SCHEMBL6283974

SCHEMBL6283974

O=C(Nc1ccccc1)c1cc(NCc2ccccc2)ccc1O

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ SYK P43405 3/20 0.62
▸ TMPRSS4 Q9NRS4 1/20 0.58
▸ KDM4C Q9H3R0 1/20 0.57
▸ EGFR P00533 4/20 0.56
▸ HDAC3 O15379 1/20 0.56
▸ HDAC4 P56524 1/20 0.56
▸ HDAC1 Q13547 1/20 0.56
▸ HDAC7 Q8WUI4 1/20 0.56
▸ HDAC2 Q92769 1/20 0.56
▸ HDAC10 Q969S8 1/20 0.56
▸ HDAC11 Q96DB2 1/20 0.56
▸ HDAC8 Q9BY41 1/20 0.56
▸ HDAC6 Q9UBN7 1/20 0.56
▸ HDAC9 Q9UKV0 1/20 0.56
▸ HDAC5 Q9UQL6 1/20 0.56
▸ MEN1 O00255 2/20 0.55
▸ KMT2A Q03164 2/20 0.55
▸ KDM4E B2RXH2 1/20 0.55
▸ LMNA P02545 1/20 0.55
▸ TP53 P04637 1/20 0.55

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29532272 0.85 KDM4C (0.76) SYKKDM4CEGFRKDM4EHPGD
SCHEMBL611490 0.85 KDM4C (0.76) SYKKDM4CEGFRKDM4EHPGD
SCHEMBL13812570 0.84 TMPRSS4 (0.69) TMPRSS4MEN1KMT2AP2RX1
SCHEMBL15668379 0.80 EGFR (0.78) SYKKDM4CEGFRMEN1KMT2A
SCHEMBL6283982 0.79 HNF4A (0.67) TMPRSS4EGFRHDAC3HDAC4HDAC1
SCHEMBL13812580 0.79 TMPRSS4 (0.69) TMPRSS4MEN1KMT2AP2RX1
SCHEMBL23675429 0.79 TMPRSS4 (0.57) SYKTMPRSS4EGFRHDAC1MEN1
SCHEMBL30100434 0.79 TMPRSS4 (0.57) SYKTMPRSS4EGFRHDAC1MEN1
SCHEMBL6282756 0.79 TMPRSS4 (0.65) TMPRSS4EGFRHDAC3HDAC4HDAC1
SCHEMBL31227771 0.77 PPARA (0.80) SYKKDM4CEGFRHDAC1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6960553-B2 Heat-sensitive recording material MITSUBISHI PAPER MILLS LTD. (JP) 2005-11-01 — — US disclosed
US-20030186810-A1 Heat-sensitive recording material MITSUBISHI PAPER MILLS LTD. 2003-10-02 — — US disclosed
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