SCHEMBL6342121

SCHEMBL6342121

CNC(=O)C[Si](C)(CC(=O)NC)CC(=O)NC

nearest known ligand 0.40

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
MCL1 Q07820 1/20 0.40
LMNA P02545 1/20 0.40
ALDH1A1 P00352 2/20 0.32
MAPT P10636 1/20 0.31
POLB P06746 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10522935 0.82 MCL1 (0.40) MCL1LMNAALDH1A1MAPTPOLB
SCHEMBL8503194 0.82
SCHEMBL10525060 0.78 MCL1 (0.37) MCL1LMNAALDH1A1MAPT
SCHEMBL9870137 0.77
SCHEMBL10521218 0.76 MCL1 (0.36) MCL1LMNAALDH1A1MAPT
SCHEMBL10940993 0.74 ALDH1A1 (0.35) MCL1LMNAALDH1A1MAPT
SCHEMBL9357709 0.72 MCL1 (0.33) MCL1LMNA
SCHEMBL10524685 0.72 MCL1 (0.44) MCL1ALDH1A1MAPT
SCHEMBL10946037 0.72 ALDH1A1 (0.38) MCL1LMNAALDH1A1MAPT
SCHEMBL2106440 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023068244-A1 MEMBRANE FORMATION COMPOSITION, AND GAS PERMEATION MEMBRANE 日産化学株式会社 2023-04-27 WO disclosed
US-20220002592-A1 SILICONE ADHESIVE TONSAN ADHESIVE, INC (CN) 2022-01-06 US disclosed
EP-3401366-B1 SILICONE COMPOSITION BASED ON BOTH CONDENSATION CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION SHINETSU CHEMICAL CO (JP) 2020-08-26 EP disclosed
US-10689515-B2 Silicone composition based on both condensation/curing reaction and organic-peroxide curing reaction SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-06-23 US disclosed
US-20190010294-A1 SILICONE COMPOSITION BASED ON BOTH CONDENSATION/CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-01-10 US disclosed
EP-3401366-A1 SILICONE COMPOSITION BASED ON BOTH CONDENSATION/CURING REACTION AND ORGANIC-PEROXIDE CURING REACTION Shin-Etsu Chemical Co., Ltd. (JP) 2018-11-14 EP disclosed
US-6875806-B2 Room temperature curable organopolysiloxane composition and part using the same as adhesive SHIN-ETSU CHEMICAL CO., LTD. (JP) 2005-04-05 US disclosed
US-20030211339-A1 Room temperature curable organopolysiloxane composition and part using the same as adhesive SHIN-ETSU CHEMICAL CO., LTD. (JP) 2003-11-13 US disclosed
US-5093454-A Moisture and hot water-resistant adhesives and seals TOSHIBA SILICONE CO., LTD. (JP) 1992-03-03 US disclosed
US-4853313-A Printing plate TORAY INDUSTRIES, INC. (JP) 1989-08-01 US disclosed
EP-0242143-A2 Printing plate TORAY INDUSTRIES, INC. (JP) 1987-10-21 EP disclosed
US-4247442-A Mold and mildew resistant organopolysiloxane compositions TORAY SILICONE COMPANY, LTD. (JP) 1981-01-27 US disclosed
US-4156674-A PLATINUM OR COMPOUND THEREOF, CARBON BLACK AND A TRIAZOLE FOR SELF-EXTINGUISHING CHARACTER, CURING CATALYST AND A SILICON CONTAINING CROSSLINKER TORAY SILICONE COMPANY, LTD. (JP) 1979-05-29 US disclosed