SCHEMBL63712

SCHEMBL63712

C=C(C)C(=O)OCCO[Si](C)(OCCOC(=O)C(=C)C)OCCOC(=O)C(=C)C

nearest known ligand 0.57

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.57
TSHR P16473 4/20 0.50
ALDH1A1 P00352 3/20 0.44
POLB P06746 1/20 0.38
APEX1 P27695 1/20 0.38
HTT P42858 1/20 0.38
TDP1 Q9NUW8 1/20 0.38
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL491412 0.93 THRB (0.59) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL679847 0.88 THRB (0.57) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL322653 0.88 THRB (0.57) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL65533 0.85 THRB (0.59) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL6142874 0.84 THRB (0.74) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL15636 0.84 THRB (0.74) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL10397319 0.84 THRB (0.53) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL13129202 0.84 THRB (0.58) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL11806859 0.82 THRB (0.61) THRBTSHRALDH1A1POLBAPEX1
SCHEMBL907714 0.82 THRB (0.52) THRBTSHRALDH1A1POLBAPEX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 115 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-60053514-A None JP disclosed
US-12319814-B2 Polyamideimide resin, resin composition, and semiconductor device RESONAC CORPORATION (JP) 2025-06-03 US disclosed
CN-109155244-B Adhesive film and dicing die bonding integrated film 株式会社力森诺科 2024-11-26 CN disclosed
CN-118995087-A Adhesive film and dicing film-die bonding film 株式会社力森诺科 2024-11-22 CN disclosed
CN-114026150-B Polyamide-imide resin, resin composition, and semiconductor device 株式会社力森诺科 2024-04-05 CN disclosed
CN-112789323-B Resin composition, cured product, and semiconductor device 株式会社力森诺科 2024-02-02 CN disclosed
EP-4303250-A1 POLY(AMIDE-IMIDE) RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE Resonac Corporation (JP) 2024-01-10 EP disclosed
US-20240002705-A1 ADHESIVE COMPOSITION NIPPON SODA CO., LTD. (JP) 2024-01-04 US disclosed
EP-4026867-B1 POLYAMIDEIMIDE RESIN, RESIN COMPOSITION, AND SEMICONDUCTOR DEVICE RESONAC CORP (JP) 2023-12-06 EP disclosed
US-11795353-B2 Adhesive composition NIPPON SODA CO., LTD. (JP) 2023-10-24 US disclosed
US-6400492-B1 Electrophoretic display liquid, and electrophoretic display medium, method and device using the liquid RICOH COMPANY LIMITED (JP) 2002-06-04 US disclosed
US-20020032250-A1 Photocuring resin compositions, photocuring sheets and molded article using the same, and processes of production thereof MITSUBISHI RAYON CO., LTD. (JP) 2002-03-14 US disclosed
EP-1170109-A1 Photocuring resin compositions, photocuring sheets and molded article using the same and processes of production thereof Mitsubishi Rayon Co., Ltd. (JP) 2002-01-09 EP disclosed
US-6136886-A RUBBER KABUSHIKI KAISHA SHOFU (JP) 2000-10-24 US disclosed
US-6063830-A SILICA AND URETHANEACRYLATE KABUSHIKI KAISHA SHOFU (JP) 2000-05-16 US disclosed
EP-0534753-B1 Composite composition having high transparency and process for producing same MITSUBISHI RAYON CO (JP) 1996-12-18 EP disclosed
US-5385988-A A curable blends consisting of an additional polymer and a polysilicates, polysiloxanes or polysilsesquioxanes in a dispersion system of colloidal silica to form rigid, tough interpenetrating polymer networks MITSUBISHI RAYON CO., LTD. (JP) 1995-01-31 US disclosed
EP-0534753-A1 Composite composition having high transparency and process for producing same MITSUBISHI RAYON CO., LTD. (JP) 1993-03-31 EP disclosed
JP-S6053514-A RESIN COMPOSITION HITACHI CHEM CO LTD 1985-03-27 JP disclosed
JP-S0653514-A 0001-01-01 JP disclosed