SCHEMBL6314683

SCHEMBL6314683

NCc1ccc(Cc2ccc(CN)cc2)cc1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HRH3 Q9Y5N1 1/20 0.65
LOXL2 Q9Y4K0 7/20 0.61
ABAT P80404 1/20 0.58
ALDH1A1 P00352 1/20 0.56
CYP3A4 P08684 1/20 0.56
TSHR P16473 1/20 0.56
TDP1 Q9NUW8 1/20 0.56
TAAR1 Q96RJ0 1/20 0.52
CA1 P00915 2/20 0.48
CA2 P00918 2/20 0.48
F10 P00742 1/20 0.48
F11 P03951 1/20 0.48
CA12 O43570 1/20 0.48
CA4 P22748 1/20 0.48
CA6 P23280 1/20 0.48
CA5A P35218 1/20 0.48
CA7 P43166 1/20 0.48
CA9 Q16790 1/20 0.48
CA14 Q9ULX7 1/20 0.48
CA5B Q9Y2D0 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15828 0.89 HRH3 (0.79) HRH3LOXL2ABATTAAR1CA1
SCHEMBL2570218 0.88 LOXL2 (0.78) HRH3LOXL2ABATTSHRTAAR1
Hydrochloric Acid SCHEMBL921946 0.86 LOXL2 (0.74) HRH3LOXL2ABATTSHRTAAR1
SCHEMBL14829415 0.86 LOXL2 (0.84) HRH3LOXL2ABATALDH1A1CYP3A4
Bromide SCHEMBL29198706 0.85 HRH3 (0.73) HRH3LOXL2ABATTAAR1CA1
Iodide SCHEMBL28395414 0.85 HRH3 (0.73) HRH3LOXL2ABATTAAR1CA1
Hydrochloric Acid SCHEMBL3168189 0.85 HRH3 (0.73) HRH3LOXL2ABATTAAR1CA1
Hydrochloric Acid SCHEMBL3162690 0.85 HRH3 (0.73) HRH3LOXL2ABATTAAR1CA1
Iodide SCHEMBL29191162 0.85 HRH3 (0.73) HRH3LOXL2ABATTAAR1CA1
SCHEMBL171163 0.84 LOXL2 (0.80) HRH3LOXL2CYP3A4TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111269099-B Process for preparing fluorinated benzenes and fluorinated benzophenones and their derivatives 福建永晶科技股份有限公司 2023-04-07 CN disclosed
EP-1296540-B1 DISPLAY TORAY INDUSTRIES (JP) 2019-10-16 EP disclosed
CN-108610227-A A method of preparing bicyclic aromatic compounds 中国科学院大连化学物理研究所 2018-10-02 CN disclosed
US-6887643-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-05-03 US disclosed
EP-0878740-B1 Radiation sensitive polymer composition TORAY INDUSTRIES (JP) 2004-11-10 EP disclosed
US-20040053156-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-03-18 US disclosed
US-6696112-B2 POSITIVE-TYPE, PHOTOSENSITIVITY; FLAT PANEL DISPLAYS TORAY INDUSTRIES, INC. (JP) 2004-02-24 US disclosed
EP-1388758-A1 Photosensitive heat resistant resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-02-11 EP disclosed
EP-1296540-A1 DISPLAY TORAY INDUSTRIES, INC. (JP) 2003-03-26 EP disclosed
US-20020162998-A1 Display TORAY INDUSTRIES, INC. (JP) 2002-11-07 US disclosed
US-6090525-A PHOTOSENSITIVE POLYIMIDE COATING AGENT COMPOSITION WITH BOTH GOOD VISCOSITY STABILITY AT ROOM TEMPERATURE WITH LAPSE OF TIME AND GOOD PHOTOSENSITIVE PERFORMANCE TORAY INDUSTRIES, INC. (JP) 2000-07-18 US disclosed
EP-0131445-A2 Polyphenylene ether resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1985-01-16 EP disclosed
US-4342860-A AN UNSATUREATED IMIDE IS USED WITH A DI OR POLYISOCYANATE TO FORM A POLYIMIDE POLYMER RHONE-POULENC INDUSTRIES (FR) 1982-08-03 US disclosed
US-4342861-A AN UNSATURATGED IMIDE AND A DI OR POLYISOCYANATE GO TO MAKE UP A POLYIMIDE POLYMER WHICH ALSO CONTAINS REPEATING AMIDE GROUPS RHONE-POULENC INDUSTRIES (FR) 1982-08-03 US disclosed
US-4302572-A MOLDING MATERIALS; COATINGS; HEAT RESISTANCE; THIN FILMS RHONE-POULENC INDUSTRIES (FR) 1981-11-24 US disclosed