SCHEMBL636148

SCHEMBL636148

[BiH3].[InH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1616070 1.00
SCHEMBL1616074 0.82
SCHEMBL6414983 0.82
SCHEMBL1615456 0.82
SCHEMBL264064 0.82
SCHEMBL25217448 0.82
SCHEMBL735758 0.82
SCHEMBL8451974 0.82
SCHEMBL5534260 0.82
SCHEMBL2515533 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2154 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4591402-B1 HIGH-VELOCITY AIR-FUEL COATINGS FOR CONDUCTOR CORROSION RESISTANCE CATERPILLAR INC (US) 2026-03-25 EP claimed
EP-4593155-B1 BATTERY SYSTEM WITH IMPROVED COOLING CIRCUIT SAMSUNG SDI CO LTD (KR) 2026-02-25 EP claimed
WO-2025229143-A1 METHOD FOR PREPARING A CATALYST COMPOSITION AVANTIUM KNOWLEDGE CENTRE B.V. (NL) 2025-11-06 WO claimed
US-20250279323-A1 SENSOR PACKAGES TEXAS INSTRUMENTS INCORPORATED 2025-09-04 US claimed
EP-4593155-A1 BATTERY SYSTEM WITH IMPROVED COOLING CIRCUIT Samsung SDI Co., Ltd. (KR) 2025-07-30 EP claimed
US-20250239679-A1 BATTERY SYSTEM WITH IMPROVED COOLING CIRCUIT SAMSUNG SDI CO., LTD. (KR) 2025-07-24 US claimed
CN-120076284-A Variable-frequency phase-change wave-absorbing gasket and preparation method thereof 深圳市傲川科技有限公司 2025-05-30 CN claimed
CN-120006198-A Metal foil with liquid metal layer and preparation method and application thereof 中国科学院理化技术研究所 2025-05-16 CN claimed
CN-119947062-A Metal heat conducting sheet and preparation method and application thereof 苏州泰吉诺新材料科技有限公司 2025-05-06 CN claimed
CN-119912887-A High-heat-conductivity low-thermal-resistance epoxy heat-conducting adhesive applied to high-power LED heat-radiating component and preparation method 赛伦(厦门)新材料科技有限公司 2025-05-02 CN claimed
CN-1098559-A The manufacture method of semiconductor film film manufacturing method and hall effect devices MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 1995-02-08 CN claimed
CN-1089000-A The electrode special that is used for preparing L-semicystine by electrolytic reduction UNIV FUJIAN (CN) 1994-07-06 CN claimed
EP-0566875-A2 Piezoelectric ink jet print head and method of making the same EASTMAN KODAK COMPANY (US) 1993-10-27 EP claimed
EP-0130834-B1 DUPLEX METAL ALLOY/POLYMER COMPOSITIONS THE DOW CHEMICAL COMPANY (US) 1988-03-02 EP claimed
US-4612216-A Method for making duplex metal alloy/polymer composites THE DOW CHEMICAL COMPANY (US) 1986-09-16 US claimed
EP-0063393-B1 METHOD OF PRODUCING A LOW-PRESSURE MERCURY VAPOUR DISCHARGE LAMP Koninklijke Philips Electronics N.V. (NL) 1986-06-18 EP claimed
US-4510208-A MULTILAYER COMPOSITE THE DOW CHEMICAL COMPANY (US) 1985-04-09 US claimed
EP-0130834-A2 Duplex metal alloy/polymer compositions THE DOW CHEMICAL COMPANY (US) 1985-01-09 EP claimed
US-4312114-A Method of preparing a thin-film, single-crystal photovoltaic detector THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) 1982-01-26 US claimed
US-4268541-A Process for producing a material having a vapor-deposited metal layer, and process for producing a recording material FUJI PHOTO FILM CO., LTD. (JP) 1981-05-19 US claimed