SCHEMBL6141594

SCHEMBL6141594

CCP(=O)(c1ccccc1N)c1ccccc1N

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 3/20 0.39
SMN1; SMN2 Q16637 2/20 0.39
ALOX15 P16050 1/20 0.39
CASP1 P29466 1/20 0.39
CASP7 P55210 1/20 0.39
ALDH1A1 P00352 9/20 0.39
LMNA P02545 1/20 0.39
RECQL P46063 1/20 0.39
HSD17B10 Q99714 3/20 0.37
HPGD P15428 2/20 0.36
MAPT P10636 1/20 0.36
MAPK1 P28482 1/20 0.36
FDPS P14324 1/20 0.36
TDP1 Q9NUW8 2/20 0.36
CYP1A2 P05177 1/20 0.35
CYP2C9 P11712 1/20 0.35
CYP2C19 P33261 1/20 0.35
L3MBTL1 Q9Y468 2/20 0.35
TSHR P16473 3/20 0.34
MEN1 O00255 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13726242 0.84 ALDH1A1 (0.38) CYP3A4SMN1; SMN2ALOX15CASP1CASP7
SCHEMBL22284083 0.82 TSHR (0.46) ALDH1A1HSD17B10MAPTCYP1A2CYP2C9
Butane SCHEMBL15668569 0.77 POLB (0.42) ALDH1A1HSD17B10FDPSCYP1A2CYP2C9
SCHEMBL10960102 0.77 AOX1 (0.41) ALDH1A1LMNAHSD17B10HPGDTSHR
SCHEMBL1491871 0.76 CYP3A4 (0.43) CYP3A4SMN1; SMN2ALOX15CASP1CASP7
SCHEMBL10936870 0.76 CYP3A4 (0.43) CYP3A4SMN1; SMN2ALOX15CASP1CASP7
SCHEMBL3071689 0.75 CYP3A4 (0.47) CYP3A4SMN1; SMN2ALOX15CASP1CASP7
SCHEMBL641441 0.75 MEN1 (0.53) ALDH1A1LMNAHSD17B10HPGDFDPS
SCHEMBL9338935 0.75 ALDH1A1 (0.38) CYP3A4SMN1; SMN2ALOX15CASP1CASP7
Hydrochloric Acid SCHEMBL28471880 0.74 CYP3A4 (0.42) CYP3A4SMN1; SMN2ALOX15CASP1CASP7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113025247-B Low-water-absorption double-component thermosetting epoxy adhesive and preparation method and application thereof 东莞市德聚胶接技术有限公司 2021-11-23 CN claimed
CN-113025247-A Low-water-absorption double-component thermosetting epoxy adhesive and preparation method and application thereof 东莞市德聚胶接技术有限公司 2021-06-25 CN claimed
US-20250179289-A1 EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2025-06-05 US disclosed
WO-2025041753-A1 EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL 東レ株式会社 2025-02-27 WO disclosed
EP-4495157-A1 EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL Toray Industries, Inc. (JP) 2025-01-22 EP disclosed
EP-3702389-B1 EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES (JP) 2024-02-07 EP disclosed
WO-2023176883-A1 EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL 東レ株式会社 2023-09-21 WO disclosed
US-11441027-B2 Epoxy resin composition, prepreg, and fiber-reinforced composite material TORAY INDUSTRIES, INC. (JP) 2022-09-13 US disclosed
CN-113025247-B Low-water-absorption double-component thermosetting epoxy adhesive and preparation method and application thereof 东莞市德聚胶接技术有限公司 2021-11-23 CN disclosed
CN-113025247-A Low-water-absorption double-component thermosetting epoxy adhesive and preparation method and application thereof 东莞市德聚胶接技术有限公司 2021-06-25 CN disclosed
EP-3702389-A1 EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL Toray Industries, Inc. (JP) 2020-09-02 EP disclosed
US-20200247986-A1 EPOXY RESIN COMPOSITION, PREPREG, AND FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2020-08-06 US disclosed
CN-111164124-A Epoxy resin composition, prepreg, and fiber-reinforced composite material 东丽株式会社 2020-05-15 CN disclosed
EP-1000108-B1 AQUEOUS POLYIMIDE PROCESS COMMW SCIENT IND RES ORG (AU) 2005-01-05 EP disclosed