SCHEMBL6060935

SCHEMBL6060935

CCCCCCCCCCCCCC(C)(S)C(=O)O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES2 O00748 1/20 0.44
KMT2A Q03164 2/20 0.43
MAPT P10636 1/20 0.43
GPR84 Q9NQS5 7/20 0.43
PPARG P37231 7/20 0.43
PPARD Q03181 7/20 0.43
PPARA Q07869 7/20 0.43
HDAC11 Q96DB2 5/20 0.43
TSHR P16473 4/20 0.43
PTPN1 P18031 3/20 0.43
ALDH1A1 P00352 2/20 0.43
TLR2 O60603 2/20 0.43
TDP1 Q9NUW8 2/20 0.43
FABP4 P15090 2/20 0.43
SLC22A6 Q4U2R8 1/20 0.43
SLC22A8 Q8TCC7 1/20 0.43
MEN1 O00255 1/20 0.43
ESR1 P03372 1/20 0.43
ALOX15 P16050 1/20 0.43
PDE4A P27815 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11182558 1.00 CES2 (0.44) CES2KMT2AMAPTGPR84PPARG
SCHEMBL750123 1.00 CES2 (0.44) CES2KMT2AMAPTGPR84PPARG
SCHEMBL11089307 1.00 CES2 (0.44) CES2KMT2AMAPTGPR84PPARG
SCHEMBL10495900 1.00 CES2 (0.44) CES2KMT2AMAPTGPR84PPARG
SCHEMBL679536 1.00 CES2 (0.44) CES2KMT2AMAPTGPR84PPARG
SCHEMBL11571759 0.98 CES2 (0.42) CES2KMT2AMAPTGPR84PPARG
SCHEMBL9709720 0.98 AKR1B1 (0.41) CES2KMT2AMAPTGPR84PPARG
SCHEMBL2474045 0.91 AKR1B1 (0.37) KMT2AMAPTGPR84PPARGPPARD
SCHEMBL10610882 0.89 ACLY (0.58) KMT2AMAPTPPARGPPARDPPARA
SCHEMBL10610901 0.89 ACLY (0.58) KMT2AMAPTPPARGPPARDPPARA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3144328-A1 ACRYLIC POLYMER, METHOD FOR PRODUCING SAME, AND PLASTISOL COMPOSITION INCLUDING SAID ACRYLIC POLYMER Mitsubishi Rayon Co., Ltd. (JP) 2017-03-22 EP disclosed
US-7105602-B1 Processing aid for thermoplastic resin and thermoplastic resin composition containing the same KANEKA CORPORATION (JP) 2006-09-12 US disclosed
EP-1209203-A1 PROCESSING AID FOR THERMOPLASTIC RESIN AND THERMOPLASTIC RESIN COMPOSITION CONTAINING THE SAME KANEKA CORPORATION (JP) 2002-05-29 EP disclosed
US-6242149-B1 LIGHT SENSITIVE ELEMENTS CURED WITH RADIATION, RADICAL POLYMERIZATION, PHOTOPOLYMERIZATION, ENCAPSULATION BROTHER KOGYO KABUSHIKI KAISHA (JP) 2001-06-05 US disclosed
EP-0924569-A1 Fast-curing photosensitive composition and recording sheet Brother Kogyo Kabushiki Kaisha (JP) 1999-06-23 EP disclosed