Hydrochloric Acid

Hydrochloric Acid

SCHEMBL6249807

CC(C)(N)C(C)(C)N.[Cl-].[Cl-].[Cu+2]

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

ACHEBDKRB2CHRM1CHRM2CHRM3CHRNA1CHRNB1CHRNDCHRNECHRNGGUCY1A1GUCY1A2GUCY1B1GUCY1B2NAMPTPTAFRSLC10A2SLC6A2SLC6A3TACR1dacAdacBdacCftsImrcAmrcBmrdA

The experimentally established mechanism targets of Hydrochloric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL19715271 0.89
Hydrochloric Acid SCHEMBL7860335 0.89
Hydrochloric Acid SCHEMBL1370750 0.89
Hydrochloric Acid SCHEMBL5352785 0.89
SCHEMBL15333 0.88
SCHEMBL10425917 0.88 FDPS (0.31)
SCHEMBL2194227 0.82
Ammonia Solution, Strong SCHEMBL1083611 0.82
SCHEMBL9469219 0.82
SCHEMBL6128086 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10329231-B2 Epoxy compound, method for producing the same, epoxy resin composition, and cured product thereof DIC CORPORATION (JP) 2019-06-25 US disclosed
CN-104684902-B Epoxide, preparation method, composition epoxy resin and its solidfied material DIC株式会社 2019-05-17 CN disclosed
US-20180002261-A1 EPOXY COMPOUND, METHOD FOR PRODUCING THE SAME, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF DAINIPPON INK & CHEMICALS (JP) 2018-01-04 US disclosed
US-9738580-B2 Epoxy compound, method for producing the same, epoxy resin composition, and cured product thereof DIC CORPORATION (JP) 2017-08-22 US disclosed
US-20150353456-A1 EPOXY COMPOUND, METHOD FOR PRODUCING THE SAME, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF DIC CORPORATION (JP) 2015-12-10 US disclosed
EP-1503998-A1 HETEROARYL SUBSTITUTED SPIROCYCLIC SUFAMIDES FOR INHIBITION OF GAMMA SECRETASE MERCK SHARP &amp; DOHME LTD. (GB) 2005-02-09 EP disclosed
WO-2003093252-A1 HETEROARYL SUBSTITUTED SPIROCYCLIC SULFAMIDES FOR INHIBITION OF GAMMA SECRETASE MERCK SHARP & DOHME LIMITED (GB) 2003-11-13 WO disclosed
US-4472356-A FILTER, SEMICONDUCTIVE POLYMER THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE AIR FORCE (US) 1984-09-18 US disclosed
US-4079071-A REACTING WITH HYDROGEN, COPPER CATALYST UNION CARBIDE CORPORATION (US) 1978-03-14 US disclosed