SCHEMBL6441097

SCHEMBL6441097

O=C1c2cccc(O)c2C(=O)N1c1ccc(O)cc1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.58
APAF1 O14727 1/20 0.58
NR1H3 Q13133 1/20 0.57
ANPEP P15144 2/20 0.56
DPP4 P27487 2/20 0.56
ESR1 P03372 4/20 0.54
ESR2 Q92731 3/20 0.54
HSPA1A P0DMV8 1/20 0.51
PABPC1 P11940 1/20 0.51
ADORA2A P29274 1/20 0.51
BRD4 O60885 1/20 0.50
MEN1 O00255 2/20 0.48
USP2 O75604 2/20 0.48
KMT2A Q03164 2/20 0.48
TYMS P04818 1/20 0.48
LMNA P02545 1/20 0.48
AHR P35869 1/20 0.47
NPC1 O15118 1/20 0.47
RAB9A P51151 1/20 0.47
ATM Q13315 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9630664 0.85 ANPEP (0.56) NR1H3ANPEPDPP4HSPA1APABPC1
SCHEMBL15323075 0.85 POLB (0.56) POLBAPAF1NR1H3ESR1ESR2
SCHEMBL9588487 0.83 NPC1 (0.66) POLBNR1H3ANPEPDPP4ESR1
SCHEMBL3373539 0.83 ANPEP (0.54) NR1H3ANPEPDPP4HSPA1APABPC1
SCHEMBL887456 0.81 NR1H3 (0.79) POLBAPAF1NR1H3ESR1ESR2
SCHEMBL3371679 0.81 ANPEP (0.48) NR1H3ANPEPDPP4HSPA1APABPC1
SCHEMBL3373435 0.81 ANPEP (0.48) NR1H3ANPEPDPP4HSPA1APABPC1
SCHEMBL3376342 0.79 CCR9 (0.47) POLBANPEPDPP4HSPA1APABPC1
SCHEMBL11308425 0.79 KDM4E (0.62) POLBAPAF1NR1H3ESR1ESR2
SCHEMBL10792923 0.77 POLB (0.70) POLBAPAF1NR1H3ESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-1238423-C Thermoplastic resin composition and molded object thereof POLYPLASTICS CO (JP) 2006-01-25 CN disclosed
US-6956072-B1 Thermoplastic resin composition and molded object thereof POLYPLASTICS CO., LTD. (JP) 2005-10-18 US disclosed
CN-1361810-A Thermoplastic resin composition and molded object thereof POLYPLASTICS CO (JP) 2002-07-31 CN disclosed
US-5246751-A Poly(hydroxy ether imides) as barrier packaging materials THE DOW CHEMICAL COMPANY (US) 1993-09-21 US disclosed