SCHEMBL6418946

SCHEMBL6418946

C=C(CC(C)[Si](C)(C)C)C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
TET2 Q6N021 4/20 0.46
TET3 O43151 1/20 0.46
TET1 Q8NFU7 1/20 0.46
GRIK1 P39086 1/20 0.45
GRIK2 Q13002 1/20 0.45
GRM1 Q13255 1/20 0.45
GRM2 Q14416 1/20 0.45
ALOX15 P16050 1/20 0.31
HSD17B10 Q99714 1/20 0.31
CA2 P00918 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21715 0.75
SCHEMBL8970587 0.75 SLC22A6 (0.41)
Hydrochloric Acid SCHEMBL16756617 0.73 TET2 (0.52) TET2TET3TET1GRIK1GRIK2
SCHEMBL36381 0.73
SCHEMBL3045176 0.71 TET2 (0.56) TET2TET3TET1GRIK1GRIK2
SCHEMBL11241113 0.71 CA2 (0.56) CA2
SCHEMBL183599 0.71
Acetic Acid SCHEMBL10488044 0.71 TET2 (0.50) TET2TET3TET1GRIK1GRIK2
Potassium Ion SCHEMBL11221311 0.71 CA2 (0.50) CA2
SCHEMBL2772613 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6887649-B2 Multi-layered resist structure and manufacturing method of semiconductor device FUJITSU LIMITED (JP) 2005-05-03 US disclosed
US-6677100-B2 COPOLYMER OF AN ACRYLATE OR METHACRYLATE MONOMER HAVING A SILYL (SI), SILANOL, SILANEDIOL, SILANETRIOL, GERMANYL (GE), OR STANNOUS (SN) GROUP, AND MALEIC ANHYDRIDE; FOR EXCIMER LASER LITHOGRAPHY SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-01-13 US disclosed
US-20020192595-A1 Multi-layered resist structure and manufacturing method of semiconductor device FUJITSU LIMITED (JP) 2002-12-19 US disclosed
US-20020072009-A1 Photosensitive polymer containing Si, Ge or Sn and resist composition comprising the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2002-06-13 US disclosed