SCHEMBL587512

SCHEMBL587512

C=COCc1ccccc1C#N

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FFAR1 O14842 1/20 0.41
PLAU P00749 1/20 0.40
RAB9A P51151 3/20 0.40
KMT2A Q03164 3/20 0.40
NPC1 O15118 2/20 0.40
MEN1 O00255 1/20 0.40
ALDH1A1 P00352 5/20 0.40
KDM4E B2RXH2 2/20 0.40
CYP19A1 P11511 1/20 0.39
TSHR P16473 1/20 0.39
MAPT P10636 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
TDP1 Q9NUW8 2/20 0.38
CASP3 P42574 1/20 0.38
SENP8 Q96LD8 1/20 0.38
SENP7 Q9BQF6 1/20 0.38
SENP6 Q9GZR1 1/20 0.38
HTT P42858 1/20 0.37
MAOB P27338 1/20 0.37
TACR1 P25103 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL514414 0.81 FFAR1 (0.44) FFAR1PLAURAB9AKMT2ANPC1
SCHEMBL9363502 0.81 FFAR1 (0.41) FFAR1PLAURAB9AKMT2ANPC1
SCHEMBL29728038 0.80 IDO1 (0.38) KMT2AMEN1ALDH1A1KDM4ETSHR
SCHEMBL8602403 0.80 IDO1 (0.38) KMT2AMEN1ALDH1A1KDM4ETSHR
SCHEMBL515209 0.79 FFAR1 (0.44) FFAR1PLAURAB9AKMT2ANPC1
SCHEMBL515210 0.79 ALDH1A1 (0.48) FFAR1PLAURAB9AKMT2ANPC1
SCHEMBL6668462 0.78 FFAR1 (0.46) FFAR1PLAURAB9AKMT2ANPC1
SCHEMBL3156172 0.76 FFAR1 (0.42) FFAR1PLAURAB9AKMT2ANPC1
SCHEMBL6517065 0.75 ALDH1A1 (0.50) FFAR1RAB9AKMT2ANPC1ALDH1A1
SCHEMBL2162474 0.75 GABRA1 (0.42) FFAR1ALDH1A1KDM4ECYP19A1TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2078607-B1 PROCESS FOR PRODUCING A METAL FILM COATED MATERIAL, PROCESS FOR PRODUCING A METALLIC PATTERN BEARING MATERIAL AND USE OF A COMPOSITION FOR POLYMER LAYER FORMATION FUJIFILM CORP (JP) 2018-09-12 EP disclosed
EP-2236647-B1 PROCESS FOR ADSORBING PLATING CATALYSTS, PROCESS FOR PRODUCTION OF SUBSTRATES PROVIDED WITH METAL LAYERS AND PLATING CATALYST CONTAINING FLUID FOR USE IN BOTH PROCESSES FUJIFILM CORP (JP) 2018-02-21 EP disclosed
EP-2247171-B1 METAL-CLAD SUBSTRATE, AND METHOD FOR PRODUCTION THEREOF FUJIFILM CORP (JP) 2015-04-22 EP disclosed
CN-103588930-A Nitrile group-containing polymer, method for synthesizing same, composition using nitrile group-containing polymer, and laminate FUJIFILM CORP 2014-02-19 CN disclosed
CN-101528458-B Surface metal film material and method for producing same, metal mold material and method for producing same, composition for forming polymer layer, nitrile group-containing polymer and method for synthesizing same, composition using nitrile group-containing polymer, and laminate FUJIFILM CORP 2013-10-30 CN disclosed
CN-101911844-B Metal-clad substrate, and method for production thereof FUJI PHOTO FILM CO LTD 2012-11-14 CN disclosed
CN-101652247-B Conductive substance-adsorbing resin film, method for producing conductive substance-adsorbing resin film, resin film with metal layer using same, and method for producing resin film with metal layer FUJI PHOTO FILM CO LTD 2012-11-07 CN disclosed
CN-101910461-B Plating method, method for forming metal thin film, and plating catalyst liquid FUJIFILM CORP 2012-10-31 CN disclosed
CN-101910462-B Adsorption method of plating catalyst, and method for manufacturing substrate coated with metal layer FUJI PHOTO FILM CO LTD 2012-09-26 CN disclosed
US-8273463-B2 Multilayer film for plating, method of manufacturing metal film-coated material and metal film-coated material FUJIFILM CORPORATION (JP) 2012-09-25 US disclosed
US-20100113264-A1 CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METHOD FOR PRODUCING CONDUCTIVE SUBSTANCE-ADSORBING RESIN FILM, METAL LAYER-COATED RESIN FILM USING THE SAME, AND METHOD FOR PRODUCING METAL LAYER-COATED RESIN FILM FUJIFILM CORPORATION (JP) 2010-05-06 US disclosed
CN-101652247-A Conductive substance-adsorbing resin film, method for producing conductive substance-adsorbing resin film, resin film with metal layer using same, and method for producing resin film with metal layer FUJIFILM CORP JP 2010-02-17 CN disclosed
US-20100003533-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2010-01-07 US disclosed
EP-2133200-A1 CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, PROCESS FOR PRODUCING CONDUCTIVE-SUBSTANCE-ADSORBING RESIN FILM, METAL-LAYER-COATED RESIN FILM MADE FROM THE SAME, AND PROCESS FOR PRODUCING METAL-LAYER-COATED RESIN FILM Fujifilm Corporation (JP) 2009-12-16 EP disclosed
US-20090269599-A1 MULTILAYER FILM FOR PLATING, METHOD OF MANUFACTURING METAL FILM-COATED MATERIAL AND METAL FILM-COATED MATERIAL FUJIFILM CORPORATION (JP) 2009-10-29 US disclosed
EP-2105451-A2 Nitrile group-containing polymer and method of synthesizing the same, composition containing nitrile group-containing polymer, and laminate Fujifilm Corporation (JP) 2009-09-30 EP disclosed
CN-101528458-A Surface metal film material and method for producing same, metal mold material and method for producing same, composition for forming polymer layer, nitrile group-containing polymer and method for synthesizing same, composition using nitrile group-containing polymer, and laminate FUJIFILM CORP (JP) 2009-09-09 CN disclosed
US-20090214876-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE GROUP-CONTAINING POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE GROUP-CONTAINING POLYMER, AND LAMINATE FUJIFILM CORPORATION (JP) 2009-08-27 US disclosed
EP-2078607-A1 METAL-FILM-COATED MATERIAL AND PROCESS FOR PRODUCING THE SAME, METALLIC-PATTERN-BEARING MATERIAL AND PROCESS FOR PRODUCING THE SAME, COMPOSITION FOR POLYMER LAYER FORMATION, NITRILE POLYMER AND METHOD OF SYNTHESIZING THE SAME, COMPOSITION CONTAINING NITRILE POLYMER, AND LAYERED PRODUCT FUJIFILM Corporation (JP) 2009-07-15 EP disclosed
US-20090155553-A1 Method of manufacturing surface metal film material, surface metal film material, method of manufacturing patterned metal material, patterned metal material, and polymer layer-forming composition FUJIFILM CORPORATION (JP) 2009-06-18 US disclosed