⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30747985 | 0.87 | — | — | |
| SCHEMBL81562 | 0.87 | — | — | |
| SCHEMBL1672678 | 0.87 | — | — | |
| SCHEMBL6436378 | 0.87 | — | — | |
| SCHEMBL31678966 | 0.87 | — | — | |
| SCHEMBL30489063 | 0.87 | — | — | |
| SCHEMBL28338161 | 0.75 | — | — | |
| Phosphine SCHEMBL15455959 | 0.75 | — | — | |
| SCHEMBL30906929 | 0.75 | — | — | |
| SCHEMBL1169745 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119132974-A | Nickel-palladium-gold lead frame and preparation method thereof | 宁波港波电子有限公司 | 2024-12-13 | — | — | CN | claimed |
| CN-117568907-B | Electroplating process of nickel-palladium-gold lead frame | 天水华洋电子科技股份有限公司 | 2024-05-17 | — | — | CN | claimed |
| CN-117568907-A | Novel electroplating process of nickel-palladium-gold lead frame | 天水华洋电子科技股份有限公司 | 2024-02-20 | — | — | CN | claimed |
| CN-223357105-U | Nickel-palladium-gold lead frame for improving cutting layering | 珠海市钯金电子科技有限公司 | 2025-09-19 | — | — | CN | disclosed |
| CN-223357105-U | Nickel-palladium-gold lead frame for improving cutting layering | 珠海市钯金电子科技有限公司 | 2025-09-19 | — | — | CN | disclosed |
| CN-119752396-B | Polyimide adhesive and preparation method thereof, and temperature-resistant adhesive tape and preparation method and application thereof | 安徽工程大学 | 2025-06-13 | — | — | CN | disclosed |
| CN-119752396-A | Polyimide adhesive and preparation method thereof, and temperature-resistant adhesive tape and preparation method and application thereof | 安徽工程大学 | 2025-04-04 | — | — | CN | disclosed |
| CN-119132974-A | Nickel-palladium-gold lead frame and preparation method thereof | 宁波港波电子有限公司 | 2024-12-13 | — | — | CN | disclosed |
| CN-119132974-A | Nickel-palladium-gold lead frame and preparation method thereof | 宁波港波电子有限公司 | 2024-12-13 | — | — | CN | disclosed |
| CN-119132974-A | Nickel-palladium-gold lead frame and preparation method thereof | 宁波港波电子有限公司 | 2024-12-13 | — | — | CN | disclosed |
| CN-117568907-B | Electroplating process of nickel-palladium-gold lead frame | 天水华洋电子科技股份有限公司 | 2024-05-17 | — | — | CN | disclosed |
| CN-117568907-B | Electroplating process of nickel-palladium-gold lead frame | 天水华洋电子科技股份有限公司 | 2024-05-17 | — | — | CN | disclosed |
| CN-117568907-A | Novel electroplating process of nickel-palladium-gold lead frame | 天水华洋电子科技股份有限公司 | 2024-02-20 | — | — | CN | disclosed |
| CN-117568907-A | Novel electroplating process of nickel-palladium-gold lead frame | 天水华洋电子科技股份有限公司 | 2024-02-20 | — | — | CN | disclosed |
| CN-117568907-A | Novel electroplating process of nickel-palladium-gold lead frame | 天水华洋电子科技股份有限公司 | 2024-02-20 | — | — | CN | disclosed |
| CN-114926467-B | Full-automatic lead frame counting method and device | 新恒汇电子股份有限公司 | 2022-10-21 | — | — | CN | disclosed |
| CN-114926467-A | Full-automatic lead frame counting method and device | 新恒汇电子股份有限公司 | 2022-08-19 | — | — | CN | disclosed |
| CN-216671621-U | Nickel-palladium-gold lead frame capable of improving cutting layering | 深圳市金业达电子有限公司 | 2022-06-03 | — | — | CN | disclosed |
| CN-216671621-U | Nickel-palladium-gold lead frame capable of improving cutting layering | 深圳市金业达电子有限公司 | 2022-06-03 | — | — | CN | disclosed |
| CN-216671621-U | Nickel-palladium-gold lead frame capable of improving cutting layering | 深圳市金业达电子有限公司 | 2022-06-03 | — | — | CN | disclosed |