SCHEMBL64038

SCHEMBL64038

COCCOC(=O)CCN(CCOC(C)=O)CCOC(C)=O

nearest known ligand 0.37

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.37
TSHR P16473 3/20 0.37
CHRM5 P08912 2/20 0.37
CHRM1 P11229 2/20 0.37
CHRM3 P20309 2/20 0.37
PGR P06401 1/20 0.37
CHRM2 P08172 1/20 0.37
CHRM4 P08173 1/20 0.37
HTR1A P08908 1/20 0.37
CHRNB2 P17787 1/20 0.37
TBXA2R P21731 1/20 0.37
CHRNB4 P30926 1/20 0.37
CHRNA3 P32297 1/20 0.37
CHRNA7 P36544 1/20 0.37
CHRNA4 P43681 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
CHRNA10 Q9GZZ6 1/20 0.37
CHRNA9 Q9UGM1 1/20 0.37
DNM1 Q05193 1/20 0.37
GALR3 O60755 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14182331 1.00 ALDH1A1 (0.37) ALDH1A1TSHRCHRM5CHRM1CHRM3
SCHEMBL14182296 0.95 ALDH1A1 (0.42) ALDH1A1TSHRCHRM5CHRM1CHRM3
SCHEMBL14182326 0.95 CHRM5 (0.38) ALDH1A1TSHRCHRM5CHRM1CHRM3
SCHEMBL14182354 0.95 CHRM5 (0.38) ALDH1A1TSHRCHRM5CHRM1CHRM3
SCHEMBL4014737 0.94 GALR3 (0.33) ALDH1A1TSHRCHRM5CHRM1CHRM3
SCHEMBL64335 0.93 ALDH1A1 (0.42) ALDH1A1TSHRCHRM5CHRM1CHRM3
SCHEMBL14182332 0.93 ALDH1A1 (0.42) ALDH1A1TSHRCHRM5CHRM1CHRM3
SCHEMBL14182350 0.89 MEN1 (0.41) ALDH1A1TSHRDNM1MEN1KMT2A
SCHEMBL14024282 0.89 MEN1 (0.41) ALDH1A1TSHRDNM1MEN1KMT2A
SCHEMBL14182328 0.88 ALDH1A1 (0.41) ALDH1A1CHRM5CHRM1CHRM3PGR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 720 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4660703-A2 METAL-CONTAINING FILM PATTERNING PROCESS Shin-Etsu Chemical Co., Ltd. (JP) 2025-12-10 EP disclosed
US-20250372377-A1 METAL-CONTAINING FILM PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-12-04 US disclosed
US-20250251665-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN FILM, PHOTOSENSITIVE DRY FILM, AND PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-08-07 US disclosed
EP-4553100-A1 POLYMER, POSITIVE AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITIONS, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-14 EP disclosed
US-20250147420-A1 Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-05-08 US disclosed
US-12055853-B2 Photosensitive resin composition, laminate, and pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-08-06 US disclosed
US-12032287-B2 Resist material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-07-09 US disclosed
US-20240184206-A1 LAMINATE, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR PATTERNING SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-06-06 US disclosed
US-11994798-B2 Resist material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2024-05-28 US disclosed
US-20010051315-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-12-13 US disclosed
US-20010051316-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-12-13 US disclosed
US-20010044071-A1 Novel ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD (JP) 2001-11-22 US disclosed
EP-1150166-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-31 EP disclosed
EP-1149825-A2 Ester compounds, polymers, resist compositions and patterning process Shin-Etsu Chemical Co., Ltd. (JP) 2001-10-31 EP disclosed
EP-1150167-A1 Polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-31 EP disclosed
EP-1148044-A1 Ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-24 EP disclosed
EP-1148045-A1 Ester compounds, polymers, resist compositions and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-10-24 EP disclosed
US-20010031424-A1 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. OF (JP) 2001-10-18 US disclosed
EP-1132774-A2 Polymer, resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2001-09-12 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 ALDH1A1 3281/4885TSHR 3402/4885CHRM5 2739/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.