SCHEMBL598490

SCHEMBL598490

CCCC(OC)OC(=O)OOC(=O)OC(CCC)OC

nearest known ligand 0.34

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CHRM1 P11229 1/20 0.34
AKR1A1 P14550 1/20 0.34
CHRM3 P20309 1/20 0.34
HTR2A P28223 1/20 0.34
HTR2C P28335 1/20 0.34
ADRA1A P35348 1/20 0.34
HRH1 P35367 1/20 0.34
DRD3 P35462 1/20 0.34
SLC6A3 Q01959 1/20 0.34
HDAC1 Q13547 1/20 0.34
HDAC2 Q92769 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
CYP3A4 P08684 2/20 0.33
TSHR P16473 2/20 0.33
NFKB1 P19838 2/20 0.33
NPSR1 Q6W5P4 2/20 0.33
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31
HDAC7 Q8WUI4 1/20 0.31
HDAC8 Q9BY41 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10277388 0.92 CHRM1 (0.34) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL1470258 0.91 CHRM1 (0.37) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL1128339 0.89 HDAC7 (0.37) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL1470222 0.83 ALDH1A1 (0.46) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL159210 0.80 TSHR (0.39) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL14905761 0.80 CHRM1 (0.41) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL7928839 0.79 LMNA (0.33) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL1469562 0.79 ALDH1A1 (0.44) TDP1TSHRCA1CA2
SCHEMBL17453517 0.78 ALDH1A1 (0.36) CHRM1AKR1A1CHRM3HTR2AHTR2C
SCHEMBL9182303 0.78 CHRM1 (0.34) CHRM1AKR1A1CHRM3HTR2AHTR2C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120175790-A1 COMPOSITION FOR PATTERNABLE ADHESIVE FILM, PATTERNABLE ADHESIVE FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-07-12 US claimed
CN-114302910-B Foam and method for producing foam 积水化学工业株式会社 2024-03-01 CN disclosed
CN-114341240-B Foam and method for producing foam 积水化学工业株式会社 2023-04-21 CN disclosed
WO-2022181389-A1 METHOD FOR PRODUCING MODIFIED CONJUGATED DIENE POLYMER LATEX 日本ゼオン株式会社 2022-09-01 WO disclosed
CN-107001762-B Acrylic resin composition and laminate obtained by laminating the same 株式会社艾迪科 2022-08-09 CN disclosed
CN-108148335-A Resin composition, film and circuit board using the same 臻鼎科技股份有限公司 2018-06-12 CN disclosed
US-9868878-B2 Adhesive composition and display device SAMSUNG DISPLAY CO., LTD. (KR) 2018-01-16 US disclosed
US-20170022393-A1 ADHESIVE COMPOSITION AND DISPLAY DEVICE SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION (KR) 2017-01-26 US disclosed
US-20120175790-A1 COMPOSITION FOR PATTERNABLE ADHESIVE FILM, PATTERNABLE ADHESIVE FILM, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-07-12 US disclosed
US-8120189-B2 Wiring terminal-connecting adhesive HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-02-21 US disclosed
US-7777335-B2 Wiring structure having a wiring-terminal-connecting adhesive comprising silicone particles HITACHI CHEMICAL COMPANY, LTD. (JP) 2010-08-17 US disclosed
US-20090101279-A1 ADHESIVE, METHOD OF CONNECTING WIRING TERMINALS AND WIRING STRUCTURE ARIFUKI MOTOHIRO 2009-04-23 US disclosed
US-7241644-B2 Adhesive, method of connecting wiring terminals and wiring structure HITACHI CHEMICAL COMPANY, LTD. (JP) 2007-07-10 US disclosed
EP-1229095-B1 ADHESIVE AGENT, METHOD FOR CONNECTING WIRING TERMINALS AND WIRING STRUCTURE HITACHI CHEMICAL CO LTD (JP) 2006-10-18 EP disclosed
US-6939913-B1 Adhesive agent, method of connecting wiring terminals and wiring structure HITACHI CHEMICAL COMPANY, LTD. (JP) 2005-09-06 US disclosed
US-20050178502-A1 Adhesive, method of connecting wiring terminals and wiring structure ARIFUKU MOTOHIRO (JP) 2005-08-18 US disclosed
EP-1229095-A1 ADHESIVE AGENT, METHOD FOR CONNECTING WIRING TERMINALS AND WIRING STRUCTURE HITACHI CHEMICAL COMPANY, LTD. (JP) 2002-08-07 EP disclosed
US-5789499-A RETAINING EFFECT OF ANTIFOULING AGENT IN A COATED POLYMERIZATION REACTOR MITSUI CHEMICALS, INC. (JP) 1998-08-04 US disclosed
EP-0351814-A2 Poly (N-cyclic iminoether), processes for production thereof, thermosetting composition containing it and thermoset resin TEIJIN LIMITED (JP) 1990-01-24 EP disclosed
EP-0336390-A2 Process for producing thermoset resin TEIJIN LIMITED (JP) 1989-10-11 EP disclosed