SCHEMBL6403729

SCHEMBL6403729

Nc1ccc(-c2nc3c(N)cccc3s2)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
APP P05067 12/20 0.60
MMP9 P14780 1/20 0.60
MMP8 P22894 1/20 0.60
MAPT P10636 8/20 0.51
KDM4E B2RXH2 7/20 0.51
GAA P10253 6/20 0.51
NPC1 O15118 6/20 0.51
RAB9A P51151 6/20 0.51
ALDH1A1 P00352 5/20 0.51
GLA P06280 4/20 0.51
MEN1 O00255 3/20 0.51
KMT2A Q03164 3/20 0.51
POLB P06746 3/20 0.51
NFKB1 P19838 3/20 0.51
NFKB2 Q00653 3/20 0.51
RELA Q04206 3/20 0.51
GFER P55789 2/20 0.51
SMN1; SMN2 Q16637 3/20 0.46
TP53 P04637 2/20 0.46
HPGD P15428 3/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10873450 0.89 MAPT (0.73) APPMMP9MMP8MAPTKDM4E
SCHEMBL3385440 0.88 KDM4E (0.50) APPMMP9MMP8MAPTKDM4E
SCHEMBL28174501 0.85 APP (0.58) APPMMP9MMP8MAPTKDM4E
SCHEMBL3680730 0.83 SMN1; SMN2 (0.60) APPMMP9MMP8MAPTKDM4E
SCHEMBL8535704 0.83 ALDH1A1 (0.60) APPMMP9MMP8MAPTKDM4E
SCHEMBL6396202 0.83 MAPT (0.65) APPMMP9MMP8MAPTKDM4E
SCHEMBL7455542 0.82 APP (0.55) APPMMP9MMP8MAPTKDM4E
2-Phenylbenzo[D]Thiazole SCHEMBL12479298 0.81 APP (0.62) APPMMP9MMP8MAPTKDM4E
SCHEMBL27307376 0.81 PRKDC (0.48) APPMMP9MMP8NPC1RAB9A
SCHEMBL1983852 0.80 CYP3A4 (0.63) APPMMP9MMP8MAPTKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20050079185-A1 Vaccine formulations MERIAL, INC. 2005-04-14 US claimed
US-20050170077-A1 Adhesion method SHIPLEY COMPANY, L.L.C. (US) 2005-08-04 US disclosed
US-20040161545-A1 Adhesion method SHIPLEY COMPANY, L.L.C. 2004-08-19 US disclosed
EP-0464371-A1 Polyamic acid structures, and methods of fabrication thereof International Business Machines Corporation (US) 1992-01-08 EP disclosed
US-5004627-A Polyimides for mold release ETHYL CORPORATION (US) 1991-04-02 US disclosed
EP-0192937-B1 FLEXIBLE POLYIMIDE MULTILAYER LAMINATE Akzo Patente GmbH (DE) 1990-10-24 EP disclosed
EP-0249744-B1 PROCESS FOR MAKING POLYIMIDE-METAL LAMINATES AKZO N.V. (NL) 1989-10-11 EP disclosed
EP-0167020-B1 FLEXIBLE POLYIMIDE MULTILAYER LAMINATE Akzo Patente GmbH (DE) 1988-11-23 EP disclosed
US-4746561-A Polyimide-containing cover layer for a printed circuit element AKZO N.V. (NL) 1988-05-24 US disclosed
EP-0249744-A1 Process for making polyimide-metal laminates AKZO N.V. (NL) 1987-12-23 EP disclosed
EP-0116297-B1 POLYIMIDE LAMINATE WITH PEEL-RESISTANCE AND METHOD OF MANUFACTURING IT Akzo GmbH (DE) 1987-12-02 EP disclosed
US-4705720-A FOR PRINTED CIRCUITS AKZO NV (NL) 1987-11-10 US disclosed
US-4699841-A PRINTED CIRCUITS AKZO NV (NL) 1987-10-13 US disclosed
US-4675246-A DIRECT BONDING WITH SUBSTRATE AND POLYIMIDE AKZO NV (NL) 1987-06-23 US disclosed
EP-0194413-A2 Printed circuit element with a cover sheet containing polyimide Akzo Patente GmbH (DE) 1986-09-17 EP disclosed
EP-0167020-A2 Flexible polyimide multilayer laminate Akzo Patente GmbH (DE) 1986-01-08 EP disclosed
US-4522880-A EXTRUSION ON SUBSTRATE, THEN CURING AKZONA INCORPORATED (US) 1985-06-11 US disclosed
EP-0116297-A2 Polyimide laminate with peel-resistance and method of manufacturing it Akzo GmbH (DE) 1984-08-22 EP disclosed