Malic Acid

Malic Acid

SCHEMBL6368134

CCCC[Sn+3].CCCC[Sn+3].O=C([O-])CC(O)C(=O)[O-].O=C([O-])CC(O)C(=O)[O-].O=C([O-])CC(O)C(=O)[O-]

nearest known ligand 0.61

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

CACNA1CCACNA1DCACNA1FCACNA1SCSF1RDRD2FLT1FLT3FLT4HTR1BHTR1DHTR1FKDRKITMETOPRD1OPRK1OPRM1PDGFRAPDGFRBRET

The experimentally established mechanism targets of Malic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
CA4 P22748 2/20 0.61
CA1 P00915 3/20 0.39
NFKB1 P19838 2/20 0.38
CA2 P00918 4/20 0.37
GPR84 Q9NQS5 1/20 0.37
SLC22A16 Q86VW1 1/20 0.35
CYP3A4 P08684 1/20 0.34
TSHR P16473 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Malic Acid SCHEMBL6372959 0.93 CA4 (0.57) CA4CA1NFKB1CA2GPR84
SCHEMBL6072518 0.82 CA2 (0.47) CA4CA1NFKB1CA2GPR84
Malic Acid SCHEMBL3593174 0.81 CA4 (0.94) CA4NFKB1CA2SLC22A16CYP3A4
L-Lactic Acid SCHEMBL6072253 0.79 CA1 (0.48) CA1NFKB1CA2GPR84CYP3A4
Malic Acid SCHEMBL29359514 0.79 CA4 (0.59) CA4CA1NFKB1CA2GPR84
Malic Acid SCHEMBL511412 0.79 CA4 (0.59) CA4CA1NFKB1CA2GPR84
Tetrabuthylammonium SCHEMBL5874718 0.79 CA4 (0.59) CA4CA1NFKB1
SCHEMBL6072819 0.77 CA1 (0.50) CA1NFKB1CA2CYP3A4TSHR
Malic Acid SCHEMBL27944022 0.77 CA4 (0.81) CA4CA1NFKB1CA2SLC22A16
Malic Acid SCHEMBL674352 0.77 CA4 (0.55) CA4CA1NFKB1CA2GPR84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4741462-A1 PLASTICIZER COMPOSITION Kao Corporation (JP) 2026-05-13 EP disclosed
EP-4682199-A1 MEMBER, AND SEMICONDUCTOR MANUFACTURING?RELATED DEVICE Daikin Industries, Ltd. (JP) 2026-01-21 EP disclosed
US-12486215-B2 Method of manufacturing diester-based compound LG CHEM, LTD. (KR) 2025-12-02 US disclosed
CN-118184509-A Process for producing diester compound 株式会社LG化学 2024-06-14 CN disclosed
CN-114829334-B Process for producing diester compound 株式会社LG化学 2024-04-02 CN disclosed
US-20230348355-A1 METHOD OF MANUFACTURING DIESTER-BASED COMPOUND LG CHEM, LTD. (KR) 2023-11-02 US disclosed
US-20230290550-A1 MAGNETIC RESIN COMPOSITION FOR INJECTION MOLDING, AND INJECTION MOLDED BODY FOR MAGNETIC SHIELDS TOYO INK SC HOLDINGS CO., LTD. (JP) 2023-09-14 US disclosed
WO-2023120301-A1 MAGNETIC RESIN COMPOSITION FOR INJECTION MOLDING, AND INJECTION-MOLDED ARTICLE FOR MAGNETIC SHIELD 東洋インキSCホールディングス株式会社 2023-06-29 WO disclosed
US-20230150911-A1 METHOD OF MANUFACTURING DIESTER-BASED COMPOUND LG CHEM, LTD. (KR) 2023-05-18 US disclosed
EP-4180485-A1 MAGNETIC RESIN COMPOSITION FOR INJECTION MOLDING, AND INJECTION MOLDED BODY FOR MAGNETIC SHIELDS Toyo Ink SC Holdings Co., Ltd. (JP) 2023-05-17 EP disclosed
CN-114829334-A Process for producing diester compound 株式会社LG化学 2022-07-29 CN disclosed
CN-114829335-A Preparation method of diester material 株式会社LG化学 2022-07-29 CN disclosed
EP-4032875-A1 METHOD FOR PREPARING DIESTER COMPOUND LG Chem, Ltd. (KR) 2022-07-27 EP disclosed
EP-4023629-A1 METHOD FOR PREPARING DIESTER COMPOUND LG Chem, Ltd. (KR) 2022-07-06 EP disclosed
CN-104011091-B The manufacture method of chlorinated vinyl chloride-based resin TOKUYAMA SEKISUI Co.,Ltd. (JP) 2016-05-04 CN disclosed
CN-104011091-A Method for producing chlorinated vinyl chloride-based resin TOKUYAMA SEKISUI CO LTD 2014-08-27 CN disclosed
US-20050107501-A1 Compound resin molding and process for producing the same SUZUKA FUJI XEROX CO., LTD. (JP) 2005-05-19 US disclosed
EP-1466723-A1 COMPOSITE RESIN MOLDING AND PROCESS FOR PRODUCING THE SAME Suzuka Fuji Xerox Co., Ltd. (JP) 2004-10-13 EP disclosed