Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PRKCI | P41743 | 1/20 | 0.42 |
| ▸ | ACHE | P22303 | 1/20 | 0.41 |
| ▸ | GAA | P10253 | 4/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.37 |
| ▸ | MAPT | P10636 | 3/20 | 0.37 |
| ▸ | HTT | P42858 | 3/20 | 0.37 |
| ▸ | POLB | P06746 | 3/20 | 0.37 |
| ▸ | CASP1 | P29466 | 2/20 | 0.37 |
| ▸ | TP53 | P04637 | 2/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.37 |
| ▸ | MEN1 | O00255 | 2/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.37 |
| ▸ | USP2 | O75604 | 1/20 | 0.37 |
| ▸ | CASP7 | P55210 | 1/20 | 0.37 |
| ▸ | ATM | Q13315 | 1/20 | 0.37 |
| ▸ | TSHR | P16473 | 3/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.36 |
| ▸ | ESR1 | P03372 | 1/20 | 0.36 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.36 |
| ▸ | GLA | P06280 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4597777 | 0.88 | CNR1 (0.40) | PRKCIACHEGAAALDH1A1MAPT | |
| SCHEMBL29530665 | 0.88 | CNR1 (0.40) | PRKCIACHEGAAALDH1A1MAPT | |
| SCHEMBL5381974 | 0.87 | TLR8 (0.42) | PRKCIACHEGAAALDH1A1MAPT | |
| Methane SCHEMBL28326825 | 0.86 | SREBF2 (0.40) | PRKCIACHEGAAALDH1A1MAPT | |
| SCHEMBL434114 | 0.85 | TLR8 (0.44) | PRKCIACHEMAPTHTTTP53 | |
| SCHEMBL29795424 | 0.85 | DPP4 (0.41) | PRKCIALDH1A1MAPTHTTCASP1 | |
| SCHEMBL4576433 | 0.84 | PRKCI (0.44) | PRKCIACHEGAAALDH1A1MAPT | |
| SCHEMBL12798389 | 0.84 | HTR2A (0.46) | GAAALDH1A1MAPTHTTTP53 | |
| SCHEMBL30087007 | 0.82 | PRKCI (0.42) | PRKCIACHEGAAALDH1A1MAPT | |
| SCHEMBL146162 | 0.82 | PRKCI (0.42) | PRKCIACHEGAAALDH1A1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12504687-B2 | Curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern, semiconductor device and electronic device | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2025-12-23 | — | — | US | disclosed |
| CN-119775953-A | Adhesive composition, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2025-04-08 | — | — | CN | disclosed |
| WO-2025070767-A1 | RESIN COMPOSITION, COATING SOLUTION, RESIN FILM, METAL-CLAD LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS | 日鉄ケミカル＆マテリアル株式会社 | 2025-04-03 | — | — | WO | disclosed |
| WO-2025070797-A1 | COPOLYMER, RESIN BASE MATERIAL, RESIN COMPOSITION, COATING LIQUID, POLYIMIDE, RESIN FILM, METAL-CLAD LAMINATE, CIRCUIT BOARD, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS, AND MANUFACTURING METHOD | 日鉄ケミカル＆マテリアル株式会社 | 2025-04-03 | — | — | WO | disclosed |
| CN-119307222-A | Adhesive composition, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2025-01-14 | — | — | CN | disclosed |
| CN-119217819-A | Laminate, metal-clad laminate, circuit board, electronic component, device, adhesive resin composition, method for producing the same, and adhesive film | 日铁化学材料株式会社 | 2024-12-31 | — | — | CN | disclosed |
| CN-112571901-B | Polyimide film, metal-clad laminate, and circuit board | 日铁化学材料株式会社 | 2024-12-31 | — | — | CN | disclosed |
| CN-118255987-A | Polyamic acid, polyimide, resin film, metal-clad laminate, and circuit board | 日铁化学材料株式会社 | 2024-06-28 | — | — | CN | disclosed |
| CN-117700990-A | Resin composition, adhesive, coating agent, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2024-03-15 | — | — | CN | disclosed |
| CN-115877658-A | Curable photosensitive resin composition, cured product, resist pattern and method for producing same, semiconductor element, and electronic device | 荒川化学工业株式会社 | 2023-03-31 | — | — | CN | disclosed |
| US-20230101181-A1 | CURABLE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, RESIST PATTERN, METHOD OF PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2023-03-30 | — | — | US | disclosed |
| CN-113174231-B | Polyimide resin composition, adhesive composition, and related articles thereof | 荒川化学工业株式会社 | 2022-09-27 | — | — | CN | disclosed |
| CN-114958287-A | Adhesive composition, cured product, adhesive sheet, copper foil with resin, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2022-08-30 | — | — | CN | disclosed |
| CN-114940757-A | Polyimide resin composition, adhesive composition, and related articles | 荒川化学工业株式会社 | 2022-08-26 | — | — | CN | disclosed |
| CN-114621723-A | Adhesive composition, cured product, adhesive sheet, copper foil with resin, copper-clad laminate, and printed wiring board | 荒川化学工业株式会社 | 2022-06-14 | — | — | CN | disclosed |
| CN-113174231-A | Polyimide resin composition, adhesive composition, and related articles | 荒川化学工业株式会社 | 2021-07-27 | — | — | CN | disclosed |
| JP-2006193434-A | 4,4'-DIAMINOBIPHENYL COMPOUND | NIPPON STEEL CHEM CO LTD | 2006-07-27 | — | — | JP | disclosed |
| JP-2005314630-A | AROMATIC POLYAMIC ACID AND POLYIMIDE | NIPPON STEEL CHEM CO LTD | 2005-11-10 | — | — | JP | disclosed |