SCHEMBL6003225

SCHEMBL6003225

O=C(O)c1c(C(=O)O)c(C(=O)O)c2c(ccc3ccccc32)c1C(=O)O

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 6/20 0.52
HSD17B10 Q99714 6/20 0.52
KDM4E B2RXH2 6/20 0.52
ALDH1A1 P00352 5/20 0.52
MEN1 O00255 2/20 0.52
KMT2A Q03164 2/20 0.52
GLA P06280 2/20 0.52
CYP1A2 P05177 1/20 0.52
CYP2C19 P33261 1/20 0.52
WDR5 P61964 1/20 0.48
LDHA P00338 1/20 0.47
NR4A1 P22736 1/20 0.47
NR4A2 P43354 1/20 0.47
NR4A3 Q92570 1/20 0.47
CDC25B P30305 1/20 0.46
METAP2 P50579 2/20 0.44
METAP1 P53582 1/20 0.44
HPRT1 P00492 1/20 0.43
L3MBTL1 Q9Y468 3/20 0.42
CSNK2A2 P19784 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7813457 0.89 HPGD (0.52) HPGDHSD17B10KDM4EALDH1A1MEN1
SCHEMBL17200968 0.83 HPGD (0.50) HPGDHSD17B10KDM4EALDH1A1MEN1
SCHEMBL28774020 0.80 MEN1 (0.49) HPGDHSD17B10KDM4EALDH1A1MEN1
SCHEMBL275486 0.80 KMT2A (0.53) HPGDHSD17B10KDM4EALDH1A1MEN1
SCHEMBL7101315 0.78 ALDH1A1 (0.52) HPGDHSD17B10KDM4EALDH1A1MEN1
SCHEMBL1666954 0.78 L3MBTL1 (0.55) HPGDHSD17B10KDM4EALDH1A1MEN1
SCHEMBL547734 0.76 ERN1 (0.47) HPGDHSD17B10KDM4EALDH1A1MEN1
SCHEMBL547733 0.76 ERN1 (0.47) HPGDHSD17B10KDM4EALDH1A1MEN1
SCHEMBL54422 0.76 KDM4E (0.58) HPGDHSD17B10KDM4EALDH1A1MEN1
SCHEMBL27880221 0.76 MEN1 (0.55) HPGDHSD17B10KDM4EALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113402882-B Composition for forming release layer 日产化学工业株式会社 2024-02-06 CN disclosed
WO-2023112764-A1 RELEASE LAYER-FORMING COMPOSITION AND RELEASE LAYER 日産化学株式会社 2023-06-22 WO disclosed
CN-115734871-A Low dielectric constant, low dissipation factor laminate comprising aerogel layer 蓝移材料有限公司 2023-03-03 CN disclosed
CN-112368108-B Adhesive tape for glass processing 古河电气工业株式会社 2022-11-04 CN disclosed
CN-109153852-B Composition for forming release layer and release layer 日产化学株式会社 2022-07-05 CN disclosed
CN-111133073-B Composition for forming temporary adhesive layer and temporary adhesive layer 日产化学株式会社 2022-06-03 CN disclosed
CN-109563341-B Composition for forming release layer for transparent resin substrate 日产化学株式会社 2022-05-31 CN disclosed
CN-109476913-B Composition for forming release layer 日产化学株式会社 2022-03-01 CN disclosed
CN-110099974-B Composition for forming protective layer on substrate 日产化学株式会社 2022-02-25 CN disclosed
CN-111423813-B Composition for forming release layer and release layer 日产化学工业株式会社 2021-11-23 CN disclosed
CN-105339416-B Polyimides, resin film and metallic cover layered product 新日铁住金化学株式会社 2017-07-14 CN disclosed
CN-106019841-A Photosensitive resin composition, pattern forming method, cured film, insulation film, color filter and display device 东京应化工业株式会社 2016-10-12 CN disclosed
US-7092608-B2 Polyimide optical materials, polyimide precursor solutions and optical waveguide elements KABUSHIKI KAISHA TOSHIBA (JP) 2006-08-15 US disclosed
US-7082244-B2 Polyimide optical materials, polyimide precursor solutions and optical waveguide elements KABUSHIKI KAISHA TOSHIBA (JP) 2006-07-25 US disclosed
US-20060159413-A1 POLYIMIDE OPTICAL MATERIALS, POLYIMIDE PRECURSOR SOLUTIONS AND OPTICAL WAVEGUIDE ELEMENTS KABUSHIKI KAISHA TOSHIBA (JP) 2006-07-20 US disclosed
US-20040197064-A1 Polyimide optical materials, polyimide precursor solutions and optical waveguide elements KABUSHIKI KAISHA TOSHIBA (JP) 2004-10-07 US disclosed
EP-0349010-A1 Polyimide copolymers NIPPON STEEL CHEMICAL CO., LTD. (JP) 1990-01-03 EP disclosed
EP-0330505-A1 Process for preparing polyimides MITSUI TOATSU CHEMICALS, Inc. (JP) 1989-08-30 EP disclosed
EP-0243507-A1 FLEXIBLE LAMINATE FOR PRINTED CIRCUIT BOARD AND PROCESS FOR ITS PRODUCTION MITSUI TOATSU CHEMICALS, Inc. (JP) 1987-11-04 EP disclosed
EP-0196939-A1 Process for enhancing the properties of a polymeric material chosen among polyimides or polyamides-imides SOCIETE NATIONALE ELF AQUITAINE (FR) 1986-10-08 EP disclosed