Styrene

Styrene

SCHEMBL6455547

C=Cc1ccccc1.[H]

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Styrene SCHEMBL8100955 0.97 ALDH1A1 (1.00)
Styrene SCHEMBL140 0.97
Styrene SCHEMBL369036 0.97 ALDH1A1 (1.00)
Styrene SCHEMBL1226310 0.97 ALDH1A1 (1.00)
Styrene SCHEMBL10892600 0.97 ALDH1A1 (1.00)
Styrene SCHEMBL9776790 0.97 ALDH1A1 (1.00)
Styrene SCHEMBL4986035 0.97 ALDH1A1 (1.00)
Styrene SCHEMBL6258482 0.97 ALDH1A1 (1.00)
Styrene SCHEMBL11144289 0.97 ALDH1A1 (1.00)
Styrene SCHEMBL8465847 0.97 ALDH1A1 (1.00)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230323105-A1 THERMOSETTING RESIN COMPOSITION, CURED MATERIAL THEREOF AND PREPREG, LAMINATE PROVIDED WITH CURED MATERIAL OR CURED MATERIAL OF PREPREG, METAL CLAD LAMINATE, AND PRINTED CIRCUIT BOARD LG CHEM, LTD. (KR) 2023-10-12 US claimed
CN-109265848-A A kind of high glaze PS of resistance to edible oil alloy material and preparation method thereof 会通新材料股份有限公司 2019-01-25 CN claimed
EP-0144054-B1 COMPOSITE FILMS ADAPTED FOR SELECTIVE GAS SEPARATION MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 1990-05-30 EP claimed
US-20230323105-A1 THERMOSETTING RESIN COMPOSITION, CURED MATERIAL THEREOF AND PREPREG, LAMINATE PROVIDED WITH CURED MATERIAL OR CURED MATERIAL OF PREPREG, METAL CLAD LAMINATE, AND PRINTED CIRCUIT BOARD LG CHEM, LTD. (KR) 2023-10-12 US disclosed
CN-109796645-A Rubber composition for tire and the pneumatic tire for having used the composition 东洋橡胶工业株式会社 2019-05-24 CN disclosed
CN-106928621-A Woven hose TPE and preparation method thereof 苏州康邦新材料有限公司 2017-07-07 CN disclosed
CN-105086895-B Non-bituminous base Prespreading high polymer waterproof coil material PUR and preparation method thereof 惠州市能辉化工有限公司 2017-06-06 CN disclosed
CN-102786896-B Reaction type hot-fusible encapsulant composition used for solar batteries 横滨橡胶株式会社 2016-12-07 CN disclosed
EP-0984031-B1 MOLDING MATERIAL, INNER MATERIAL USING THE SAME, AND METHOD FOR PRODUCING THE SAME NAGOYA OILCHEMICAL (JP) 2005-12-28 EP disclosed
EP-1090973-B1 DISPERSION OF HOT-MELT ADHESIVE PARTICLES, HEAT-BONDABLE SHEET, INTERIOR MATERIAL, THERMOFORMABLE TEXTILE SHEET, AND CARPET NAGOYA OILCHEMICAL (JP) 2004-04-28 EP disclosed
EP-0636495-B2 IC card having image information KONISHIROKU PHOTO IND (JP) 2003-09-24 EP disclosed
US-6316088-B1 SUCH AS LIGHTLY CROSSLINKED SODIUM POLYACRYLATE NAGOYA OILCHEMICAL CO., LTD. (JP) 2001-11-13 US disclosed
CN-1314930-A Water-proof composition and its preparation method and application PCA HODGSON CHEMICALS PTY LTD (AU) 2001-09-26 CN disclosed
EP-1090973-A1 DISPERSION OF HOT-MELT ADHESIVE PARTICLES, HEAT-BONDABLE SHEET, INTERIOR MATERIAL, THERMOFORMABLE TEXTILE SHEET, AND CARPET Nagoya Oilchemical Co., Ltd. (JP) 2001-04-11 EP disclosed
EP-0984031-A1 MOLDING MATERIAL, INNER MATERIAL USING THE SAME, AND METHOD FOR PRODUCING THE SAME Nagoya Oilchemical Co., Ltd. (JP) 2000-03-08 EP disclosed
EP-0636495-B1 IC card having image information KONISHIROKU PHOTO IND (JP) 1997-10-15 EP disclosed
US-5534372-A IC card having image information KONICA CORPORATION (JP) 1996-07-09 US disclosed
EP-0636495-A2 IC card having image information KONICA CORPORATION (JP) 1995-02-01 EP disclosed