Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP1A2 | P05177 | 2/20 | 0.37 |
| ▸ | ERBB2 | P04626 | 1/20 | 0.37 |
| ▸ | FYN | P06241 | 1/20 | 0.37 |
| ▸ | MAOA | P21397 | 1/20 | 0.37 |
| ▸ | ACHE | P22303 | 1/20 | 0.37 |
| ▸ | AHR | P35869 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.32 |
| ▸ | GAA | P10253 | 2/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.32 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.32 |
| ▸ | HPGD | P15428 | 2/20 | 0.32 |
| ▸ | CYP1B1 | Q16678 | 1/20 | 0.32 |
| ▸ | THRB | P10828 | 1/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.30 |
| ▸ | TSHR | P16473 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8681282 | 0.88 | CYP1A2 (0.43) | CYP1A2ERBB2FYNMAOAACHE | |
| Lithium Ion SCHEMBL5621652 | 0.88 | CYP1A2 (0.43) | CYP1A2ERBB2FYNMAOAACHE | |
| Tetrabuthylammonium SCHEMBL6889467 | 0.74 | ERBB2 (0.33) | CYP1A2ERBB2FYNMAOAACHE | |
| Tetraphenylphosphonium SCHEMBL11135593 | 0.73 | ERBB2 (0.34) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL182202 | 0.73 | CYP1A2 (0.44) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL4847644 | 0.69 | ALDH1A1 (0.55) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL4852538 | 0.69 | CYP1A2 (0.60) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL4953985 | 0.69 | CYP1A2 (0.38) | CYP1A2ERBB2FYNMAOAACHE | |
| Bromide SCHEMBL17818164 | 0.67 | CYP1A2 (0.46) | CYP1A2ERBB2FYNMAOAACHE | |
| SCHEMBL4852657 | 0.67 | ALDH1A1 (0.52) | CYP1A2ERBB2FYNMAOAACHE |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111315799-B | Resin composition, use thereof, and method for producing resin composition | 普林科技有限公司 | 2022-12-27 | — | — | CN | disclosed |
| CN-110869403-B | Resin composition, prepreg, film with resin, metal foil with resin, metal-foil-clad laminate, and wiring board | 松下知识产权经营株式会社 | 2022-11-25 | — | — | CN | disclosed |
| CN-106916400-B | Resin composition, adhesive film, and method for producing coreless substrate | 味之素株式会社 | 2022-07-05 | — | — | CN | disclosed |
| CN-114641551-A | Adhesive for endoscope, cured product thereof, endoscope, and method for producing endoscope | 富士胶片株式会社 | 2022-06-17 | — | — | CN | disclosed |
| CN-108352333-B | Adhesive for semiconductor, semiconductor device, and method for manufacturing semiconductor device | 昭和电工材料株式会社 | 2021-07-20 | — | — | CN | disclosed |
| CN-113031399-A | Resin composition, cured product, and siloxane-modified (meth) acrylic resin | 东京应化工业株式会社 | 2021-06-25 | — | — | CN | disclosed |
| CN-112885790-A | Electronic device sealing sheet and method for manufacturing electronic device package | 日东电工株式会社 | 2021-06-01 | — | — | CN | disclosed |
| CN-105590905-B | Electronic device sealing sheet and method for manufacturing electronic device package | 日东电工株式会社 | 2021-01-15 | — | — | CN | disclosed |
| CN-107615454-B | Composite sheet for forming protective film | 琳得科株式会社 | 2020-12-18 | — | — | CN | disclosed |
| CN-111801781-A | Adhesive for semiconductor and method for manufacturing semiconductor device using same | 日立化成株式会社 | 2020-10-20 | — | — | CN | disclosed |
| CN-108602318-B | Metal-clad laminate, method for producing metal-clad laminate, metal member with resin, method for producing metal member with resin, wiring board, and method for producing wiring board | 松下知识产权经营株式会社 | 2020-07-17 | — | — | CN | disclosed |
| CN-111372771-A | Laminate and electronic device | 积水化学工业株式会社 | 2020-07-03 | — | — | CN | disclosed |
| CN-110600434-A | Sealing sheet, sealing sheet with spacer, semiconductor device, and method for manufacturing semiconductor device | 日东电工株式会社 | 2019-12-20 | — | — | CN | disclosed |
| CN-110582840-A | Semiconductor device and method for manufacturing the same | 日立化成株式会社 | 2019-12-17 | — | — | CN | disclosed |
| CN-110556344-A | Adhesive for semiconductor, method for manufacturing semiconductor device, and semiconductor device | HITACHI CHEMICAL CO LTD | 2019-12-10 | — | — | CN | disclosed |
| EP-1551901-A1 | METHOD OF POLYCARBONATE PREPARATION | GENERAL ELECTRIC COMPANY (US) | 2005-07-13 | — | — | EP | disclosed |
| US-6797802-B2 | Method of polycarbonate preparation | GENERAL ELECTRIC COMPANY | 2004-09-28 | — | — | US | disclosed |
| WO-2004033530-A1 | METHOD OF POLYCARBONATE PREPARATION | GENERAL ELECTRIC COMPANY (US) | 2004-04-22 | — | — | WO | disclosed |
| US-20040068087-A1 | METHOD OF POLYCARBONATE PREPARATION | GENERAL ELECTRIC COMPANY | 2004-04-08 | — | — | US | disclosed |