⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1810452 | 0.75 | — | — | |
| SCHEMBL2761872 | 0.73 | — | — | |
| SCHEMBL7216147 | 0.72 | PSMB5 (0.32) | — | |
| SCHEMBL6112965 | 0.72 | — | — | |
| SCHEMBL6466032 | 0.69 | — | — | |
| SCHEMBL6113138 | 0.69 | TSHR (0.30) | — | |
| SCHEMBL12970866 | 0.67 | CRBN (0.30) | — | |
| SCHEMBL3325238 | 0.66 | ALDH1A1 (0.36) | — | |
| SCHEMBL576391 | 0.61 | — | — | |
| SCHEMBL2078718 | 0.58 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8258254-B2 | Biodegradable resin, biodegradable resin composition, biodegradable molded object, and process for producing biodegradable resin | NEC CORPORATION (JP) | 2012-09-04 | — | — | US | disclosed |
| US-8258254-B2 | Biodegradable resin, biodegradable resin composition, biodegradable molded object, and process for producing biodegradable resin | NEC CORPORATION (JP) | 2012-09-04 | — | — | US | disclosed |
| US-20120129046-A1 | NONAQUEOUS SECONDARY BATTERY AND FLAME RETARDANT FOR THE SAME | SHARP KABUSHIKI KAISHA (JP) | 2012-05-24 | — | — | US | disclosed |
| US-7723460-B2 | Shape-memory resin performing remoldability and excellent in shape recovering property, and molded product composed of the cross-linked resin | NEC CORPORATION (JP) | 2010-05-25 | — | — | US | disclosed |
| US-7723460-B2 | Shape-memory resin performing remoldability and excellent in shape recovering property, and molded product composed of the cross-linked resin | NEC CORPORATION (JP) | 2010-05-25 | — | — | US | disclosed |
| US-20070148465-A1 | Shape-memory resin performing remoldability and excellent in shape recovering property, and molded product composed of the cross-linked resin | NEC CORPORATION (JP) | 2007-06-28 | — | — | US | disclosed |
| US-20070148465-A1 | Shape-memory resin performing remoldability and excellent in shape recovering property, and molded product composed of the cross-linked resin | NEC CORPORATION (JP) | 2007-06-28 | — | — | US | disclosed |