLEXCEL INC. (US) | 2012-05-08 | — | — | US | disclosed |
| US-8148047-B2 | Carboxyl resin, hardening composition containing carboxyl resin, and hardened material thereof | Goo Chemical Company, Ltd. (JP) | 2012-04-03 | — | — | US | disclosed |
| EP-2292678-B1 | CARBOXYL GROUP-CONTAINING RESIN, CURABLE COMPOSITION CONTAINING CARBOXYL GROUP-CONTAINING RESIN, AND CURED PRODUCT OF THE COMPOSITION | GOO CHEMICAL CO LTD (JP) | 2012-02-15 | — | — | EP | disclosed |
| US-20110269907-A1 | RESIN COMPOSITION AND MOLDED ARTICLE MADE THEREOF | TORAY INDUSTRIES, INC. (JP) | 2011-11-03 | — | — | US | disclosed |
| US-8048613-B2 | Alkali development-type solder resist, cured product thereof, and printed wiring board prepared by using the same | TAIYO INK MFG. CO., LTD. (JP) | 2011-11-01 | — | — | US | disclosed |
| US-20110221331-A1 | Active matrix organic electroluminescent device and method of manufacture thereof | UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA | 2011-09-15 | — | — | US | disclosed |
| EP-1524332-B1 | SURFACE-TREATED STEEL SHEET EXCELLENT IN RESISTANCE TO WHITE RUST AND METHOD FOR PRODUCTION THEREOF | JFE STEEL CORP (JP) | 2011-09-14 | — | — | EP | disclosed |
| US-7999021-B2 | Resin composition and molded article made thereof | TORAY INDUSTRIES, INC. (JP) | 2011-08-16 | — | — | US | disclosed |
| US-7993732-B2 | Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material | RICOH COMPANY, LTD. (JP) | 2011-08-09 | — | — | US | disclosed |
| US-20110082229-A1 | CARBOXYL RESIN, HARDENING COMPOSITION CONTAINING CARBOXYL RESIN, AND HARDENED MATERIAL THEREOF | GOO CHEMICAL CO., LTD. (JP) | 2011-04-07 | — | — | US | disclosed |
| EP-2292678-A1 | CARBOXYL GROUP-CONTAINING RESIN, CURABLE COMPOSITION CONTAINING CARBOXYL GROUP-CONTAINING RESIN, AND CURED PRODUCT OF THE COMPOSITION | Goo Chemical Co., Ltd. (JP) | 2011-03-09 | — | — | EP | disclosed |
| US-7893140-B2 | Polyacetal resin composition | POLYPLASTICS CO., LTD. (JP) | 2011-02-22 | — | — | US | disclosed |
| US-20110015321-A1 | POLYACETAL RESIN COMPOSITION AND PREPARATION PROCESS THEREOF | ASAHI KASEI CHEMICALS CORPORATION (JP) | 2011-01-20 | — | — | US | disclosed |
| EP-2267075-A1 | POLYACETAL RESIN COMPOSITION AND METHOD FOR PRODUCING THE SAME | Asahi Kasei Chemicals Corporation (JP) | 2010-12-29 | — | — | EP | disclosed |
| US-20100260743-A1 | Solubilization and Targeted Delivery of Drugs With Self-Assembling Amphiphilic Polymers | ALLEXCEL, INC. (US) | 2010-10-14 | — | — | US | disclosed |
| US-20100239659-A1 | SELF-ASSEMBLING AMPHIPHILIC POLYMERS AS ANTI-CANCER AGENTS | ALLEXCEL., INC. (US) | 2010-09-23 | — | — | US | disclosed |
| US-20100160505-A1 | Resin composition and molded article made thereof | TORAY INDUSTRIES, INC. (JP) | 2010-06-24 | — | — | US | disclosed |
| EP-1553450-B1 | Process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board | SAN EI KAGAKU CO (JP) | 2010-05-26 | — | — | EP | disclosed |
| US-20100093901-A1 | POLYACETAL RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | POLYPLASTICS CO., LTD. (JP) | 2010-04-15 | — | — | US | disclosed |
| US-20100087575-A1 | POLYACETAL RESIN COMPOSITION | POLYPLASTICS CO., LTD. (JP) | 2010-04-08 | — | — | US | disclosed |
| EP-2167103-A1 | SELF-ASSEMBLING AMPHIPHILIC POLYMERS AS ANTICANCER AGENTS | Allexcel, Inc. (US) | 2010-03-31 | — | — | EP | disclosed |
| US-20100008938-A1 | SELF ASSEMBLING AMPHIPHILIC POLYMERS AS ANTIVIRAL AGENTS | ALLEXCEL, INC. | 2010-01-14 | — | — | US | disclosed |
| EP-1788044-B1 | Ink-jet ink, ink-jet ink set, and ink-jet recording method | KONICA MINOLTA HOLDINGS INC (JP) | 2009-12-23 | — | — | EP | disclosed |
| US-20090312466-A1 | POLYACETAL RESIN COMPOSITION | POLYPLASTICS CO., LTD. (JP) | 2009-12-17 | — | — | US | disclosed |
| EP-2120974-A1 | SELF-ASSEMBLING AMPHIPHILIC POLYMERS AS ANTIVIRAL AGENTS | Allexcel, Inc. (US) | 2009-11-25 | — | — | EP | disclosed |
| EP-2123709-A1 | POLYACETAL RESIN COMPOSITION | Polyplastics Co., Ltd. (JP) | 2009-11-25 | — | — | EP | disclosed |
| EP-2098569-A1 | POLYACETAL RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | Polyplastics Co., Ltd. (JP) | 2009-09-09 | — | — | EP | disclosed |
| US-7585611-B2 | Photocurable and thermosetting resin composition, dry film using the same, and cured product thereof | TAIYO INK MFG. CO., LTD. (JP) | 2009-09-08 | — | — | US | disclosed |
| EP-2036949-A1 | POLYACETAL RESIN COMPOSITION | Polyplastics Co., Ltd. (JP) | 2009-03-18 | — | — | EP | disclosed |
| US-20090038834-A1 | ALKALI DEVELOPMENT-TYPE SOLDER RESIST, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD PREPARED BY USING THE SAME | TAIYO INK MFG. CO., LTD. (JP) | 2009-02-12 | — | — | US | disclosed |
| US-20090029181-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND PRINTED WIRING BOARD OBTAINED BY USING THE SAME | TAIYO INK MFG. CO., LTD. (JP) | 2009-01-29 | — | — | US | disclosed |
| WO-2009011702-A1 | SELF-ASSEMBLING AMPHIPHILIC POLYMERS AS ANTICANCER AGENTS | ALLEXCEL, INC. (US) | 2009-01-22 | — | — | WO | disclosed |
| EP-1979407-A1 | SOLUBILIZATION AND TARGETED DELIVERY OF DRUGS WITH SELF-ASSEMBLING AMPHIPHILIC POLYMERS | Allexcel, Inc. (US) | 2008-10-15 | — | — | EP | disclosed |
| WO-2008091246-A1 | SELF-ASSEMBLING AMPHIPHILIC POLYMERS AS ANTIVIRAL AGENTS | ALLEXCEL, INC. (US) | 2008-07-31 | — | — | WO | disclosed |
| US-7396885-B2 | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board | SAN-EI KAGAKU CO., LTD. (JP) | 2008-07-08 | — | — | US | disclosed |
| EP-1911807-A1 | RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING THE SAME | TORAY INDUSTRIES, INC. (JP) | 2008-04-16 | — | — | EP | disclosed |
| US-20080026205-A1 | Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material | RICOH COMPANY, LTD. (JP) | 2008-01-31 | — | — | US | disclosed |
| EP-1882726-A1 | Heat-sensitive pressure-sensitive adhesive and heat-sensitive adhesive material | Ricoh Company, Ltd. (JP) | 2008-01-30 | — | — | EP | disclosed |
| US-7291402-B2 | Surface-treated steel sheets of good white rust resistance, and method for producing them | JFE STEEL CORPORATION (JP) | 2007-11-06 | — | — | US | disclosed |
| WO-2007084126-A1 | SOLUBILIZATION AND TARGETED DELIVERY OF DRUGS WITH SELF-ASSEMBLING AMPHIPHILIC POLYMERS | ALLEXCEL, INC. (US) | 2007-07-26 | — | — | WO | disclosed |
| US-20070123617-A1 | Polyacetal resin composition | DEUTSCHE BANK AG, NEW YORK BRANCH, AS COLLATERAL AGENT | 2007-05-31 | — | — | US | disclosed |
| US-20070122742-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, DRY FILM USING THE SAME, AND CURED PRODUCT THEREOF | TAIYO INK MFG. CO., LTD. (JP) | 2007-05-31 | — | — | US | disclosed |
| EP-1788044-A1 | Ink-jet ink, ink-jet ink set, and ink-jet recording method | KONICA MINOLTA HOLDINGS, INC. (JP) | 2007-05-23 | — | — | EP | disclosed |
| US-20070109375-A1 | INK-JET INK, INK-JET INK SET AND INK-JET RECORDING METHOD | KONICA MINOLTA HOLDINGS, INC. (JP) | 2007-05-17 | — | — | US | disclosed |
| US-7175892-B2 | Emulsion and coating liquid and recording medium using the same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2007-02-13 | — | — | US | disclosed |
| EP-1050603-B1 | SURFACE TREATED STEEL SHEET HAVING EXCELLENT CORROSION RESISTANCE | JFE STEEL CORP (JP) | 2007-01-10 | — | — | EP | disclosed |
| EP-1679346-A1 | POLYACETAL RESIN COMPOSITION | Polyplastics Co., Ltd. (JP) | 2006-07-12 | — | — | EP | disclosed |
| EP-1298155-B1 | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring substrate | SAN EI KAGAKU CO (JP) | 2005-07-20 | — | — | EP | disclosed |
| EP-1553450-A1 | Process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board | San-Ei Kagaku Co. Ltd. (JP) | 2005-07-13 | — | — | EP | disclosed |
| US-20050147832-A1 | Surface-treated steel sheet excellent in resistance to white rust and method for production thereof | KANSAI PAINT CO., LTD. (JP) | 2005-07-07 | — | — | US | disclosed |
| EP-1524332-A1 | SURFACE-TREATED STEEL SHEET EXCELLENT IN RESISTANCE TO WHITE RUST AND METHOD FOR PRODUCTION THEREOF | JFE Steel Corporation (JP) | 2005-04-20 | — | — | EP | disclosed |
| US-20040115370-A1 | Emulsion and coating liquid and recording medium using the same | ASAHI KASEI KABUSHIKI KAISHA (JP) | 2004-06-17 | — | — | US | disclosed |
| EP-1380438-A1 | EMULSION AND COATING LIQUID AND RECORDING MEDIUM USING THE SAME | Asahi Kasei Kabushiki Kaisha (JP) | 2004-01-14 | — | — | EP | disclosed |
| US-20030215567-A1 | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board | SAN-EI KAGAKU CO., LTD. | 2003-11-20 | — | — | US | disclosed |
| US-6562474-B1 | Coated steel sheet having excellent corrosion resistance and method for producing the same | NKK CORPORATION (JP) | 2003-05-13 | — | — | US | disclosed |
| EP-1298155-A1 | Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board, and plugged-through-hole printed wiring board | San-Ei Kagaku Co. Ltd. (JP) | 2003-04-02 | — | — | EP | disclosed |
| JP-2002226602-A | METHOD FOR MANUFACTURING CROSSLINKED POLYMER, CROSSLINKED POLYMER AND COMPOSITION FOR COMPOUNDING | KAYAKU AKZO CORP | 2002-08-14 | — | — | JP | disclosed |
| US-6403713-B2 | CROSSLINKING WITH PHENOL-FORMALDEHYDE RESIN, 3-(N-SALICYLOYL) AMINO-1,2,4-TRIAZOLE, AND HYDRAZIDE FORMING BUTYL RUBBER; RESILIENT AND LOW CORROSIVITY; HALOGEN-FREE | ONIZAWA MASAO (JP) | 2002-06-11 | — | — | US | disclosed |
| US-6388008-B2 | DIELECTRIC, CORROSION RESISTANCE | ONIZAWA MASAO (JP) | 2002-05-14 | — | — | US | disclosed |
| US-20010031832-A1 | Method for crosslinking of isoprene-isobutylene rubber and crosslinked rubber product obtained by said method | ONIZAWA MASAO (JP) | 2001-10-18 | — | — | US | disclosed |
| US-20010027235-A1 | Method for crosslinking of isoprene-isobutylene rubber, ethylene-propylene-diene rubber containing ethylidenenorbornene as unsaturated component, or mixture thereof; and crosslinked rubber product obtained by said method | ONIZAWA MASAO (JP) | 2001-10-04 | — | — | US | disclosed |
| US-6255394-B1 | INCREASING HARDNESS WITHOUT USING A HALOGEN COMPOUND OR EXCESS CARBON BLACK | ONIZAWA MASAO (JP) | 2001-07-03 | — | — | US | disclosed |
| EP-1050603-A1 | SURFACE TREATED STEEL SHEET HAVING EXCELLENT CORROSION RESISTANCE AND METHOD FOR PRODUCING THE SAME | NKK CORPORATION (JP) | 2000-11-08 | — | — | EP | disclosed |
| EP-0620238-B1 | Epoxy resin composition | TOTOKASEI CO LTD (JP) | 1999-03-03 | — | — | EP | disclosed |
| EP-0498620-B1 | Colored polyacetal resin composition | POLYPLASTICS CO (JP) | 1997-05-21 | — | — | EP | disclosed |
| US-5494950-A | A CURABLE EPOXY RESIN COMPRISING HARDENER, INORGANIC FILLER; LOW WATER ABSORPTION, STRESS AND HEAT RESISTANCE | TOTOKASEI CO., LTD. (JP) | 1996-02-27 | — | — | US | disclosed |
| EP-0620238-A2 | Epoxy resin composition | TOTOKASEI Co., Ltd. (JP) | 1994-10-19 | — | — | EP | disclosed |
| EP-0304503-B1 | Hardener for curable one-package epoxy resin system | ASAHI CHEMICAL IND (JP) | 1994-06-29 | — | — | EP | disclosed |
| US-5212222-A | Nitrogen compound, fatty ester, salt, hindered phenol | POLYPLASTICS CO., LTD. (JP) | 1993-05-18 | — | — | US | disclosed |
| EP-0498620-A1 | Colored polyacetal resin composition | POLYPLASTICS CO. LTD. (JP) | 1992-08-12 | — | — | EP | disclosed |
| US-RE33965-E | Carbon fibers impregnated with epoxy resin containing hardevers, accelerators, additives; prepregs | MITSUBISHI RAYON CO., LTD. (JP) | 1992-06-16 | — | — | US | disclosed |
| US-4996286-A | Rapid low temperature curing; storage stability | AJINOMOTO CO., INC. (JP) | 1991-02-26 | — | — | US | disclosed |
| US-4983655-A | MOLDING MATERIALS | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 1991-01-08 | — | — | US | disclosed |
| US-4981889-A | SURFACE TREATED CURING AGENT | SUNSTAR GIKEN KABUSHIKI KAISHA (JP) | 1991-01-01 | — | — | US | disclosed |
| EP-0154455-B1 | LATENT CURING AGENT FOR EPOXY RESINS | AJINOMOTO CO., INC. (JP) | 1990-05-02 | — | — | EP | disclosed |
| US-4833226-A | Hardener for curable one-package epoxy resin system | ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) | 1989-05-23 | — | — | US | disclosed |
| EP-0304503-A1 | Hardener for curable one-package epoxy resin system | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1989-03-01 | — | — | EP | disclosed |
| US-4767805-A | CARBON FIBERS IMPREGNATED WITH EPOXY RESIN CONTAINING HYDROXY-AMINE,-AMIDE OR-UREA ADDITIVE, HARDENERS; PREPREGS | MITSUBISHI RAYON CO., LTD. (JP) | 1988-08-30 | — | — | US | disclosed |
| EP-0145358-B1 | LATENT CURING AGENTS FOR EPOXY RESINS | AJINOMOTO CO., INC. (JP) | 1988-03-23 | — | — | EP | disclosed |
| EP-0193068-A1 | One liquid type epoxy resin composition | Asahi Kasei Kogyo Kabushiki Kaisha (JP) | 1986-09-03 | — | — | EP | disclosed |
| EP-0100633-B1 | LATENT CURING AGENTS FOR EPOXY RESINS | AJINOMOTO CO., INC. (JP) | 1986-04-09 | — | — | EP | disclosed |
| EP-0173137-A2 | Intermediate for composite materials | MITSUBISHI RAYON CO., LTD. (JP) | 1986-03-05 | — | — | EP | disclosed |
| EP-0039230-B1 | CURABLE COMPOSITION | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1985-12-11 | — | — | EP | disclosed |
| US-4544733-A | HYDRAZIDES, STORAGE STABILITY | AJINOMOTO CO., INC. (JP) | 1985-10-01 | — | — | US | disclosed |
| EP-0154455-A2 | Latent curing agent for epoxy resins | AJINOMOTO CO., INC. (JP) | 1985-09-11 | — | — | EP | disclosed |
| US-4530991-A | Hydrazide compound | AJINOMOTO CO., INC. (JP) | 1985-07-23 | — | — | US | disclosed |
| EP-0145358-A1 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1985-06-19 | — | — | EP | disclosed |
| US-4465830-A | HYDRAZIDE SUBSTITUTED HYDANTOINS | AJINOMOTO COMPANY, INCORPORATED (JP) | 1984-08-14 | — | — | US | disclosed |
| US-4450267-A | AROMATIC ETHER HYDRAZIDES | AJINOMOTO COMPANY INCORPORATED (JP) | 1984-05-22 | — | — | US | disclosed |
| US-4448949-A | Latent curing agents for epoxy resins | AJINOMOTO COMPANY INCORPORATED (JP) | 1984-05-15 | — | — | US | disclosed |
| EP-0106635-A1 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1984-04-25 | — | — | EP | disclosed |
| EP-0100633-A2 | Latent curing agents for epoxy resins | AJINOMOTO CO., INC. (JP) | 1984-02-15 | — | — | EP | disclosed |
| US-4360649-A | EPOXY RESIN, EPOXIDE-DIALKYLAMINE ADDUCT, UREA COMPOUND, CURING AGENTS | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1982-11-23 | — | — | US | disclosed |
| EP-0039230-A2 | Curable composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1981-11-04 | — | — | EP | disclosed |
| EP-0039230-A2 | Curable composition | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1981-11-04 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (3 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20100008938-A1 | SELF ASSEMBLING AMPHIPHILIC POLYMERS AS ANTIVIRAL AGENTS | PICALM, CLTA, HAVCR2 | CRBN 570/4885FKBP5 3437/4885ALDH1A1 4248/4885 |
| US-20100239659-A1 | SELF-ASSEMBLING AMPHIPHILIC POLYMERS AS ANTI-CANCER AGENTS | CD44, EPCAM, EGFR | CRBN 1703/4885FKBP5 3299/4885ALDH1A1 3336/4885 |
| US-20100260743-A1 | Solubilization and Targeted Delivery of Drugs With Self-Assembling Amphiphilic Polymers | CD44, ABCG2, ABCC1 | CRBN 1313/4885FKBP5 3457/4885ALDH1A1 2133/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.