SCHEMBL6319928

SCHEMBL6319928

NCc1ccccc1C(F)(c1ccccc1CN)C(F)(F)C(F)(F)F

nearest known ligand 0.40

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 2/20 0.40
PNMT P11086 3/20 0.39
MAOB P27338 3/20 0.38
DPP4 P27487 2/20 0.36
ALDH1A1 P00352 2/20 0.34
POLB P06746 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
TAAR1 Q96RJ0 1/20 0.33
KDM4E B2RXH2 1/20 0.31
ATM Q13315 1/20 0.31
HTR2C P28335 1/20 0.31
HTR2B P41595 1/20 0.31
LOXL2 Q9Y4K0 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6320734 0.85 TAAR1 (0.48) IDO1MAOBTAAR1HTR2CLOXL2
SCHEMBL2095080 0.79 IDO1 (0.42) IDO1PNMTMAOBDPP4ALDH1A1
SCHEMBL7539869 0.79 IDO1 (0.42) IDO1PNMTMAOBDPP4ALDH1A1
SCHEMBL43013 0.79 IDO1 (0.61) IDO1PNMTMAOBDPP4ALDH1A1
Hydrochloric Acid SCHEMBL6169962 0.77 IDO1 (0.62) IDO1PNMTMAOBDPP4ALDH1A1
Methane SCHEMBL27580279 0.77 IDO1 (0.59) IDO1PNMTMAOBDPP4ALDH1A1
SCHEMBL26748088 0.75 IDO1 (0.42) IDO1PNMTMAOBDPP4ALDH1A1
Ethane SCHEMBL27580262 0.75 IDO1 (0.57) IDO1PNMTMAOBALDH1A1POLB
SCHEMBL6173073 0.73 IDO1 (0.41) IDO1PNMTMAOBDPP4ALDH1A1
SCHEMBL8404393 0.73 PNMT (0.48) IDO1PNMTMAOBDPP4TAAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112939915-A Diamine monomer for photosensitive resin, polyimide precursor, photosensitive resin composition, and use thereof 武汉柔显科技股份有限公司 2021-06-11 CN disclosed
EP-1296540-B1 DISPLAY TORAY INDUSTRIES (JP) 2019-10-16 EP disclosed
US-6887643-B2 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2005-05-03 US disclosed
EP-0878740-B1 Radiation sensitive polymer composition TORAY INDUSTRIES (JP) 2004-11-10 EP disclosed
US-20040053156-A1 Photosensitive resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-03-18 US disclosed
US-6696112-B2 POSITIVE-TYPE, PHOTOSENSITIVITY; FLAT PANEL DISPLAYS TORAY INDUSTRIES, INC. (JP) 2004-02-24 US disclosed
EP-1388758-A1 Photosensitive heat resistant resin precursor composition TORAY INDUSTRIES, INC. (JP) 2004-02-11 EP disclosed
EP-1296540-A1 DISPLAY TORAY INDUSTRIES, INC. (JP) 2003-03-26 EP disclosed
US-20020162998-A1 Display TORAY INDUSTRIES, INC. (JP) 2002-11-07 US disclosed
US-6090525-A PHOTOSENSITIVE POLYIMIDE COATING AGENT COMPOSITION WITH BOTH GOOD VISCOSITY STABILITY AT ROOM TEMPERATURE WITH LAPSE OF TIME AND GOOD PHOTOSENSITIVE PERFORMANCE TORAY INDUSTRIES, INC. (JP) 2000-07-18 US disclosed
EP-0878740-A1 Radiation sensitive polymer composition TORAY INDUSTRIES, INC. (JP) 1998-11-18 EP disclosed
EP-0552058-B1 Method of producing multi-layered wiring substrate FUJITSU LTD (JP) 1996-12-18 EP disclosed
US-5349155-A Impregnating PTFE with thermosetting polybenzocyclobutene FUJITSU LIMITED (JP) 1994-09-20 US disclosed
EP-0552058-A1 Method of producing multi-layered wiring substrate FUJITSU LIMITED (JP) 1993-07-21 EP disclosed