SCHEMBL585023

SCHEMBL585023

C=Cc1ccc(CC)c(CC)c1CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL28664970 0.96
SCHEMBL5278369 0.88
SCHEMBL9310273 0.88 THRB (0.33)
SCHEMBL29144410 0.85
SCHEMBL11830766 0.84 TDP1 (0.34)
SCHEMBL11215657 0.83
SCHEMBL17160046 0.83
SCHEMBL4079128 0.83 TYR (0.37)
SCHEMBL9310057 0.82 THRB (0.33)
SCHEMBL59712 0.81 GABRA1 (0.41)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 467 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119242118-A Method for preparing GMA (GMA-type acrylic resin) for powder coating in biomass solvent 安徽工程大学 2025-01-03 CN claimed
CN-116640260-A Anti-indentation acrylic resin and synthetic method thereof 六安捷通达新材料有限公司 2023-08-25 CN claimed
CN-116515050-A High heat-resistant carboxyl acrylic resin for powder coating and synthetic method thereof 安徽科瑞达新材料有限公司 2023-08-01 CN claimed
CN-115167078-A Positive photoresist composition, cured film and synthesis method thereof 漳州思美科新材料有限公司 2022-10-11 CN claimed
CN-113671795-B Positive photoresist composition with high residual film rate, synthetic method and cured film thereof 深圳迪道微电子科技有限公司 2022-05-24 CN claimed
CN-113671795-A High residual film rate positive photoresist composition and its synthesis method and cured film 深圳迪道微电子科技有限公司 2021-11-19 CN claimed
CN-113641081-A High-adhesion positive photoresist composition, synthesis method thereof and cured film 深圳迪道微电子科技有限公司 2021-11-12 CN claimed
EP-1627664-A1 Hair styling composition comprising adhesive particles and non-adhesive particles L'OREAL (FR) 2006-02-22 EP claimed
US-20060024255-A1 Hair styling compositions comprising adhesive particles and non-adhesive particles L'ORÉAL (FR) 2006-02-02 US claimed
EP-4749682-A1 CURABLE COMPOSITION, FILM FORMING METHOD, AND METHOD FOR PRODUCING ARTICLE Canon Kabushiki Kaisha (JP) 2026-05-27 EP disclosed
CN-122071546-A Curable composition, film forming method, and method for producing product 佳能株式会社 2026-05-22 CN disclosed
US-20260140445-A1 CURABLE COMPOSITION AND METHODS FOR FORMING FILM AND MANUFACTURING ARTICLE CANON KK (JP) 2026-05-21 US disclosed
EP-4743311-A1 PHENOL-FREE, HEAT-SENSITIVE RECORDING MATERIAL Oji Holdings Corporation (JP) 2026-05-20 EP disclosed
US-12629718-B2 Film forming method and article manufacturing method CANON KABUSHIKI KAISHA (JP) 2026-05-19 US disclosed
US-4933253-A EASE OF CLEANING FUJI XEROX CO., LTD. (JP) 1990-06-12 US disclosed
US-4929528-A TRIFLUOROETHYLENE-VINYLIDENE FLUORIDE COPOLYMER, ELECTROGRAPHY FUJI XEROX CO., LTD. (JP) 1990-05-29 US disclosed
US-4868083-A Developer carrier and process for producing the same FUJI XEROX CO., LTD. (JP) 1989-09-19 US disclosed
US-4791041-A FLUORINATED ALKYL (METH)ARYLATE COPOLYMER OVERCOATINGS; ANTISOILANTS; ANTISTICKING AGENTS FUJI XEROX CO., LTD. (JP) 1988-12-13 US disclosed
EP-0283938-A1 Silver halide color photographic material Fuji Photo Film Co., Ltd. (JP) 1988-09-28 EP disclosed
EP-0248421-A2 Carrier for developer FUJI XEROX CO., LTD. (JP) 1987-12-09 EP disclosed