SCHEMBL6072706

SCHEMBL6072706

OCCCCCCCCCCCCCCCCN(CCO)CCO

nearest known ligand 0.38

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.38
TSHR P16473 2/20 0.38
HSD17B10 Q99714 2/20 0.38
ALDH1A1 P00352 1/20 0.38
MEN1 O00255 1/20 0.38
KMT2A Q03164 1/20 0.38
MAPT P10636 2/20 0.33
SMN1; SMN2 Q16637 2/20 0.33
GPR84 Q9NQS5 1/20 0.33
FFAR1 O14842 1/20 0.33
FFAR4 Q5NUL3 1/20 0.33
KDM4E B2RXH2 1/20 0.32
ALOX15 P16050 1/20 0.32
CYP1A2 P05177 1/20 0.30
CYP2C9 P11712 1/20 0.30
HPGD P15428 1/20 0.30
MAPK1 P28482 1/20 0.30
HIF1A Q16665 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10820949 1.00 LMNA (0.38) LMNATSHRHSD17B10ALDH1A1MEN1
SCHEMBL6072533 1.00 LMNA (0.38) LMNATSHRHSD17B10ALDH1A1MEN1
SCHEMBL14412047 1.00 LMNA (0.38) LMNATSHRHSD17B10ALDH1A1MEN1
SCHEMBL8219045 0.97 TSHR (0.37) LMNATSHRHSD17B10ALDH1A1MEN1
SCHEMBL8597780 0.97 TSHR (0.37) LMNATSHRHSD17B10ALDH1A1MEN1
SCHEMBL9312412 0.94 TSHR (0.35) LMNATSHRHSD17B10ALDH1A1MEN1
SCHEMBL7155455 0.94 TSHR (0.42) LMNATSHRHSD17B10ALDH1A1MEN1
SCHEMBL14739314 0.94 MAPT (0.37) LMNATSHRHSD17B10ALDH1A1MEN1
SCHEMBL14739160 0.94 MAPT (0.37) LMNATSHRHSD17B10ALDH1A1MEN1
SCHEMBL465348 0.94 TSHR (0.42) LMNATSHRHSD17B10ALDH1A1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 45 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7087671-B2 Recycled plastic molded parts for photosensitive materials FUJI PHOTO FILM CO., LTD. (JP) 2006-08-08 US disclosed
US-6789675-B2 Light-sensitive material package FUJI PHOTO FILM CO., LTD. (JP) 2004-09-14 US disclosed
US-6783715-B2 CRUSHING; PELLETIZATION; USING AS MOLDING MATERIALS FUJI PHOTO FILM CO., LTD. (JP) 2004-08-31 US disclosed
US-20040092612-A1 Method of recycling mold plastic parts for photosensitive material and a recycled plastic mold parts FUJI PHOTO FILM CO., LTD. (JP) 2004-05-13 US disclosed
US-20030029766-A1 Light-sensitive material package FUJI PHOTO FILM CO., LTD. 2003-02-13 US disclosed
EP-1283443-A1 Light-sensitive material package FUJI PHOTO FILM CO., LTD. (JP) 2003-02-12 EP disclosed
EP-1043623-B1 Photographic film package FUJI PHOTO FILM CO LTD (JP) 2002-08-28 EP disclosed
EP-0717079-B1 Injection molded article for photographic photosensitive material, molding method thereof and package using the same FUJI PHOTO FILM CO LTD (JP) 2002-07-24 EP disclosed
EP-0718673-B1 Photo film cassette FUJI PHOTO FILM CO LTD (JP) 2002-04-17 EP disclosed
US-20020038921-A1 Method of recycling mold plastic parts for photosensitive material and a recycled plastic mold parts FUJI PHOTO FILM CO., LTD. 2002-04-04 US disclosed
EP-0691327-A1 AMINE DERIVATIVE AND DERMATOLOGIC PREPARATION CONTAINING THE SAME Kao Corporation (JP) 1996-01-10 EP disclosed
US-5460768-A Process for producing container for photographic film FUJI PHOTO FILM CO., LTD. (JP) 1995-10-24 US disclosed
US-5384173-A Thermoplastic resin containers with openings having lips FUJI PHOTO FILM CO., LTD. (JP) 1995-01-24 US disclosed
EP-0622412-A2 Molded article for photographic photosensitive material, molding method and package FUJI PHOTO FILM CO., LTD. (JP) 1994-11-02 EP disclosed
US-5358785-A Inflation film with inner surface joined by blocking, cut end joined by heat fusion having greater peel strength FUJI PHOTO FILM CO., LTD. (JP) 1994-10-25 US disclosed
EP-0596525-A1 Process for manufacturing containers for photographic film FUJI PHOTO FILM CO., LTD. (JP) 1994-05-11 EP disclosed
EP-0582044-A1 Container for photographic film, its production and photographic film package FUJI PHOTO FILM CO., LTD. (JP) 1994-02-09 EP disclosed
EP-0569950-A1 Molded articles for photographic photosensitive materials FUJI PHOTO FILM CO., LTD. (JP) 1993-11-18 EP disclosed
EP-0519251-A2 Laminated film and process for producing the same Fuji Photo Film Co., Ltd. (JP) 1992-12-23 EP disclosed
EP-0408013-A2 Packaging material for photosensitive materials FUJI PHOTO FILM CO., LTD. (JP) 1991-01-16 EP disclosed