SCHEMBL629162

SCHEMBL629162

CC(C)O[Si](F)(OC(C)C)OC(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL646830 0.67
SCHEMBL2110876 0.67
SCHEMBL34902 0.67
SCHEMBL3893317 0.65
SCHEMBL1108445 0.64
SCHEMBL276184 0.64
SCHEMBL106986 0.64
SCHEMBL26106889 0.64
SCHEMBL93160 0.64
SCHEMBL2531649 0.64

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 191 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119593195-A Hydrophilic material, hydrophobic material, preparation method of hydrophilic material and hydrophobic material, and gas-liquid separation filter device with hydrophilic material and hydrophobic material 中科瑞丽分离科技无锡有限公司 2025-03-11 CN claimed
US-20240209234-A1 NON-SPHERICAL PRIMARY SILICA NANOPARTICLES AND THE USE THEREFOR VERSUM MATERIALS US, LLC 2024-06-27 US claimed
EP-4326678-A1 NON-SPHERICAL PRIMARY SILICA NANOPARTICLES AND THE USE THEREFOR Versum Materials US, LLC (US) 2024-02-28 EP claimed
CN-117425621-A Non-spherical primary silica nanoparticles and uses thereof 弗萨姆材料美国有限责任公司 2024-01-19 CN claimed
WO-2022226471-A1 NON-SPHERICAL PRIMARY SILICA NANOPARTICLES AND THE USE THEREFOR VERSUM MATERIALS US, LLC (US) 2022-10-27 WO claimed
US-8216649-B2 Liquid crystal aligning agent, method of producing a liquid crystal alignment film and liquid crystal display device JSR CORPORATION (JP) 2012-07-10 US claimed
CN-119593195-A Hydrophilic material, hydrophobic material, preparation method of hydrophilic material and hydrophobic material, and gas-liquid separation filter device with hydrophilic material and hydrophobic material 中科瑞丽分离科技无锡有限公司 2025-03-11 CN disclosed
US-20240209234-A1 NON-SPHERICAL PRIMARY SILICA NANOPARTICLES AND THE USE THEREFOR VERSUM MATERIALS US, LLC 2024-06-27 US disclosed
EP-4326678-A1 NON-SPHERICAL PRIMARY SILICA NANOPARTICLES AND THE USE THEREFOR Versum Materials US, LLC (US) 2024-02-28 EP disclosed
CN-117425621-A Non-spherical primary silica nanoparticles and uses thereof 弗萨姆材料美国有限责任公司 2024-01-19 CN disclosed
US-11801662-B2 Cementitious panels with polymeric-film facing material GOLD BOND BUILDING PRODUCTS, LLC (US) 2023-10-31 US disclosed
WO-2022226471-A1 NON-SPHERICAL PRIMARY SILICA NANOPARTICLES AND THE USE THEREFOR VERSUM MATERIALS US, LLC (US) 2022-10-27 WO disclosed
EP-3239111-B1 CURABLE COMPOSITION, TRANSFER FILM, FRONT PLATE OF IMAGE DISPLAY DEVICE, FRONT PLATE-INTEGRATED SENSOR, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD FOR FRONT PLATE OF IMAGE DISPLAY DEVICE FUJIFILM CORP (JP) 2021-02-17 EP disclosed
EP-1117102-A2 Method of manufacturing material for forming insulating film JSR Corporation (JP) 2001-07-18 EP disclosed
EP-1090967-A2 Composition for film formation, method of film formation, and insulating film JSR Corporation (JP) 2001-04-11 EP disclosed
EP-1088868-A2 Composition for film formation, method of film formation, and insulating film JSR Corporation (JP) 2001-04-04 EP disclosed
EP-1058274-A1 Composition for film formation and material for insulating film formation JSR Corporation (JP) 2000-12-06 EP disclosed
EP-1045290-A2 Composition for resist underlayer film and method for producing the same JSR Corporation (JP) 2000-10-18 EP disclosed
US-5444023-A Method of fabricating a semiconductor device having a multilayer wiring structure and using a fluorine compound-containing gas NEC CORPORATION (JP) 1995-08-22 US disclosed
US-5405805-A Method for forming interconnect structure, insulating films and surface protective films of semiconductor device NEC CORPORATION (JP) 1995-04-11 US disclosed