SCHEMBL6004412

SCHEMBL6004412

Oc1cccc(O)c1C1CCCCC1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC4 P56524 1/20 0.50
HDAC2 Q92769 1/20 0.50
HDAC8 Q9BY41 1/20 0.50
CHRNB2 P17787 1/20 0.41
CHRNA4 P43681 1/20 0.41
CNR1 P21554 6/20 0.41
CNR2 P34972 5/20 0.41
KMO O15229 1/20 0.40
PPIA P62937 1/20 0.40
ALDH1A1 P00352 3/20 0.39
ALOX15 P16050 2/20 0.39
LMNA P02545 2/20 0.39
HPGD P15428 2/20 0.39
ACMSD Q8TDX5 1/20 0.39
KDM4E B2RXH2 1/20 0.39
NPC1 O15118 1/20 0.39
HTT P42858 1/20 0.39
RAB9A P51151 1/20 0.39
ESR1 P03372 1/20 0.39
ESR2 Q92731 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7531576 1.00 HDAC4 (0.50) HDAC4HDAC2HDAC8CHRNB2CHRNA4
SCHEMBL3169205 0.98 HDAC4 (0.52) HDAC4HDAC2HDAC8CHRNB2CHRNA4
SCHEMBL4961704 0.87 CHRNB2 (0.53) HDAC4HDAC2HDAC8CHRNB2CHRNA4
SCHEMBL4961639 0.87 CHRNB2 (0.53) HDAC4HDAC2HDAC8CHRNB2CHRNA4
SCHEMBL4958023 0.87 CHRNB2 (0.53) HDAC4HDAC2HDAC8CHRNB2CHRNA4
SCHEMBL4962002 0.87 CHRNB2 (0.53) HDAC4HDAC2HDAC8CHRNB2CHRNA4
SCHEMBL901458 0.87 CHRNB2 (0.53) HDAC4HDAC2HDAC8CHRNB2CHRNA4
SCHEMBL15994822 0.86 TSHR (0.43) HDAC4HDAC2HDAC8CHRNB2CHRNA4
SCHEMBL4973664 0.86 HDAC2 (0.43) HDAC4HDAC2HDAC8CHRNB2CHRNA4
SCHEMBL7869684 0.86 TRPA1 (0.48) HDAC4HDAC2HDAC8CHRNB2CHRNA4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112592448-B Mixed alkylresorcinol modified cardanol-formaldehyde adhesive resin, preparation method thereof, rubber composition and rubber product 北京彤程创展科技有限公司 2022-06-24 CN claimed
CN-112592447-A Mixed alkylresorcinol modified adhesive resin, preparation method thereof, rubber composition and rubber product 北京彤程创展科技有限公司 2021-04-02 CN claimed
CN-112592448-A Mixed alkylresorcinol modified cardanol-formaldehyde adhesive resin, preparation method thereof, rubber composition and rubber product 北京彤程创展科技有限公司 2021-04-02 CN claimed
US-20250090554-A1 A METHOD OF TREATING DEPRESSION BY IMMUNE MODULATION MYND LIFE SCIENCES INC (CA) 2025-03-20 US disclosed
CN-112592448-B Mixed alkylresorcinol modified cardanol-formaldehyde adhesive resin, preparation method thereof, rubber composition and rubber product 北京彤程创展科技有限公司 2022-06-24 CN disclosed
CN-112521666-B Rubber composition, preparation method thereof and rubber product 北京彤程创展科技有限公司 2022-04-12 CN disclosed
CN-112592447-B Mixed alkylresorcinol modified adhesive resin, preparation method thereof, rubber composition and rubber product 北京彤程创展科技有限公司 2022-02-11 CN disclosed
CN-112592447-A Mixed alkylresorcinol modified adhesive resin, preparation method thereof, rubber composition and rubber product 北京彤程创展科技有限公司 2021-04-02 CN disclosed
CN-112592448-A Mixed alkylresorcinol modified cardanol-formaldehyde adhesive resin, preparation method thereof, rubber composition and rubber product 北京彤程创展科技有限公司 2021-04-02 CN disclosed
CN-112521666-A Rubber composition, preparation method thereof and rubber product 北京彤程创展科技有限公司 2021-03-19 CN disclosed
CN-105143394-B Resin composition, injection agent, and filling method 住友电木株式会社 2018-05-29 CN disclosed
CN-1284520-A Arylester compound and its prep, epoxy resin composition using the compound and copper-coated laminated SUMITOMO CHEMICAL CO (JP) 2001-02-21 CN disclosed
CN-1060771-C Aryl ester compound, process for producing the same, epoxy resin composition using the same, and copper-clad laminate using the same SUMITOMO CHEMICAL CO (JP) 2001-01-17 CN disclosed
EP-0811619-B1 Novel ester compound and thermosetting resin composition using the same SUMITOMO CHEMICAL CO (JP) 2000-09-27 EP disclosed
US-5916683-A Copper-clad laminate with prepreg of epoxy resin and aryl ester SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1999-06-29 US disclosed
US-5726257-A Esterified resorcinol-carbonyl compound condensates and epoxy resins therewith SUMITOMO CHEMICAL COMPANY, LTD. (JP) 1998-03-10 US disclosed
CN-1170710-A Novel ester compound and themrosetting resin composition using the same SUMITOMO CHEMICAL CO (JP) 1998-01-21 CN disclosed
EP-0811619-A1 Novel ester compound and thermosetting resin composition using the same SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1997-12-10 EP disclosed
CN-1125218-A Novel aryl ester compound, process for producing the same, epoxy resin composition using the same, and copper-clad laminate using the same SUMITOMO CHEMICAL CO (JP) 1996-06-26 CN disclosed
EP-0699670-A2 Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1996-03-06 EP disclosed