SCHEMBL6344659

SCHEMBL6344659

CCCCCCOC(=O)CC=CCC(=O)OCCCCCC

nearest known ligand 0.67

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.67
HTR2C P28335 1/20 0.58
RAD52 P43351 1/20 0.56
NPSR1 Q6W5P4 1/20 0.56
DGKA P23743 1/20 0.55
FAAH O00519 2/20 0.55
EPHX1 P07099 1/20 0.52
HCAR2 Q8TDS4 2/20 0.52
TSHR P16473 2/20 0.50
PRSS1 P07477 1/20 0.47
PRSS2 P07478 1/20 0.47
PRSS3 P35030 1/20 0.47
ATM Q13315 1/20 0.47
LMNA P02545 2/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
HTT P42858 1/20 0.46
DNM1 Q05193 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6334790 1.00 NAAA (0.67) NAAAHTR2CRAD52NPSR1DGKA
SCHEMBL10404935 1.00 NAAA (0.67) NAAAHTR2CRAD52NPSR1DGKA
SCHEMBL6346924 1.00 NAAA (0.67) NAAAHTR2CRAD52NPSR1DGKA
SCHEMBL10404937 1.00 NAAA (0.67) NAAAHTR2CRAD52NPSR1DGKA
SCHEMBL6346158 1.00 NAAA (0.67) NAAAHTR2CRAD52NPSR1DGKA
SCHEMBL6345681 1.00 NAAA (0.67) NAAAHTR2CRAD52NPSR1DGKA
SCHEMBL6344669 1.00 NAAA (0.67) NAAAHTR2CRAD52NPSR1DGKA
SCHEMBL12157464 0.94 NAAA (0.60) NAAAHTR2CRAD52NPSR1DGKA
SCHEMBL14827528 0.93 NAAA (0.58) NAAAHTR2CRAD52NPSR1DGKA
SCHEMBL10876249 0.91 ATM (0.56) NAAAHTR2CRAD52NPSR1DGKA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6846862-B2 Binder system and method for particulate material cross-reference to related application APEX ADVANCED TECHNOLOGIES, LLC (US) 2005-01-25 US disclosed
US-20030220424-A1 Binder system and method for particulate material cross-reference to related application JOHNSON ELECTRIC NORTH AMERICA, INC. 2003-11-27 US disclosed
WO-2002000569-A2 BINDER SYSTEM AND METHOD FOR FORMING SINTERED PARTS BY POWDER INJECTION MOLDING APEX ADVANCED TECHNOLOGIES, LLC (US) 2002-01-03 WO disclosed