SCHEMBL631827

SCHEMBL631827

C=C(C)C(=O)OC(C)OC1CCCCC1

nearest known ligand 0.35

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.35
ALDH1A1 P00352 2/20 0.33
CYP19A1 P11511 1/20 0.32
EPHX1 P07099 3/20 0.32
LMNA P02545 1/20 0.30
CYP1A2 P05177 1/20 0.30
CYP2D6 P10635 1/20 0.30
SCN1A P35498 1/20 0.30
SCN2A Q99250 1/20 0.30
SCN3A Q9NY46 1/20 0.30
ACHE P22303 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4245638 0.98 TSHR (0.36) TSHRALDH1A1
SCHEMBL3871344 0.91 TSHR (0.38) TSHRALDH1A1
SCHEMBL8982919 0.82
SCHEMBL2739849 0.82 TSHR (0.39) TSHRCYP19A1EPHX1LMNACYP1A2
SCHEMBL12190126 0.81 CYP19A1 (0.32) CYP19A1ACHE
SCHEMBL16866420 0.80 EPHX1 (0.32) TSHRALDH1A1EPHX1
SCHEMBL2739859 0.80 TSHR (0.41) TSHRCYP19A1EPHX1LMNACYP1A2
SCHEMBL16706530 0.79 ALDH1A1 (0.31) ALDH1A1CYP19A1
SCHEMBL9002290 0.78 EPHX1 (0.38) TSHRALDH1A1CYP19A1EPHX1
SCHEMBL2958767 0.77 TSHR (0.36) TSHRALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 201 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6617086-B2 Providing on substrate a layer of a negative photoresist comprising a polymer having methacrylate recurring groups; imagewise exposing layer to irradiation; developing photoresist by removing portions of layer not exposed INTERNATIONAL BUSINESS MACHINES CORPORATION 2003-09-09 US claimed
US-20020123010-A1 Forming a pattern of a negative photoresist INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2002-09-05 US claimed
US-6251569-B1 ACRYLATED ESTER INTERNATIONAL BUSINESS MACHINES CORPORATION 2001-06-26 US claimed
US-12421339-B2 (Meth)acrylic copolymer, pressure-sensitive adhesive composition, pressure-sensitive adhesive, and pressure-sensitive adhesive sheet MITSUBISHI CHEMICAL CORPORATION (JP) 2025-09-23 US disclosed
US-20250206861-A1 COPOLYMER FOR SUPPRESSING PROTEIN ADSORPTION, METHOD FOR PRODUCING COPOLYMER, RESIN MODIFIER, MOLDING MATERIAL, COPOLYMER-CONTAINING COMPOSITION, COATING FILM, AND ARTICLE MITSUBISHI CHEMICAL CORPORATION (JP) 2025-06-26 US disclosed
CN-119937243-A Chemically amplified positive photosensitive resin composition, cured film, and element having cured film 奇美实业股份有限公司 2025-05-06 CN disclosed
US-12264212-B2 Copolymer for suppressing protein adsorption, method for producing copolymer, resin modifier, molding material, copolymer-containing composition, coating film, and article MITSUBISHI CHEMICAL CORPORATION (JP) 2025-04-01 US disclosed
EP-3858879-B1 COPOLYMER FOR SUPPRESSING PROTEIN ADSORPTION, METHOD FOR PRODUCING COPOLYMER, RESIN MODIFIER, MOLDING MATERIAL, COPOLYMER-CONTAINING COMPOSITION, COATING FILM AND ARTICLE MITSUBISHI CHEM CORP (JP) 2025-01-01 EP disclosed
US-20240301193-A1 RESIN COMPOSITION, PRODUCTION METHOD OF RESIN COMPOSITION, MOLDING MATERIAL, AND ARTICLE MITSUBISHI CHEMICAL CORPORATION (JP) 2024-09-12 US disclosed
EP-4421120-A1 RESIN COMPOSITION, PRODUCTION METHOD OF RESIN COMPOSITION, MOLDING MATERIAL AND ARTICLE Mitsubishi Chemical Corporation (JP) 2024-08-28 EP disclosed
CN-118159603-A Resin composition, method for producing resin composition, molding material, and article 三菱化学株式会社 2024-06-07 CN disclosed
CN-1898291-A Curable resin composition, overcoats, and process for formation thereof JSR CORP (JP) 2007-01-17 CN disclosed
US-20060210915-A1 Composition for forming lower layer film for lithography comprising compound having protected carboxyl group NISSAN CHEMICAL INDUSTRIES, LTD. (JP) 2006-09-21 US disclosed
EP-1662769-A1 COMPOSITION FOR FORMING LOWER LAYER FILM FOR LITHOGRAPHY COMPRISING COMPOUND HAVING PROTECTED CARBOXYL GROUP Nissan Chemical Industries, Ltd. (JP) 2006-05-31 EP disclosed
CN-1749856-A Curable jettable liquid for flexography AGFA GEVAERT (BE) 2006-03-22 CN disclosed
CN-1749858-A Method for manufacturing a flexographic printing master AGFA GEVAERT (BE) 2006-03-22 CN disclosed
US-6617086-B2 Providing on substrate a layer of a negative photoresist comprising a polymer having methacrylate recurring groups; imagewise exposing layer to irradiation; developing photoresist by removing portions of layer not exposed INTERNATIONAL BUSINESS MACHINES CORPORATION 2003-09-09 US disclosed
US-20020123010-A1 Forming a pattern of a negative photoresist INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2002-09-05 US disclosed
US-6251569-B1 ACRYLATED ESTER INTERNATIONAL BUSINESS MACHINES CORPORATION 2001-06-26 US disclosed
US-5994025-A MIXTURE OF POLYMER AND ACID GENERATOR NEC CORPORATION (JP) 1999-11-30 US disclosed