SCHEMBL644386

SCHEMBL644386

O[Si](O)(O)O.[AlH3].[Hf]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12470801 0.91
SCHEMBL42700 0.91
SCHEMBL8503534 0.91
SCHEMBL17263 0.91
SCHEMBL21457927 0.91
SCHEMBL2400500 0.91
SCHEMBL11356950 0.91
SCHEMBL375121 0.91
SCHEMBL23716983 0.83
SCHEMBL1369435 0.83

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 147 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220376176-A1 METHODS OF FORMING ELECTRONIC DEVICES COMPRISING METAL OXIDE MATERIALS MICRON TECHNOLOGY INC (US) 2022-11-24 US claimed
US-11444243-B2 Electronic devices comprising metal oxide materials and related methods and systems MICRON TECHNOLOGY, INC. (US) 2022-09-13 US claimed
EP-4052297-A1 ELECTRONIC DEVICES COMPRISING METAL OXIDE MATERIALS AND RELATED METHODS AND SYSTEMS Micron Technology, Inc. (US) 2022-09-07 EP claimed
CN-114631198-A Electronic devices including metal oxide materials and related methods and systems 美光科技公司 2022-06-14 CN claimed
US-20210126193-A1 ELECTRONIC DEVICES COMPRISING METAL OXIDE MATERIALS AND RELATED METHODS AND SYSTEMS MICRON TECHNOLOGY, INC. 2021-04-29 US claimed
US-20130015518-A1 SEMICONDUCTOR MEMORY DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 2013-01-17 US claimed
US-8252674-B2 Transistors with multilayered dielectric films and methods of manufacturing such transistors SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-08-28 US claimed
US-20110287622-A1 Transistors with Multilayered Dielectric Films and Methods of Manufacturing Such Transistors LIM HA-JIN (KR) 2011-11-24 US claimed
CN-102197459-A Vapor deposition method for ternary compounds APPLIED MATERIALS INC 2011-09-21 CN claimed
US-8013402-B2 Transistors with multilayered dielectric films SAMSUNG ELECTRONICS CO., LTD. (KR) 2011-09-06 US claimed
US-20100102417-A1 VAPOR DEPOSITION METHOD FOR TERNARY COMPOUNDS APPLIED MATERIALS, INC. (US) 2010-04-29 US claimed
US-20100025781-A1 Transistors with Multilayered Dielectric Films and Methods of Manufacturing Such Transistors LIM HA-JIN 2010-02-04 US claimed
CN-100449775-C High density composite metal-insulator-metal capacitor with reduced voltage dependence in semiconductor chips NEWPORT FAB DBA JAZZ SEMICOND (US) 2009-01-07 CN claimed
US-7078310-B1 Method for fabricating a high density composite MIM capacitor with flexible routing in semiconductor dies NEWPORT FAB, LLC (US) 2006-07-18 US claimed
CN-1771603-A High density composite metal-insulator-metal capacitor with reduced voltage dependence in semiconductor chips NEWPORT FAB DBA JAZZ SEMICOND (US) 2006-05-10 CN claimed
US-7041569-B1 Method for fabricating a high density composite MIM capacitor with reduced voltage dependence in semiconductor dies NEWPORT FAB, LLC (US) 2006-05-09 US claimed
US-20060081948-A1 Transistors with multilayered dielectric films and methods of manufacturing such transistors SAMSUNG ELECTRONICS CO., LTD. (KR) 2006-04-20 US claimed
WO-2004095582-A1 A HIGH DENSITY MIM CAPACITOR WITH REDUCED VOLTAGE DEPENDENCE IN SEMICONDUCTOR DIES NEWPORT FAB, LLC DBA JAZZ SEMICONDUCTOR (US) 2004-11-04 WO claimed
US-6777777-B1 High density composite MIM capacitor with flexible routing in semiconductor dies NEWPORT FAB, LLC 2004-08-17 US claimed
US-6680521-B1 High density composite MIM capacitor with reduced voltage dependence in semiconductor dies NEWPORT FAB, LLC 2004-01-20 US claimed