⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4374599 | 0.68 | — | — | |
| Hydrochloric Acid SCHEMBL10363990 | 0.66 | ALDH1A1 (0.31) | — | |
| SCHEMBL8528128 | 0.66 | — | — | |
| SCHEMBL632176 | 0.65 | — | — | |
| SCHEMBL3068643 | 0.65 | — | — | |
| SCHEMBL7847039 | 0.65 | EPHX1 (0.42) | — | |
| Water SCHEMBL9550563 | 0.64 | — | — | |
| SCHEMBL5354949 | 0.63 | — | — | |
| SCHEMBL150800 | 0.63 | — | — | |
| SCHEMBL11046821 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 36 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20210017650-A1 | PLATED LAMINATE AND PRINTED CIRCUIT BOARD | YMT CO.,LTD. (KR) | 2021-01-21 | — | — | US | claimed |
| EP-3760761-A1 | PLATED LAMINATE AND PRINTED CIRCUIT BOARD | YMT Co. Ltd. (KR) | 2021-01-06 | — | — | EP | claimed |
| US-20240260200-A1 | METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USING SAME, AND MANUFACTURING METHOD FOR LAMINATE | YMT CO., LTD. (KR) | 2024-08-01 | — | — | US | disclosed |
| EP-4329437-A1 | METAL FOIL WITH CARRIER FOIL, LAMINATE FOR PRINTED WIRING BOARD USING SAME, AND MANUFACTURING METHOD FOR LAMINATE | YMT Co., Ltd. (KR) | 2024-02-28 | — | — | EP | disclosed |
| US-11499233-B2 | Plated laminate and printed circuit board | YMT CO., LTD. (KR) | 2022-11-15 | — | — | US | disclosed |
| US-20210140051-A1 | ELECTROLESS COPPER PLATING AND COUNTERACTING PASSIVATION | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2021-05-13 | — | — | US | disclosed |
| US-20210140052-A1 | ELECTROLESS COPPER PLATING AND COUNTERACTING PASSIVATION | ROHM AND HAAS ELECTRONIC MATERIALS LLC | 2021-05-13 | — | — | US | disclosed |
| EP-3819397-A1 | ELECTROLESS COPPER PLATING AND COUNTERACTING PASSIVATION | Rohm and Haas Electronic Materials LLC (US) | 2021-05-12 | — | — | EP | disclosed |
| EP-3819398-A1 | ELECTROLESS COPPER PLATING AND COUNTERACTING PASSIVATION | Rohm and Haas Electronic Materials LLC (US) | 2021-05-12 | — | — | EP | disclosed |
| US-20210017650-A1 | PLATED LAMINATE AND PRINTED CIRCUIT BOARD | YMT CO.,LTD. (KR) | 2021-01-21 | — | — | US | disclosed |
| EP-3760761-A1 | PLATED LAMINATE AND PRINTED CIRCUIT BOARD | YMT Co. Ltd. (KR) | 2021-01-06 | — | — | EP | disclosed |
| US-7501014-B2 | Formaldehyde free electroless copper compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2009-03-10 | — | — | US | disclosed |
| US-20080038451-A1 | Formaldehyde free electroless copper compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-02-14 | — | — | US | disclosed |
| US-20080038449-A1 | Electroless copper and redox couples | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-02-14 | — | — | US | disclosed |
| US-20080038450-A1 | Environmentally friendly electroless copper compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-02-14 | — | — | US | disclosed |
| US-20080038452-A1 | Electroless copper compositions | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2008-02-14 | — | — | US | disclosed |
| EP-1876259-A2 | Formaldehyde free electrolesss copper compositions | Rohm and Haas Electronic Materials, L.L.C. (US) | 2008-01-09 | — | — | EP | disclosed |
| EP-1876260-A2 | Improved electroless copper compositions | Rohm and Haas Electronic Materials LLC (US) | 2008-01-09 | — | — | EP | disclosed |
| EP-1876261-A1 | Electroless copper and redox couples | Rohm and Haas Electronic Materials, L.L.C. (US) | 2008-01-09 | — | — | EP | disclosed |
| EP-1876262-A1 | Environmentally friendly electroless copper compositions | Rohm and Haas Electronic Materials, L.L.C. (US) | 2008-01-09 | — | — | EP | disclosed |