SCHEMBL6258772

SCHEMBL6258772

Cc1cc(CCC(=O)OCCOCCOC(=O)CCc2cc(C)c(O)c(C(C)(C)C)c2)cc(C(C)(C)C)c1O

nearest known ligand 0.48

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
GAA P10253 6/20 0.48
KMT2A Q03164 3/20 0.45
MEN1 O00255 2/20 0.43
ALOX5 P09917 1/20 0.42
CYP1A2 P05177 1/20 0.41
CYP2C9 P11712 1/20 0.41
CYP2C19 P33261 1/20 0.41
APP P05067 2/20 0.40
TDP1 Q9NUW8 1/20 0.40
HTT P42858 2/20 0.39
PKM P14618 1/20 0.39
ALDH1A1 P00352 2/20 0.37
LMNA P02545 1/20 0.37
AGTR1 P30556 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29395480 1.00 GAA (0.48) GAAKMT2AMEN1ALOX5CYP1A2
SCHEMBL29363126 1.00 GAA (0.48) GAAKMT2AMEN1ALOX5CYP1A2
SCHEMBL29351339 1.00 GAA (0.48) GAAKMT2AMEN1ALOX5CYP1A2
SCHEMBL97797 1.00 GAA (0.48) GAAKMT2AMEN1ALOX5CYP1A2
SCHEMBL23263834 0.99 GAA (0.50) GAAKMT2AMEN1ALOX5CYP1A2
SCHEMBL551089 0.96 GAA (0.51) GAAKMT2AMEN1ALOX5CYP1A2
SCHEMBL29586862 0.96 GAA (0.51) GAAKMT2AMEN1ALOX5CYP1A2
SCHEMBL11736945 0.95 GAA (0.44) GAAKMT2AMEN1ALOX5CYP1A2
SCHEMBL13197509 0.95 GAA (0.44) GAAKMT2AMEN1ALOX5CYP1A2
SCHEMBL29200152 0.95 GAA (0.44) GAAKMT2AMEN1ALOX5CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-11802181-B2 Di-amine compound, and heat-resistant resin and resin composition using the same TORAY INDUSTRIES, INC. (JP) 2023-10-31 US disclosed
US-11802181-B2 Di-amine compound, and heat-resistant resin and resin composition using the same TORAY INDUSTRIES, INC. (JP) 2023-10-31 US disclosed
US-20230213858-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2023-07-06 US disclosed
US-20230213858-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2023-07-06 US disclosed
US-20220171285-A1 METHOD OF MANUFACTURING CURED FILM, PHOTOCURABLE RESIN COMPOSITION, METHOD OF MANUFACTURING LAMINATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2022-06-02 US disclosed
US-11347146-B2 Resin composition TORAY INDUSTRIES, INC. (JP) 2022-05-31 US disclosed
US-11279802-B2 Alkali-soluble resin, photosensitive resin composition, photosensitive sheet, cured film, interlayer insulating film or semiconductor protective film, production method for relief pattern of cured film, and electronic component or semiconductor device TORAY INDUSTRIES, INC. (JP) 2022-03-22 US disclosed
US-11174350-B2 Resin and photosensitive resin composition TORAY INDUSTRIES, INC. (JP) 2021-11-16 US disclosed
US-10545406-B2 Cured film formed by curing photosensitive resin composition and method for manufacturing same TORAY INDUSTRIES, INC. (JP) 2020-01-28 US disclosed
US-20190256655-A1 DI-AMINE COMPOUND, AND HEAT-RESISTANT RESIN AND RESIN COMPOSITION USING THE SAME TORAY INDUSTRIES, INC. (JP) 2019-08-22 US disclosed
US-20190250511-A1 RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2019-08-15 US disclosed
US-20190081258-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2019-03-14 US disclosed
US-20190004423-A1 CURED FILM AND METHOD FOR PRODUCING SAME TORAY INDUSTRIES, INC. (JP) 2019-01-03 US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 US disclosed
EP-0990493-B1 Process for production of wood-plastic combinations by high energy electron accelerator PARA CHEMIE GMBH (AT) 2005-10-26 EP disclosed
US-6191222-B1 LOWER RESIDUAL FORMALDEHYDE CONTENT; FOR FILMS AND SHAPED ARTICLES DEGUSSA-HULS AG (DE) 2001-02-20 US disclosed
EP-0990493-A1 Process for production of wood-plastic combinations by high energy electron accelerator Röhm Gesellschaft mit beschränkter Haftung (DE) 2000-04-05 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11802181-B2 Di-amine compound, and heat-resistant resin and resin composition using the same CAD, ARID2, SMC3 GAA 3846/4885KMT2A 1021/4885MEN1 4033/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.