⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29720892 | 0.87 | — | — | |
| SCHEMBL29366439 | 0.82 | — | — | |
| SCHEMBL29493546 | 0.82 | — | — | |
| SCHEMBL29368387 | 0.82 | — | — | |
| SCHEMBL8912718 | 0.82 | — | — | |
| SCHEMBL28844086 | 0.82 | — | — | |
| SCHEMBL29405529 | 0.82 | — | — | |
| SCHEMBL4574627 | 0.82 | — | — | |
| SCHEMBL151515 | 0.82 | — | — | |
| SCHEMBL8510286 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110497116-A | A kind of mutative scale boron nitrogen graphene modified layer solder, Preparation method and use | UNIV NORTH CHINA WATER RESOURCES & ELECTRIC POWER | 2019-11-26 | — | — | CN | claimed |
| CN-119132974-A | Nickel-palladium-gold lead frame and preparation method thereof | 宁波港波电子有限公司 | 2024-12-13 | — | — | CN | disclosed |
| CN-110497116-A | A kind of mutative scale boron nitrogen graphene modified layer solder, Preparation method and use | UNIV NORTH CHINA WATER RESOURCES & ELECTRIC POWER | 2019-11-26 | — | — | CN | disclosed |
| CN-1274744-C | Flame retardant molding compositions | HENKEL LOCTITE CORP (US) | 2006-09-13 | — | — | CN | disclosed |
| EP-1414895-B1 | FLAME RETARDANT MOLDING COMPOSITIONS | HENKEL CORP (US) | 2005-04-13 | — | — | EP | disclosed |
| CN-1537137-A | Flame retardant molding compositions | ��˶����̩�ع�˾ | 2004-10-13 | — | — | CN | disclosed |
| EP-1414895-A1 | FLAME RETARDANT MOLDING COMPOSITIONS | Henkel Loctite Corporation (US) | 2004-05-06 | — | — | EP | disclosed |
| US-6610406-B2 | Used to coat electronic or electrical devices such as semiconductors, diodes, and integrated circuits; free of halogen, phosphorus, and antimony | HENKEL LOCKTITE CORPORATION | 2003-08-26 | — | — | US | disclosed |
| WO-2003014210-A1 | FLAME RETARDANT MOLDING COMPOSITIONS | HENKEL LOCTITE CORPORATION (US) | 2003-02-20 | — | — | WO | disclosed |
| US-20020143091-A1 | Used to coat electronic or electrical devices such as semiconductors, diodes, and integrated circuits; free of halogen, phosphorus, and antimony | LOCTITE CORPORATION | 2002-10-03 | — | — | US | disclosed |