⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28055926 | 0.91 | — | — | |
| SCHEMBL9309258 | 0.80 | ALDH1A1 (0.38) | — | |
| SCHEMBL6533718 | 0.79 | ALDH1A1 (0.31) | — | |
| SCHEMBL9741273 | 0.77 | — | — | |
| SCHEMBL8512777 | 0.76 | TSHR (0.47) | — | |
| SCHEMBL9308723 | 0.74 | MAPT (0.31) | — | |
| SCHEMBL28565015 | 0.74 | — | — | |
| SCHEMBL2799211 | 0.73 | TSHR (0.53) | — | |
| SCHEMBL9309423 | 0.73 | TSHR (0.53) | — | |
| SCHEMBL9841072 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-9012725-A | — | — | None | — | — | JP | disclosed |
| WO-2024143211-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143210-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143212-A1 | METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143209-A1 | METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024095885-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED OBJECT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED OBJECT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-05-10 | — | — | WO | disclosed |
| US-20240126171-A1 | HOLLOW STRUCTURE, ELECTRONIC COMPONENT USING SAME, AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2024-04-18 | — | — | US | disclosed |
| WO-2024071237-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-04-04 | — | — | WO | disclosed |
| WO-2024070963-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | 富士フイルム株式会社 | 2024-04-04 | — | — | WO | disclosed |
| EP-4276055-A1 | HOLLOW STRUCTURE, ELECTRONIC COMPONENT USING SAME, AND NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION | Toray Industries, Inc. (JP) | 2023-11-15 | — | — | EP | disclosed |
| US-8119744-B2 | Curable silicone composition | DOW CORNING TORAY CO., LTD. (JP) | 2012-02-21 | — | — | US | disclosed |
| US-7994246-B2 | Curable silicone composition and electronic component | DOW CORNING TORAY COMPANY, LTD. (JP) | 2011-08-09 | — | — | US | disclosed |
| EP-2201068-B1 | CURABLE SILICONE COMPOSITION AND CURED PRODUCT THEREOF | DOW CORNING TORAY CO LTD (JP) | 2011-06-29 | — | — | EP | disclosed |
| US-20100140537-A1 | Curable Silicone Composition | DOW CORNING TORAY CO., LTD. (JP) | 2010-06-10 | — | — | US | disclosed |
| EP-1776420-B1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION | DOW CORNING TORAY CO LTD (JP) | 2010-02-24 | — | — | EP | disclosed |
| US-20080262157-A1 | Curable Organopolysiloxane Composition | DOW CORNING TORAY COMPANY, LTD. (JP) | 2008-10-23 | — | — | US | disclosed |
| EP-1776420-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION | Dow Corning Toray Co., Ltd. (JP) | 2007-04-25 | — | — | EP | disclosed |
| WO-2005123839-A1 | CURABLE ORGANOPOLYSILOXANE COMPOSITION | DOW CORNING TORAY CO., LTD. (JP) | 2005-12-29 | — | — | WO | disclosed |
| US-5837792-A | MODIFIED POLYSILOXANES WITH HYDROXYPHENYLDIARYL-S-TRIAZINE GROUPS FOR LIGHT, HEAT AND OXYGEN STABILIZATION | CIBA SPECIALTY CHEMICALS CORPORATION (US) | 1998-11-17 | — | — | US | disclosed |
| JP-H0912725-A | POLYSILOXANE PHOTO STABILIZER | CIBA GEIGY AG | 1997-01-14 | — | — | JP | disclosed |