SCHEMBL5830951

SCHEMBL5830951

COC(C=CC[SiH3])OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6258854 0.74 THRB (0.35)
SCHEMBL9813800 0.72
SCHEMBL11649990 0.72
SCHEMBL1415519 0.72
SCHEMBL9813797 0.72
SCHEMBL11649987 0.72
SCHEMBL1679775 0.71
SCHEMBL5696389 0.71
SCHEMBL3989087 0.71
SCHEMBL9872537 0.70 HTT (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117080447-A Adhesive and preparation method thereof, positive plate and lithium ion battery 蜂巢能源科技股份有限公司 2023-11-17 CN claimed
EP-1578753-A2 METHOD OF MAKING MERCAPTOALKYLALKYLDIALKOXYSILANES Dow Corning Corporation (US) 2005-09-28 EP claimed
US-6844460-B2 Method of making mercaptoalkylalkyldialkoxysilanes DOW CORNING CORPORATION (US) 2005-01-18 US claimed
WO-2004063204-A2 METHOD OF MAKING MERCAPTOALKYLALKYLDIALKOXYSILANES DOW CORNING CORPORATION (US) 2004-07-29 WO claimed
US-20040133025-A1 Method of making mercaptoalkylalkyldialkoxysilanes DOW CORNING CORPORATION 2004-07-08 US claimed
US-20240166778-A1 METHOD FOR PRODUCING POLYMER AND POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2024-05-23 US disclosed
CN-117396639-A Surface-treated copper foil, copper-clad laminate, and printed wiring board 古河电气工业株式会社 2024-01-12 CN disclosed
CN-117080447-A Adhesive and preparation method thereof, positive plate and lithium ion battery 蜂巢能源科技股份有限公司 2023-11-17 CN disclosed
US-7081503-B2 Process producing vinyl polymer having alkenyl group at end, vinyl polymer, and curable composition KANEKA CORPORATION (JP) 2006-07-25 US disclosed
US-7009004-B2 Process for producing vinyl polymer having alkenyl group at end vinyl polymer and curable composition KANEKA CORPORATION (JP) 2006-03-07 US disclosed
US-20060004171-A1 Process for producing vinyl polymer having alkenyl group at end, vinyl polymer, and curable composition TSUJI RYOTARO 2006-01-05 US disclosed
EP-1578753-A2 METHOD OF MAKING MERCAPTOALKYLALKYLDIALKOXYSILANES Dow Corning Corporation (US) 2005-09-28 EP disclosed
US-6844460-B2 Method of making mercaptoalkylalkyldialkoxysilanes DOW CORNING CORPORATION (US) 2005-01-18 US disclosed
WO-2004063204-A2 METHOD OF MAKING MERCAPTOALKYLALKYLDIALKOXYSILANES DOW CORNING CORPORATION (US) 2004-07-29 WO disclosed
US-20040133025-A1 Method of making mercaptoalkylalkyldialkoxysilanes DOW CORNING CORPORATION 2004-07-08 US disclosed
US-20040097678-A1 Process for producing vinyl polymer having alkenyl group at end vinyl polymer and curable composition KANEKA CORPORATION (JP) 2004-05-20 US disclosed
EP-1375531-A1 PROCESS FOR PRODUCING VINYL POLYMER HAVING ALKENYL GROUP AT END, VINYL POLYMER, AND CURABLE COMPOSITION KANEKA CORPORATION (JP) 2004-01-02 EP disclosed