SCHEMBL6138440

SCHEMBL6138440

CCCOOC(=O)CC(=O)CCC.CCCOOC(=O)CC(=O)CCC.[Zr]

nearest known ligand 0.38

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.38
FAAH O00519 1/20 0.33
HDAC3 O15379 3/20 0.32
HDAC1 Q13547 3/20 0.32
HDAC2 Q92769 3/20 0.32
HDAC8 Q9BY41 3/20 0.32
HDAC6 Q9UBN7 1/20 0.32
CES2 O00748 1/20 0.32
CES1 P23141 1/20 0.32
DGKA P23743 1/20 0.31
CTSD P07339 1/20 0.31
FFAR3 O14843 2/20 0.31
TSHR P16473 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31434757 1.00 ALDH1A1 (0.38) ALDH1A1FAAHHDAC3HDAC1HDAC2
SCHEMBL30469216 0.98 ALDH1A1 (0.39) ALDH1A1FAAHHDAC3HDAC1HDAC2
SCHEMBL21570578 0.96 ALDH1A1 (0.38) ALDH1A1FAAHHDAC3HDAC1HDAC2
SCHEMBL4151255 0.96 ALDH1A1 (0.38) ALDH1A1FAAHHDAC3HDAC1HDAC2
SCHEMBL5441284 0.89 FAAH (0.39) ALDH1A1FAAHCES2CES1DGKA
SCHEMBL487230 0.89 FAAH (0.39) ALDH1A1FAAHCES2CES1DGKA
SCHEMBL31117611 0.88 ALDH1A1 (0.38) ALDH1A1FAAHHDAC3HDAC1HDAC2
SCHEMBL4138222 0.88 FFAR3 (0.38) ALDH1A1HDAC3HDAC1HDAC2HDAC8
SCHEMBL5973893 0.88 FFAR3 (0.38) ALDH1A1HDAC3HDAC1HDAC2HDAC8
SCHEMBL20679055 0.86 ALDH1A1 (0.37) ALDH1A1FAAHHDAC3HDAC1HDAC2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-121586750-A Composition for forming silicon-containing underlayer film for directional self-assembly 日产化学株式会社 2026-02-27 CN disclosed
CN-113785243-B Composition for resist pattern metallization process 日产化学株式会社 2025-05-02 CN disclosed
CN-119768742-A Composition for forming silicon-containing resist underlayer film 日产化学株式会社 2025-04-04 CN disclosed
CN-119563142-A Composition for forming silicon-containing resist underlayer film containing multifunctional sulfonic acid 日产化学株式会社 2025-03-04 CN disclosed
CN-119487453-A Method for manufacturing laminate and method for manufacturing semiconductor element 日产化学株式会社 2025-02-18 CN disclosed
US-20240419073-A1 ADDITIVE-CONTAINING SILICON-CONTAINING RESIST UNDERLAYER FILM FORMING COMPOSITION NISSAN CHEMICAL CORPORATION (JP) 2024-12-19 US disclosed
WO-2024063044-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM 日産化学株式会社 2024-03-28 WO disclosed
WO-2024019064-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION CONTAINING POLYFUNCTIONAL SULFONIC ACID 日産化学株式会社 2024-01-25 WO disclosed
WO-2024009993-A1 METHOD OF MANUFACTURING LAMINATE AND METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT 日産化学株式会社 2024-01-11 WO disclosed
WO-2024004323-A1 CURABLE COMPOSITION 日産化学株式会社 2024-01-04 WO disclosed
WO-2022230940-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM 日産化学株式会社 2022-11-03 WO disclosed
WO-2022210954-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION 日産化学株式会社 2022-10-06 WO disclosed
WO-2022210901-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM 日産化学株式会社 2022-10-06 WO disclosed
WO-2022210944-A1 SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION 日産化学株式会社 2022-10-06 WO disclosed
WO-2022210960-A1 COMPOSITION FOR FORMING SILICON-CONTAINING UNDERLAYER FILM FOR INDUCED SELF-ORGANIZATION 日産化学株式会社 2022-10-06 WO disclosed
WO-2022210262-A1 LAMINATE, RELEASE AGENT COMPOSITION, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE 日産化学株式会社 2022-10-06 WO disclosed
EP-1117102-B1 Method of manufacturing material for forming insulating film JSR CORP (JP) 2005-08-10 EP disclosed
US-6642352-B2 Providing a silicon inorganic polymer compound or polyarylenes or polyphenylene ether organic polymer compound, treating the polymeric compound with a zeta-potential producing filter material, and producing curable polymer compound JSR CORPORATION (JP) 2003-11-04 US disclosed
EP-1295924-A2 Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor JSR Corporation (JP) 2003-03-26 EP disclosed
US-20010009936-A1 Method of manufacturing material for forming insulating film JSR CORPORATION (JP) 2001-07-26 US disclosed