SCHEMBL5859486

SCHEMBL5859486

CCC(C=C(C)C(=O)OC)(OC)OC

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33
TET2 Q6N021 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5859477 1.00 ALDH1A1 (0.33) ALDH1A1TET2
SCHEMBL9704439 0.82 APEX1 (0.30)
Hydrogen Sulfide SCHEMBL29138303 0.80
SCHEMBL7112084 0.79 ALDH1A1 (0.36) ALDH1A1TET2
SCHEMBL28596124 0.78 ALDH1A1 (0.34) ALDH1A1TET2
SCHEMBL8199751 0.74 ALDH1A1 (0.32) ALDH1A1TET2
SCHEMBL28592129 0.74
SCHEMBL28990015 0.73 ALDH1A1 (0.31) ALDH1A1TET2
SCHEMBL11032462 0.72 ALDH1A1 (0.40) ALDH1A1TET2
SCHEMBL8941587 0.70 ALDH1A1 (0.39) ALDH1A1TET2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1457527-B1 CURABLE COMPOSITION, SEALING MATERIAL, AND ADHESIVE SEKISUI CHEMICAL CO LTD (JP) 2013-03-27 EP disclosed
US-7135518-B2 Curable compositions, sealing material, and adhesive SEKISUI CHEMICAL CO., LTD. (JP) 2006-11-14 US disclosed
US-20050261412-A1 Curable compositions, sealing material, and adhesive SEKISUI CHEMICAL CO., LTD. (JP) 2005-11-24 US disclosed
EP-1457527-A1 CURABLE COMPOSITIONS, SEALING MATERIAL, AND ADHESIVE SEKISUI CHEMICAL CO., LTD. (JP) 2004-09-15 EP disclosed