Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.43 |
| ▸ | LMNA | P02545 | 1/20 | 0.43 |
| ▸ | MAPT | P10636 | 1/20 | 0.43 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.43 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.43 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.43 |
| ▸ | PDK2 | Q15119 | 5/20 | 0.39 |
| ▸ | NCOA1 | Q15788 | 1/20 | 0.37 |
| ▸ | NCOA3 | Q9Y6Q9 | 1/20 | 0.37 |
| ▸ | SCN9A | Q15858 | 3/20 | 0.37 |
| ▸ | AR | P10275 | 1/20 | 0.37 |
| ▸ | GLA | P06280 | 1/20 | 0.36 |
| ▸ | POLB | P06746 | 1/20 | 0.36 |
| ▸ | GAA | P10253 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 1/20 | 0.36 |
| ▸ | PTGDR2 | Q9Y5Y4 | 3/20 | 0.36 |
| ▸ | ESR1 | P03372 | 1/20 | 0.33 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.33 |
| ▸ | MAOA | P21397 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29418459 | 1.00 | KDM4E (0.43) | KDM4EMEN1LMNAMAPTOPRK1 | |
| SCHEMBL25258809 | 0.92 | KDM4E (0.43) | KDM4EMEN1LMNAMAPTOPRK1 | |
| SCHEMBL2446258 | 0.91 | KDM4E (0.50) | KDM4EMEN1LMNAMAPTOPRK1 | |
| SCHEMBL25217980 | 0.89 | KDM4E (0.43) | KDM4EMEN1LMNAMAPTOPRK1 | |
| SCHEMBL25218458 | 0.85 | AR (0.38) | KDM4EMEN1LMNAMAPTOPRK1 | |
| SCHEMBL2445421 | 0.85 | ESR1 (0.45) | KDM4EMEN1LMNAMAPTOPRK1 | |
| SCHEMBL2450314 | 0.85 | KDM4E (0.44) | KDM4EMEN1LMNAMAPTOPRK1 | |
| SCHEMBL2441656 | 0.85 | KDM4E (0.44) | KDM4EMEN1LMNAMAPTOPRK1 | |
| SCHEMBL2444878 | 0.83 | KDM4E (0.51) | KDM4EMEN1LMNAMAPTOPRK1 | |
| SCHEMBL2443998 | 0.83 | KDM4E (0.43) | KDM4EMEN1LMNAMAPTOPRK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0844283-B1 | Curable resin composition and cured products | JSR CORP (JP) | 2002-10-09 | — | — | EP | claimed |
| US-6313233-B1 | CAN BE CURED AND FABRICATED WITHOUT PRODUCING NO CRACKS INTO A CURED PRODUCT SUCH AS A SEMICONDUCTOR DEVICE HAVING A LOW DIELECTRIC CONSTANT, HIGH HEAT RESISTANCE AND MOISTURE RESISTANCE, SUPERIOR ADHESION TO VARIOUS SUBSTRATE MATERIALS | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 2001-11-06 | — | — | US | claimed |
| US-11680140-B2 | Particle-dispersed polyimide precursor solution, method for producing porous polyimide film, and porous polyimide film | FUJIFILM BUSINESS INNOVATION CORP. (JP) | 2023-06-20 | — | — | US | disclosed |
| CN-114133590-A | Particle-dispersed polyimide precursor solution, method for producing porous polyimide film, and porous polyimide film | 富士胶片商业创新有限公司 | 2022-03-04 | — | — | CN | disclosed |
| US-20220064379-A1 | PARTICLE-DISPERSED POLYIMIDE PRECURSOR SOLUTION, METHOD FOR PRODUCING POROUS POLYIMIDE FILM, AND POROUS POLYIMIDE FILM | FUJIFILM BUSINESS INNOVATION CORP. (JP) | 2022-03-03 | — | — | US | disclosed |
| EP-1117102-B1 | Method of manufacturing material for forming insulating film | JSR CORP (JP) | 2005-08-10 | — | — | EP | disclosed |
| EP-0875906-B1 | Electronic part and process for manufacturing the same | JSR CORP (JP) | 2004-04-07 | — | — | EP | disclosed |
| US-6642352-B2 | Providing a silicon inorganic polymer compound or polyarylenes or polyphenylene ether organic polymer compound, treating the polymeric compound with a zeta-potential producing filter material, and producing curable polymer compound | JSR CORPORATION (JP) | 2003-11-04 | — | — | US | disclosed |
| EP-0844283-B1 | Curable resin composition and cured products | JSR CORP (JP) | 2002-10-09 | — | — | EP | disclosed |
| US-6313233-B1 | CAN BE CURED AND FABRICATED WITHOUT PRODUCING NO CRACKS INTO A CURED PRODUCT SUCH AS A SEMICONDUCTOR DEVICE HAVING A LOW DIELECTRIC CONSTANT, HIGH HEAT RESISTANCE AND MOISTURE RESISTANCE, SUPERIOR ADHESION TO VARIOUS SUBSTRATE MATERIALS | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 2001-11-06 | — | — | US | disclosed |
| US-20010009936-A1 | Method of manufacturing material for forming insulating film | JSR CORPORATION (JP) | 2001-07-26 | — | — | US | disclosed |
| EP-1117102-A2 | Method of manufacturing material for forming insulating film | JSR Corporation (JP) | 2001-07-18 | — | — | EP | disclosed |
| US-6084053-A | AS STRUCTURAL COMPONENT, A DIELECTRIC POLYIMIDE MATERIAL HAVING AT LEAST ONE FLUORENE-CONTAINING STRUCTURAL UNIT; APPLYING POLYIMIDE SOLUTION TO SUBSTRATE, AND DRYING TO FORM THE DIELECTRIC; HEAT RESISTANCE, LOW DIELECTRIC CONSTANT | JSR CORPORATION (JP) | 2000-07-04 | — | — | US | disclosed |
| US-6011123-A | ORGANOSILANE COMPOUND; POLYAMIC ACIDS HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH, AND POLYIMIDES HAVING A HYDROLYZABLE SILYL GROUP OR CARBOXYLIC ACID ANHYDRIDE GROUP, OR BOTH. | JSR CORPORATION (JP) | 2000-01-04 | — | — | US | disclosed |
| EP-0875906-A2 | Electronic part and process for manufacturing the same | JSR Corporation (JP) | 1998-11-04 | — | — | EP | disclosed |
| EP-0844283-A1 | Curable resin composition and cured products | JAPAN SYNTHETIC RUBBER CO., LTD. (JP) | 1998-05-27 | — | — | EP | disclosed |