SCHEMBL634579

SCHEMBL634579

CCCCCCCCCC(CCCCCCCC)C(CCCCCCCC)CCCCCCCCC

nearest known ligand 0.57

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.57
THRB P10828 1/20 0.57
DNM1 Q05193 2/20 0.53
LMNA P02545 1/20 0.52
OPRM1 P35372 1/20 0.50
GPR84 Q9NQS5 3/20 0.46
FDPS P14324 3/20 0.46
SPHK1 Q9NYA1 1/20 0.46
FFAR1 O14842 1/20 0.46
MAPT P10636 1/20 0.44
LCK P06239 1/20 0.44
PPARD Q03181 1/20 0.44
ZDHHC20 Q5W0Z9 1/20 0.44
ZDHHC2 Q9UIJ5 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14533500 1.00 TSHR (0.57) TSHRTHRBDNM1LMNAOPRM1
SCHEMBL11818416 1.00 TSHR (0.57) TSHRTHRBDNM1LMNAOPRM1
SCHEMBL19261740 1.00 TSHR (0.57) TSHRTHRBDNM1LMNAOPRM1
SCHEMBL11815847 1.00 TSHR (0.57) TSHRTHRBDNM1LMNAOPRM1
SCHEMBL4062741 1.00 TSHR (0.57) TSHRTHRBDNM1LMNAOPRM1
SCHEMBL4067222 1.00 TSHR (0.57) TSHRTHRBDNM1LMNAOPRM1
SCHEMBL28799590 0.97 DNM1 (0.58) TSHRTHRBDNM1LMNAOPRM1
Ammonia Solution, Strong SCHEMBL31488731 0.97 TSHR (0.53) TSHRTHRBDNM1LMNAOPRM1
SCHEMBL20962950 0.97 DNM1 (0.58) TSHRTHRBDNM1LMNAOPRM1
SCHEMBL10490584 0.96 OPRM1 (0.53) TSHRTHRBDNM1LMNAOPRM1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 69 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120005519-A Curable composition for organic EL element sealing agent, cured film, organic EL element, and method for producing same JSR株式会社 2025-05-16 CN disclosed
CN-112469723-B Cationically curable compositions with latent reducing agents exhibiting low cure temperatures 汉高股份有限及两合公司 2024-09-20 CN disclosed
CN-118266072-A Liquid molding compounds, and reaction products thereof that become electroplatable when exposed to laser energy 汉高股份有限及两合公司 2024-06-28 CN disclosed
CN-115715313-A Flux compatible epoxy-anhydride adhesive compositions for low gap underfill applications 汉高股份有限及两合公司 2023-02-24 CN disclosed
CN-109196414-B Sealing agent for liquid crystal display element, vertical conduction material, and liquid crystal display element 积水化学工业株式会社 2022-09-02 CN disclosed
CN-111655807-B Interlayers comprising polyesteramide compositions 首诺公司 2022-07-12 CN disclosed
CN-111684032-B Interlayers comprising polyesteramide compositions 首诺公司 2022-07-12 CN disclosed
EP-2755234-B1 COMPOSITION FOR ELECTRONIC DEVICE HENKEL AG & CO KGAA (DE) 2018-01-24 EP disclosed
US-9771500-B2 Sealant composition for electronic device HENKEL AG & CO. KGAA (DE) 2017-09-26 US disclosed
US-9576871-B2 Composition for electronic device HENKEL AG & CO. KGAA (DE) 2017-02-21 US disclosed
EP-1344789-A2 Thermosetting resin composition containing malemide and/or vinyl compounds QUANTUM MATERIALS, INC. (US) 2003-09-17 EP disclosed
US-20030109666-A1 Thermosetting resin compositions containing maleimide and/or vinyl compounds LOCTITE CORPORATION 2003-06-12 US disclosed
US-20030087999-A1 Thermosetting resin compositions containing maleimide and/or vinyl compounds LOCTITE CORPORATION 2003-05-08 US disclosed
US-20030060531-A1 Thermosetting resin compositions containing maleimide and/or vinyl compounds DERSHEM STEPHEN M (US) 2003-03-27 US disclosed
US-20030055121-A1 Thermosetting resin compositions containing maleimide and/or vinyl compounds DERSHEM STEPHEN M (US) 2003-03-20 US disclosed
US-20020193541-A1 Thermosetting resin compositions containing maleimide and/or vinyl compounds LOCTITE 2002-12-19 US disclosed
US-6034195-A BLEND CONTAINING UNSATURATED COMPOUND AND PEROXIDE FREE RADICAL CATALYST DEXTER CORPORATION (US) 2000-03-07 US disclosed
US-6034194-A BLEND CONTAINING UNSATURATED COMPOUND AND PEROXIDE FREE RADICAL CATALYST QUANTUM MATERIALS/DEXTER CORPORATION (US) 2000-03-07 US disclosed
EP-0778857-A2 THERMOSETTING RESIN COMPOSITIONS CONTAINING MALEIMIDE AND/OR VINYL COMPOUNDS QUANTUM MATERIALS, INC. (US) 1997-06-18 EP disclosed
WO-1996007691-A2 THERMOSETTING RESIN COMPOSITIONS CONTAINING MALEIMIDE AND/OR VINYL COMPOUNDS QUANTUM MATERIALS, INC. (US) 1996-03-14 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20030087999-A1 Thermosetting resin compositions containing maleimide and/or vinyl compounds SUV39H2, SUV39H1, VIM TSHR 4854/4885THRB 4730/4885DNM1 417/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.