⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL646200 | 0.77 | — | — | |
| SCHEMBL4199698 | 0.73 | — | — | |
| SCHEMBL216672 | 0.71 | — | — | |
| SCHEMBL1405545 | 0.70 | — | — | |
| SCHEMBL247770 | 0.67 | — | — | |
| SCHEMBL645481 | 0.67 | — | — | |
| SCHEMBL9551529 | 0.64 | — | — | |
| SCHEMBL26667666 | 0.64 | — | — | |
| SCHEMBL26667653 | 0.64 | — | — | |
| SCHEMBL11144940 | 0.62 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 222 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1482070-B1 | MECHANICAL ENHANCER ADDITIVES FOR LOW DIELECTRIC FILMS | AIR PROD & CHEM (US) | 2015-11-11 | — | — | EP | claimed |
| US-20040241463-A1 | Mechanical enhancer additives for low dielectric films | VERSUM MATERIALS US, LLC | 2004-12-02 | — | — | US | claimed |
| EP-1482070-A1 | Mechanical enhancer additives for low dielectric films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2004-12-01 | — | — | EP | claimed |
| US-12346026-B2 | Composition for forming underlayer film, resist pattern forming method, and manufacturing method of electronic device | FUJIFILM CORPORATION (JP) | 2025-07-01 | — | — | US | disclosed |
| US-20220252985-A1 | COMPOSITION FOR FORMING UNDERLAYER FILM, RESIST PATTERN FORMING METHOD, AND MANUFACTURING METHOD OF ELECTRONIC DEVICE | FUJIFILM CORPORATION (JP) | 2022-08-11 | — | — | US | disclosed |
| WO-2021106537-A1 | RESIST UNDERLAYER FILM-FORMING COMPOSITION, PATTERN FORMING METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD | 富士フイルム株式会社 | 2021-06-03 | — | — | WO | disclosed |
| EP-1520891-B1 | FILM FORMING COMPOSITION, PROCESS FOR PRODUCING FILM FORMING COMPOSITION, INSULATING FILM FORMING MATERIAL, PROCESS FOR FORMING FILM, AND SILICA-BASED FILM | JSR CORP (JP) | 2019-05-01 | — | — | EP | disclosed |
| US-10234762-B2 | Pattern-forming method | JSR CORPORATION (JP) | 2019-03-19 | — | — | US | disclosed |
| US-10025188-B2 | Resist pattern-forming method | JSR CORPORATION (JP) | 2018-07-17 | — | — | US | disclosed |
| US-20170322492-A1 | RESIST PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2017-11-09 | — | — | US | disclosed |
| US-20170003592-A1 | PATTERN-FORMING METHOD | JSR CORPORATION (JP) | 2017-01-05 | — | — | US | disclosed |
| US-5633312-A | Process for preparing polyorganosilane | TOSHIBA SILICONE CO., LTD. (JP) | 1997-05-27 | — | — | US | disclosed |
| US-5489662-A | Process for the preparation of organosilicon polymer | TOSHIBA SILICONE CO., LTD. (JP) | 1996-02-06 | — | — | US | disclosed |
| EP-0669363-A2 | Process for preparing polyorganosilane | TOSHIBA SILICONE CO., LTD. (JP) | 1995-08-30 | — | — | EP | disclosed |
| EP-0641820-A1 | Process for the preparation of organosilicon polymer | TOSHIBA SILICONE CO., LTD. (JP) | 1995-03-08 | — | — | EP | disclosed |
| US-5250646-A | Reacting disilane with organometallic compound | WACKER-CHEMIE GMBH (DE) | 1993-10-05 | — | — | US | disclosed |
| US-5166287-A | Reaction of a disilane to form polysiloxanes | WACKER-CHEMIE GMBH (DE) | 1992-11-24 | — | — | US | disclosed |
| EP-0486946-A2 | Process for the production of metallopolysilanes and their use | Wacker-Chemie GmbH (DE) | 1992-05-27 | — | — | EP | disclosed |
| EP-0463624-A2 | Process for preparing organopolysilanes | WACKER-CHEMIE GMBH (DE) | 1992-01-02 | — | — | EP | disclosed |
| US-4395562-A | FROM ALKYL ALLENE AND A DISILANE IN PRESENCE OF PHOSPHINE COMPLEX OF A TRANSITION METAL | CHISSO CORPORATION (JP) | 1983-07-26 | — | — | US | disclosed |