SCHEMBL645096

SCHEMBL645096

C=CC(=O)OC(CC(=O)OCC)C(=O)O

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 9/20 0.38
HPGD P15428 1/20 0.37
MGAM O43451 1/20 0.36
GAA P10253 1/20 0.36
SI P14410 1/20 0.36
MGAM2 Q2M2H8 1/20 0.36
ALDH1A1 P00352 8/20 0.36
CYP3A4 P08684 3/20 0.36
ALOX15 P16050 2/20 0.36
HSD17B10 Q99714 2/20 0.36
CHRM1 P11229 1/20 0.36
ADORA1 P30542 1/20 0.36
HCAR2 Q8TDS4 1/20 0.35
TRPA1 O75762 1/20 0.34
TDP1 Q9NUW8 1/20 0.33
TP53 P04637 2/20 0.32
HIF1A Q16665 2/20 0.32
THRB P10828 1/20 0.32
NPSR1 Q6W5P4 1/20 0.31
CYP1A2 P05177 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11539269 0.88 ALDH1A1 (0.40) TSHRHPGDMGAMGAASI
SCHEMBL27829153 0.87 TSHR (0.42) TSHRHPGDALDH1A1CYP3A4HSD17B10
SCHEMBL21359690 0.84 L3MBTL1 (0.40) TSHRHPGDMGAMGAASI
SCHEMBL23174613 0.82 HCAR2 (0.38) TSHRHPGDMGAMGAASI
SCHEMBL27653408 0.81 CYP1A2 (0.41) TSHRHPGDMGAMGAASI
SCHEMBL27899022 0.79 TSHR (0.44) TSHRHPGDMGAMGAASI
SCHEMBL27826441 0.79 MGAM (0.41) TSHRMGAMGAASIMGAM2
SCHEMBL4643831 0.78 TSHR (0.41) TSHRHPGDALDH1A1CYP3A4HSD17B10
SCHEMBL301336 0.78 TSHR (0.36) TSHRHPGDALDH1A1CYP3A4HSD17B10
SCHEMBL645097 0.78 TSHR (0.39) TSHRHPGDALDH1A1CYP3A4HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 218 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115551958-B Inkjet ink for printed circuit boards 爱克发-格法特公司 2024-07-16 CN claimed
CN-115551958-A Inkjet inks for printed circuit boards 爱克发-格法特公司 2022-12-30 CN claimed
CN-111406080-A Hydrophobic block-random block copolymer emulsion polymer stabilizer 巴斯夫欧洲公司 2020-07-10 CN claimed
US-8399175-B2 Photopolymer resins for photo replication of information layers ADDISON CLEAR WAVE, LLC (US) 2013-03-19 US claimed
CN-1749856-B Curable jettable liquid for flexography AGFA GEVAERT 2011-10-19 CN claimed
CN-102174154-A Binder resin and ink composition for roll printing comprising the same LG CHEMICAL LTD 2011-09-07 CN claimed
US-20090252885-A1 Photopolymer Resins for Photo Replication of Information Layers ADDISON CLEAR WAVE, LLC (US) 2009-10-08 US claimed
EP-1992668-A1 Photopolymer resins for photo replication of information layers Addison Clear Wave LLC (US) 2008-11-19 EP claimed
CN-115551958-B Inkjet ink for printed circuit boards 爱克发-格法特公司 2024-07-16 CN disclosed
CN-111295738-B Method for manufacturing semiconductor device 琳得科株式会社 2024-05-24 CN disclosed
US-11964359-B2 Apparatus and method of forming a polishing article that has a desired zeta potential APPLIED MATERIALS, INC. (US) 2024-04-23 US disclosed
CN-111164129-B PEG-based ligands with enhanced dispersibility and improved properties 昭荣化学工业株式会社 2024-03-12 CN disclosed
CN-117321493-A Liquid crystal aligning agent, liquid crystal alignment film and liquid crystal element 日产化学株式会社 2023-12-29 CN disclosed
CN-113613893-B Pressure-sensitive adhesive sheet and method for manufacturing semiconductor device 琳得科株式会社 2023-11-21 CN disclosed
CN-1682149-A Liquid crystal sealing composition and method for manufacturing liquid crystal display panel using the same MITSUI CHEMICALS INC (JP) 2005-10-12 CN disclosed
CN-1622964-A Polyester KYOWA HAKKO KOGYO KK (JP) 2005-06-01 CN disclosed
US-20050038194-A1 Pseudo cross-link type resin composition, molding material, sheet or film, and optical element obtained therefrom YAMANAKA TETSURO (JP) 2005-02-17 US disclosed
US-6767967-B2 FLEXIBILITY; HYDROGEN BONDED BLEND HITACHI CHEMICAL CO., LTD. (JP) 2004-07-27 US disclosed
US-20030232923-A1 Pseudo cross-link type resin composition, molding material, sheet or film, and optical element obtained therefrom HITACHI CHEMICAL CO., LTD. (JP) 2003-12-18 US disclosed
CN-1351634-A Heat-resistant engineering plastic resin composition and molded article obtained therefrom SUMITOMO ELEC FINE POLYMER INC (JP) 2002-05-29 CN disclosed