SCHEMBL602106

SCHEMBL602106

Cc1cccc(-c2c3ccccc3nc3ccccc23)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 3/20 0.56
NPC1 O15118 2/20 0.56
RAB9A P51151 2/20 0.56
NR1I3 Q14994 2/20 0.56
ESR1 P03372 3/20 0.56
ESR2 Q92731 3/20 0.56
TSHR P16473 3/20 0.54
ALDH1A1 P00352 2/20 0.54
MAPK1 P28482 1/20 0.54
SMN1; SMN2 Q16637 3/20 0.52
ABCB1 P08183 1/20 0.50
MAPT P10636 1/20 0.50
ABCG2 Q9UNQ0 1/20 0.50
HPGD P15428 2/20 0.49
HTT P42858 1/20 0.49
NPSR1 Q6W5P4 1/20 0.49
MEN1 O00255 2/20 0.48
GAA P10253 1/20 0.48
TP53 P04637 1/20 0.48
NQO2 P16083 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29446786 1.00 KMT2A (0.56) KMT2ANPC1RAB9ANR1I3ESR1
SCHEMBL28193791 0.85 ESR1 (0.55) KMT2ANPC1RAB9ANR1I3ESR1
SCHEMBL29499034 0.85 ENPP1 (0.47) KMT2ANPC1RAB9ANR1I3ESR1
SCHEMBL20809931 0.84 CNR1 (0.49) KMT2ANPC1RAB9ANR1I3TSHR
SCHEMBL488939 0.84 ACHE (0.50) KMT2ANPC1RAB9ANR1I3TSHR
SCHEMBL28361368 0.84 ESR1 (0.64) KMT2AESR1ESR2ALDH1A1MAPT
SCHEMBL27873018 0.84 ESR1 (0.64) KMT2ANPC1RAB9AESR1ESR2
SCHEMBL29274261 0.82 ESR1 (0.61) KMT2ANPC1RAB9AESR1ESR2
SCHEMBL28159697 0.82 KMT2A (0.50) KMT2ANPC1RAB9ANR1I3ESR1
SCHEMBL29660599 0.81 ESR1 (0.49) KMT2ANPC1RAB9ANR1I3ESR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 169 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113801291-B Photosensitive resin composition, photosensitive dry film resist and manufacturing method of PCB 杭州福斯特电子材料有限公司 2023-05-12 CN claimed
CN-113174040-B Photopolymerizable monomer and high-resolution high-adhesion LDI dry film resist composed of photopolymerizable monomer 杭州福斯特电子材料有限公司 2022-05-17 CN claimed
CN-110357989-B Tertiary amine photosensitizer, preparation method thereof, photosensitive resin composition containing tertiary amine photosensitizer and application of photosensitive resin composition 常州强力电子新材料股份有限公司 2022-04-22 CN claimed
CN-114114837-A Dry film resist and preparation method thereof 杭州福斯特电子材料有限公司 2022-03-01 CN claimed
CN-113801291-A Photosensitive resin composition, photosensitive dry film resist and manufacturing method of PCB 浙江福斯特新材料研究院有限公司 2021-12-17 CN claimed
CN-108241259-B Resist composition with good hole masking function and capable of directly depicting, exposing and imaging 杭州福斯特电子材料有限公司 2021-08-10 CN claimed
CN-113174040-A Photopolymerizable monomer and high-resolution high-adhesion LDI dry film resist formed by same 浙江福斯特新材料研究院有限公司 2021-07-27 CN claimed
CN-111752097-A Self-luminous photosensitive resin composition, color filter and image display device 常州强力电子新材料股份有限公司 2020-10-09 CN claimed
CN-111752098-A Self-luminous photosensitive resin composition, color filter and image display device 常州强力电子新材料股份有限公司 2020-10-09 CN claimed
CN-111752100-A Photosensitive resin composition containing bisimidazole photoinitiator, application thereof, color filter and image display device 常州强力电子新材料股份有限公司 2020-10-09 CN claimed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US claimed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US claimed
WO-2026105768-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN 株式会社レゾナック 2026-05-21 WO disclosed
EP-3584242-B1 FLUORENYLAMINOKETONE PHOTOINITIATOR, PREPARATION METHOD THEREOF AND UV PHOTOCURABLE COMPOSITION CONTAINING SAME CHANGZHOU TRONLY ADVANCED ELECTRONIC MAT CO LTD (CN) 2026-04-08 EP disclosed
EP-4067998-B1 EO/PO MODIFIED 9-PHENYLACRIDINE PHOTOSENSITIZERS FOR USE IN PHOTOSENSITIVE RESINS IN THE MANUFACTURE OF PRINTED CIRCUIT BOARDS CHANGZHOU TRONLY NEW ELECTRONIC MAT CO LTD (CN) 2025-11-12 EP disclosed
US-20250278024-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2025-09-04 US disclosed
US-20100159691-A1 PHOTOSENSITIVE RESIN COMPOSITION AND LAMINATE ASAHI KASEI EMD CORPORATION (JP) 2010-06-24 US disclosed
CN-101525392-A 9-phenylacridine photoinitiator and preparation method thereof UNIV JIANGSU POLYTECHNIC 2009-09-09 CN disclosed
US-5346805-A Initiator comprising an onium compound and an acridine derivative; printing plate, resist, photomask FUJI PHOTO FILM CO., LTD. (JP) 1994-09-13 US disclosed
US-4587200-A Photopolymerizable composition comprising an acridine and a heterocyclic thiol compound as a photopolymerization initiator and a photographic process using said photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1986-05-06 US disclosed