Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | TSHR | P16473 | 1/20 | 0.32 |
| ▸ | THRB | P10828 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ether SCHEMBL9675710 | 1.00 | — | — | |
| Ether SCHEMBL1219153 | 1.00 | — | — | |
| Ether SCHEMBL6 | 0.89 | — | — | |
| Ether SCHEMBL21406 | 0.89 | ALDH1A1 (0.47) | ALDH1A1TSHRTHRB | |
| Ether SCHEMBL9248046 | 0.89 | ALDH1A1 (0.47) | ALDH1A1TSHRTHRB | |
| Ether SCHEMBL9248674 | 0.89 | ALDH1A1 (0.47) | ALDH1A1TSHRTHRB | |
| Ether SCHEMBL8160191 | 0.89 | ALDH1A1 (0.47) | ALDH1A1TSHRTHRB | |
| Ether SCHEMBL3653511 | 0.84 | — | — | |
| Ether SCHEMBL1312666 | 0.84 | ALDH1A1 (0.44) | ALDH1A1TSHRTHRB | |
| Ether SCHEMBL10719709 | 0.84 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20040102020-A1 | Method for bonding and debonding films using a high-temperature polymer | ROBERDS BRIAN (US) | 2004-05-27 | — | — | US | claimed |
| US-6638835-B2 | Method for bonding and debonding films using a high-temperature polymer | INTEL CORPORATION | 2003-10-28 | — | — | US | claimed |
| US-20030191275-A1 | Solvent systems for polymeric dielectric materials | HONEYWELL INTERNATIONAL INC. | 2003-10-09 | — | — | US | claimed |
| US-20030170424-A1 | Method for bonding and debonding films using a high-temperature polymer | ROBERDS BRIAN (US) | 2003-09-11 | — | — | US | claimed |
| US-20030108715-A1 | Method for bonding and debonding films using a high-temperature polymer | INTEL CORPORATION | 2003-06-12 | — | — | US | claimed |
| US-20020183476-A1 | Solvent systems for polymeric dielectric materials | HONEYWELL INTERNATIONAL INC. | 2002-12-05 | — | — | US | claimed |
| US-6413202-B1 | USING AROMATIC ETHER SOLVENT | ALLIEDSIGNAL, INC. | 2002-07-02 | — | — | US | claimed |
| WO-2000043836-A1 | SOLVENT SYSTEMS FOR POLYMERIC DIELECTRIC MATERIALS | ALLIEDSIGNAL INC. (US) | 2000-07-27 | — | — | WO | claimed |
| WO-1999038910-A1 | SOLVENT SYSTEMS FOR LOW DIELECTRIC CONSTANT POLYMERIC MATERIALS | ALLIEDSIGNAL, INC. (US) | 1999-08-05 | — | — | WO | claimed |
| US-6878796-B2 | Solvent systems for polymeric dielectric materials | HONEYWELL INTERNATIONAL INC. (US) | 2005-04-12 | — | — | US | disclosed |
| US-6780517-B2 | FOR USE IN SEMICONDUCTOR DEVICES | HONEYWELL INTERNATIONAL INC. | 2004-08-24 | — | — | US | disclosed |
| US-6761975-B1 | RESISTANCE TO DELAMINATION; ELIMINATES THE NEED FOR A PRIMER COATING APPLICATION PROCESS STEP; CURABLE POLYARYL ETHER FILM | HONEYWELL INTERNATIONAL INC. | 2004-07-13 | — | — | US | disclosed |
| US-20040102020-A1 | Method for bonding and debonding films using a high-temperature polymer | ROBERDS BRIAN (US) | 2004-05-27 | — | — | US | disclosed |
| US-6638835-B2 | Method for bonding and debonding films using a high-temperature polymer | INTEL CORPORATION | 2003-10-28 | — | — | US | disclosed |
| EP-1243003-A1 | POLYCARBOSILANE ADHESION PROMOTERS FOR LOW DIELECTRIC CONSTANT POLYMERIC MATERIALS | AlliedSignal Inc. (US) | 2002-09-25 | — | — | EP | disclosed |
| US-6413202-B1 | USING AROMATIC ETHER SOLVENT | ALLIEDSIGNAL, INC. | 2002-07-02 | — | — | US | disclosed |
| US-6291628-B1 | USED FOR FORMING A DIELECTRIC FILM ON A SUBSTRATE BY SPIN-COATING; IN MICROELECTRONIC DEVICES | ALLIED SIGNAL INC. | 2001-09-18 | — | — | US | disclosed |
| WO-2001046963-A1 | POLYCARBOSILANE ADHESION PROMOTERS FOR LOW DIELECTRIC CONSTANT POLYMERIC MATERIALS | ALLIEDSIGNAL INC. (US) | 2001-06-28 | — | — | WO | disclosed |
| WO-2000043836-A1 | SOLVENT SYSTEMS FOR POLYMERIC DIELECTRIC MATERIALS | ALLIEDSIGNAL INC. (US) | 2000-07-27 | — | — | WO | disclosed |
| WO-1999038910-A1 | SOLVENT SYSTEMS FOR LOW DIELECTRIC CONSTANT POLYMERIC MATERIALS | ALLIEDSIGNAL, INC. (US) | 1999-08-05 | — | — | WO | disclosed |