SCHEMBL5847686

SCHEMBL5847686

C=C(C)OC(=O)C(=C)Cl

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL506448 0.82 HSD17B10 (0.33)
SCHEMBL866932 0.77
SCHEMBL27786 0.77
SCHEMBL3024296 0.77
SCHEMBL9400227 0.74 TDP1 (0.55)
SCHEMBL26112685 0.74 ALDH1A1 (0.40)
SCHEMBL8827572 0.73
Tetrachloroethylene SCHEMBL6393674 0.72 TDP1 (0.78)
SCHEMBL6513358 0.72 TDP1 (0.35)
SCHEMBL27868951 0.72 TSHR (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7030007-B2 Via-filling material and process for fabricating semiconductor integrated circuit using the material MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 2006-04-18 US disclosed
US-20050101123-A1 Via-filling material and process for fabricating semiconductor integrated circuit using the material MITSUBISHI DENKI KABUSHIKI KAISHA (JP) 2005-05-12 US disclosed