SCHEMBL6048965

SCHEMBL6048965

CC[Si](Br)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6048980 0.73
SCHEMBL1224948 0.71
SCHEMBL31388307 0.71
SCHEMBL6048713 0.69 LMNA (0.34)
SCHEMBL6048757 0.69
SCHEMBL6048800 0.67 LMNA (0.38)
SCHEMBL6048892 0.66 LMNA (0.41)
SCHEMBL6048898 0.66 LMNA (0.41)
SCHEMBL31388313 0.65
SCHEMBL6048748 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114402036-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2023-11-21 CN disclosed
CN-116981751-A Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device 琳得科株式会社 2023-10-31 CN disclosed
CN-113574117-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2023-09-12 CN disclosed
CN-113574116-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2023-02-28 CN disclosed
CN-112739775-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-11-01 CN disclosed
CN-112739776-B Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-10-28 CN disclosed
WO-2022209064-A1 ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE リンテック株式会社 2022-10-06 WO disclosed
CN-115151611-A Curable composition, cured product, and method for using curable composition 琳得科株式会社 2022-10-04 CN disclosed
CN-115124973-A Adhesive paste, method for using adhesive paste, and method for manufacturing semiconductor device 琳得科株式会社 2022-09-30 CN disclosed
WO-2022202846-A1 ADHESIVE PASTE, METHOD FOR USING ADHESIVE PASTE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE リンテック株式会社 2022-09-29 WO disclosed
US-9540490-B2 Curable composition, curing product, and method for using curable composition LINTEC CORPORATION (JP) 2017-01-10 US disclosed
US-20160229961-A1 CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION LINTEC CORPORATION (JP) 2016-08-11 US disclosed
US-20160208054-A1 CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION LINTEC CORPORATION (JP) 2016-07-21 US disclosed
EP-3034543-A1 CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION Lintec Corporation (JP) 2016-06-22 EP disclosed
EP-3034560-A1 CURABLE COMPOSITION, CURING PRODUCT, AND METHOD FOR USING CURABLE COMPOSITION Lintec Corporation (JP) 2016-06-22 EP disclosed
US-7141634-B2 Catalyst for olefin polymerization and process for polymerizing olefins TOHO CATALYST CO., LTD. (JP) 2006-11-28 US disclosed
US-7005399-B2 Catalyst for polymerization of olefins TOHO TITANIUM CO., LTD. (JP) 2006-02-28 US disclosed
US-20050250918-A1 Catalyst for olefin polymerization and process for polymerizing olefins TOHO CATALYST CO., LTD. (JP) 2005-11-10 US disclosed
EP-1270604-A1 CATALYST FOR OLEFIN POLYMERIZATION Toho Titanium Co., Ltd. (JP) 2003-01-02 EP disclosed
US-20020193244-A1 Catalyst for olefin polymerization TOHO TITANIUM CO., LTD. (JP) 2002-12-19 US disclosed