SCHEMBL632460

SCHEMBL632460

[CH2]COC(=O)CCCCCO

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 1/20 0.46
FFAR1 O14842 1/20 0.46
FFAR4 Q5NUL3 1/20 0.46
DGKA P23743 1/20 0.43
TSHR P16473 1/20 0.41
PAM P19021 2/20 0.39
KDM4E B2RXH2 2/20 0.39
LMNA P02545 2/20 0.39
DUSP3 P51452 1/20 0.39
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
GAA P10253 1/20 0.37
MAPT P10636 1/20 0.37
PRKCA P17252 1/20 0.37
PRKCE Q02156 1/20 0.37
PRKCQ Q04759 1/20 0.37
PRKCD Q05655 1/20 0.37
FNTA P49354 1/20 0.36
FNTB P49356 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9687766 0.98 GPR84 (0.42) GPR84FFAR1FFAR4DGKATSHR
SCHEMBL7696786 0.91
SCHEMBL11886036 0.83 GPR84 (0.52) GPR84FFAR1FFAR4DGKATSHR
SCHEMBL7774212 0.83 GPR84 (0.52) GPR84FFAR1FFAR4DGKATSHR
SCHEMBL8454940 0.83 GPR84 (0.52) GPR84FFAR1FFAR4DGKATSHR
SCHEMBL7534986 0.83 GPR84 (0.52) GPR84FFAR1FFAR4DGKATSHR
SCHEMBL28455749 0.83 DGKA (0.50) GPR84FFAR1FFAR4DGKATSHR
SCHEMBL10802487 0.82 TSHR (0.55) GPR84FFAR1FFAR4TSHRPAM
SCHEMBL23881641 0.81 GPR84 (0.50) GPR84FFAR1FFAR4DGKATSHR
SCHEMBL12375156 0.81 DGKA (0.64) GPR84FFAR1FFAR4DGKATSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114729246-B Adhesive for electronic tag and electronic tag 三井化学株式会社 2024-05-28 CN disclosed
CN-114729246-A Adhesive for electronic tag and electronic tag 三井化学株式会社 2022-07-08 CN disclosed
CN-107003604-B Photosensitive resin composition, method for producing color filter, and liquid crystal display device 奇美实业股份有限公司 2020-08-11 CN disclosed
CN-106933033-B Photosensitive resin composition, optical filter and manufacturing method thereof, and liquid crystal display device 奇美实业股份有限公司 2020-03-13 CN disclosed
EP-2154162-B1 REACTIVE URETHANE COMPOUND HAVING ETHER BOND, CURABLE COMPOSITION AND CURED MATERIAL SHOWA DENKO KK (JP) 2019-07-17 EP disclosed
US-8329065-B2 Carbon nanotube-containing composition, composite, and methods for producing them MITSUBISHI RAYON CO., LTD. (JP) 2012-12-11 US disclosed
EP-1866357-B1 (METH)ACRYLOYL GROUP-CONTAINING AROMATIC ISOCYANATE COMPOUND AND PRODUCTION PROCESS THEREOF SHOWA DENKO KK (JP) 2012-02-22 EP disclosed
US-8044235-B2 (Meth) acryloyl group-containing aromatic isocyanate compound and production process thereof SHOWA DENKO K.K. (JP) 2011-10-25 US disclosed
EP-1812381-B1 ETHYLENICALLY UNSATURATED GROUP-CONTAINING ISOCYANATE COMPOUND AND PROCESS FOR PRODUCING THE SAME, AND REACTIVE MONOMER, REACTIVE (METH)ACRYLATE POLYMER AND ITS USE SHOWA DENKO KK (JP) 2011-02-16 EP disclosed
US-7790354-B2 Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same SHOWA DENKO K.K. (JP) 2010-09-07 US disclosed
US-20040009428-A1 Resist curable resin composition and cured article thereof SHOWA DENKO K.K. (JP) 2004-01-15 US disclosed
WO-2003062296-A1 PHOSPHORUS-CONTAINING URETHANE (METH)ACRYLATE COMPOUNDS AND PHOTOSENSITIVE COMPOSITIONS SHOWA DENKO K. K. (JP) 2003-07-31 WO disclosed
WO-2003005126-A1 RESIST CURABLE RESIN COMPOSITION AND CURED ARTICLE THEREOF SHOWA DENKO K.K. (JP) 2003-01-16 WO disclosed
US-6153719-A PHOSPHORUS-CONTAINING COMPOUND HAVING AT LEAST ONE P--OH GROUP AND AT LEAST ONE ORGANIC MOIETY CHARACTERIZED BY THE PRESENCE OF AN ETHYLENICALLY UNSATURATED GROUP;PARTICULARLY USEFUL AS A SEALER FOR AN ADHESIVE JOINT. LORD CORPORATION (US) 2000-11-28 US disclosed
EP-1053271-A1 THIOL-CURED EPOXY COMPOSITION Lord Corporation (US) 2000-11-22 EP disclosed
WO-1999040142-A1 THIOL-CURED EPOXY COMPOSITION LORD CORPORATION (US) 1999-08-12 WO disclosed
US-5770655-A ACRYLATE MONOMER WITH MULTICYCLIC FUSED RING IN ESTER GROUP, OPTICAL FIBERS AND DISKS, CLARITY AND IMPACT STRENGTH, TETRACYCLODODECYL ACRYLATE MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1998-06-23 US disclosed
EP-0671433-B1 Polymer composition and core-shell elastomer used therefor MITSUI CHEMICALS INC (JP) 1998-06-17 EP disclosed
US-5574100-A ALPHA-OLEFIN-CYCLIC OLEFIN COPOLYMER, BUTADIENE-STYRENE COPOLYMER CORE, ALICYCLIC ACRYLATE SHELL MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1996-11-12 US disclosed
EP-0671433-A1 Polymer composition and core-shell elastomer used therefor MITSUI PETROCHEMICAL INDUSTRIES, LTD. (JP) 1995-09-13 EP disclosed