SCHEMBL63262

SCHEMBL63262

N#CCCn1ccnc1-c1ccccc1

nearest known ligand 0.59

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.59
PLAA Q9Y263 1/20 0.43
ALPG P10696 1/20 0.42
PDE6D O43924 1/20 0.41
CYP3A4 P08684 2/20 0.40
CYP2C19 P33261 2/20 0.40
CYP2C9 P11712 1/20 0.40
HIF1A Q16665 1/20 0.40
BRD4 O60885 1/20 0.39
KDM4E B2RXH2 1/20 0.39
MAPT P10636 1/20 0.39
LIMK2 P53671 1/20 0.39
ALDH1A1 P00352 1/20 0.38
RAB9A P51151 1/20 0.38
TSHR P16473 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11419938 0.92 ESR1 (0.55) ESR1PLAAALPGPDE6DCYP3A4
SCHEMBL15956713 0.91 ESR1 (0.56) ESR1PLAAALPGPDE6DCYP3A4
SCHEMBL29389820 0.88 ESR1 (0.58) ESR1PLAAALPGBRD4KDM4E
SCHEMBL9253877 0.84 CSNK2A1 (0.42) ESR1HIF1AKDM4EALDH1A1TSHR
SCHEMBL1307741 0.83 ESR1 (0.54) ESR1PLAAALPGPDE6DCYP3A4
SCHEMBL31484739 0.82 ESR1 (0.51) ESR1PLAAALPGBRD4KDM4E
SCHEMBL441418 0.82 ESR1 (0.51) ESR1PLAAALPGBRD4KDM4E
SCHEMBL154797 0.82 ESR1 (0.51) ESR1PLAAALPGBRD4KDM4E
SCHEMBL29713435 0.82 ESR1 (0.51) ESR1PLAAALPGBRD4KDM4E
SCHEMBL7095574 0.81 ESR1 (0.68) ESR1PLAAALPGPDE6DCYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 6807 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122091303-A Low-temperature conductive paste for metal plate printing and preparation method thereof 2026-05-26 CN claimed
CN-121174379-B Novel notebook flexible printed circuit board and backlight module prepared based on weldable low-temperature silver paste 北京中科纳通电子技术有限公司 2026-05-15 CN claimed
US-20250333594-A1 RESIN COMPOSITION NAN YA PLASTICS CORPORATION (TW) 2025-10-30 US claimed
US-20250163261-A1 LOW-DIELECTRIC RESIN COMPOSITION NAN YA PLASTICS CORPORATION (TW) 2025-05-22 US claimed
CN-120005486-A Low dielectric resin composition 南亚塑胶工业股份有限公司 2025-05-16 CN claimed
CN-119978952-A Antistatic and dustproof coating for photovoltaic module and preparation method thereof 珠海城市职业技术学院 2025-05-13 CN claimed
CN-119662145-A Pure adhesive film and preparation method thereof 惠州市宏天电子材料有限公司 2025-03-21 CN claimed
US-20250075028-A1 FAST-CURE RESIN FORMULATIONS WITH CONSISTENT HANDLING CHARACTERISTICS CYTEC INDUSTRIES, INC. (US) 2025-03-06 US claimed
CN-119529730-A Adhesive capable of being rapidly cured at low temperature, preparation method thereof and printing screen 江苏镭利电子材料有限公司 2025-02-28 CN claimed
CN-119490771-A Thermosetting insulating adhesive, preparation method and application thereof 杭州福斯特应用材料股份有限公司 2025-02-21 CN claimed
US-5112989-A Process for producing unsaturated mono and dicarboxylic acid imide compound MATSUSHITA ELECTRIC WORKS LTD. (JP) 1992-05-12 US claimed
CN-1050730-A Polyphenylene oxide-hybrid epoxy resin system as laminates GEN ELECTRIC (US) 1991-04-17 CN claimed
EP-0349763-A1 Compositions for enhancing transdermal penetration Bristol-Myers Squibb Company (US) 1990-01-10 EP claimed
US-4370467-A CYANATE, PEROXIDE MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1983-01-25 US claimed
US-4304818-A POLYISOCYANURATE-OXAZOLIDONES FROM POLYISOCYANATE AND POLYEPOXIDE HITACHI, LTD. (JP) 1981-12-08 US claimed
US-4294950-A POLYVALENT CARBOXYLIC ACID BONDED THERETO ITO OPTICAL INDUSTRIAL CO., LTD. (JP) 1981-10-13 US claimed
US-4110364-A AND BISMALEIIMIDES MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1978-08-29 US claimed
US-4070416-A POLYFUNCTIONAL ISOCYANATES AND EPOXIDES, ISOCYANURATE-OXAZOLIDOLE POLYMERS HITACHI, LTD. (JA) 1978-01-24 US claimed
US-4026872-A PHENOLIC CURING AGENTS HITACHI, LTD. (JA) 1977-05-31 US claimed
US-3984376-A Thermosetting resin compositions prepared from isocyanates and epoxyphenols HITACHI, LTD. (JA) 1976-10-05 US claimed