Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LTA4H | P09960 | 3/20 | 0.52 |
| ▸ | FAAH | O00519 | 1/20 | 0.50 |
| ▸ | MGLL | Q99685 | 1/20 | 0.50 |
| ▸ | TSHR | P16473 | 3/20 | 0.46 |
| ▸ | CYP3A4 | P08684 | 2/20 | 0.46 |
| ▸ | MAPK1 | P28482 | 2/20 | 0.46 |
| ▸ | TP53 | P04637 | 1/20 | 0.46 |
| ▸ | LMNA | P02545 | 2/20 | 0.44 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.44 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.44 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.44 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.44 |
| ▸ | NR5A1 | Q13285 | 1/20 | 0.44 |
| ▸ | MEN1 | O00255 | 2/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.43 |
| ▸ | NR1I2 | O75469 | 1/20 | 0.43 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.43 |
| ▸ | ADRA2A | P08913 | 1/20 | 0.43 |
| ▸ | MAPT | P10636 | 1/20 | 0.43 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29372736 | 0.98 | FAAH (0.53) | LTA4HFAAHMGLLTSHRCYP3A4 | |
| SCHEMBL29566536 | 0.98 | FAAH (0.53) | LTA4HFAAHMGLLTSHRCYP3A4 | |
| SCHEMBL29371689 | 0.98 | FAAH (0.53) | LTA4HFAAHMGLLTSHRCYP3A4 | |
| SCHEMBL2916883 | 0.98 | FAAH (0.53) | LTA4HFAAHMGLLTSHRCYP3A4 | |
| SCHEMBL19583374 | 0.98 | FAAH (0.53) | LTA4HFAAHMGLLTSHRCYP3A4 | |
| SCHEMBL19583354 | 0.98 | FAAH (0.53) | LTA4HFAAHMGLLTSHRCYP3A4 | |
| SCHEMBL20398511 | 0.98 | FAAH (0.53) | LTA4HFAAHMGLLTSHRCYP3A4 | |
| SCHEMBL15513545 | 0.98 | FAAH (0.53) | LTA4HFAAHMGLLTSHRCYP3A4 | |
| SCHEMBL29368569 | 0.98 | FAAH (0.53) | LTA4HFAAHMGLLTSHRCYP3A4 | |
| SCHEMBL19583360 | 0.98 | FAAH (0.53) | LTA4HFAAHMGLLTSHRCYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 179 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12560867-B2 | Photosensitive element and method for producing photosensitive element | RESONAC CORPORATION (JP) | 2026-02-24 | — | — | US | disclosed |
| EP-4692936-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | Resonac Corporation (JP) | 2026-02-11 | — | — | EP | disclosed |
| EP-4692935-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | Resonac Corporation (JP) | 2026-02-11 | — | — | EP | disclosed |
| US-20260016749-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | RESONAC CORP (JP) | 2026-01-15 | — | — | US | disclosed |
| US-20250327961-A1 | POLARIZING PLATE AND OPTICAL DISPLAY APPARATUS | Wuxi Hengxin Optoelectronic Materials Co., Ltd. (CN) | 2025-10-23 | — | — | US | disclosed |
| US-20250278024-A1 | PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | RESONAC CORPORATION (JP) | 2025-09-04 | — | — | US | disclosed |
| WO-2025126273-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 株式会社レゾナック | 2025-06-19 | — | — | WO | disclosed |
| WO-2025127002-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR PRODUCING PRINTED WIRING BOARD | 株式会社レゾナック | 2025-06-19 | — | — | WO | disclosed |
| CN-120077329-A | Photosensitive resin composition, photosensitive resin laminate, and method for forming resist pattern | 旭化成株式会社 | 2025-05-30 | — | — | CN | disclosed |
| CN-119937243-A | Chemically amplified positive photosensitive resin composition, cured film, and element having cured film | 奇美实业股份有限公司 | 2025-05-06 | — | — | CN | disclosed |
| US-20140071379-A1 | POLARIZING PLATE PROTECTIVE FILM, POLARIZING PLATE, AND LIQUID CRYSTAL DISPLAY DEVICE | Konica Minolta, Inc. (JP) | 2014-03-13 | — | — | US | disclosed |
| EP-2284611-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD | HITACHI CHEMICAL CO LTD (JP) | 2013-11-20 | — | — | EP | disclosed |
| CN-103180784-A | Photosensitive composition, cured film formed from same, and element having cured film | TORAY INDUSTRIES | 2013-06-26 | — | — | CN | disclosed |
| US-8460853-B2 | Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-06-11 | — | — | US | disclosed |
| US-8460852-B2 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for manufacturing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-06-11 | — | — | US | disclosed |
| US-20120040290-A1 | PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-02-16 | — | — | US | disclosed |
| US-20110111344-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-05-12 | — | — | US | disclosed |
| US-20110081616-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-04-07 | — | — | US | disclosed |
| EP-2284611-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD | Hitachi Chemical Company, Ltd. (JP) | 2011-02-16 | — | — | EP | disclosed |
| EP-2278396-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | Hitachi Chemical Company, Ltd. (JP) | 2011-01-26 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-12560867-B2 | Photosensitive element and method for producing photosensitive element | TERB1, PRDM9, PRPF8 | LTA4H 3944/4885FAAH 4588/4885MGLL 4497/4885 |
| US-20260016749-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD | CD79B, KDM2B, RARB | LTA4H 784/4885FAAH 3964/4885MGLL 4209/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.